JPH0419704B2 - - Google Patents
Info
- Publication number
- JPH0419704B2 JPH0419704B2 JP57000432A JP43282A JPH0419704B2 JP H0419704 B2 JPH0419704 B2 JP H0419704B2 JP 57000432 A JP57000432 A JP 57000432A JP 43282 A JP43282 A JP 43282A JP H0419704 B2 JPH0419704 B2 JP H0419704B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- photoresist
- layer
- opening
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP43282A JPS58118117A (ja) | 1982-01-06 | 1982-01-06 | パタン状厚膜の形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP43282A JPS58118117A (ja) | 1982-01-06 | 1982-01-06 | パタン状厚膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58118117A JPS58118117A (ja) | 1983-07-14 |
JPH0419704B2 true JPH0419704B2 (enrdf_load_stackoverflow) | 1992-03-31 |
Family
ID=11473647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP43282A Granted JPS58118117A (ja) | 1982-01-06 | 1982-01-06 | パタン状厚膜の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58118117A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6001302B2 (ja) * | 2012-04-06 | 2016-10-05 | Jx金属株式会社 | スポットめっき装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5623746A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
-
1982
- 1982-01-06 JP JP43282A patent/JPS58118117A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58118117A (ja) | 1983-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4597826A (en) | Method for forming patterns | |
JPS6323657B2 (enrdf_load_stackoverflow) | ||
US4413051A (en) | Method for providing high resolution, highly defined, thick film patterns | |
US6455227B1 (en) | Multilayer resist structure, and method of manufacturing three-dimensional microstructure with use thereof | |
US4278710A (en) | Apparatus and method for submicron pattern generation | |
US6797963B2 (en) | Deflector of a micro-column electron beam apparatus and method for fabricating the same | |
JPH0419704B2 (enrdf_load_stackoverflow) | ||
JPS6211068B2 (enrdf_load_stackoverflow) | ||
US7354699B2 (en) | Method for producing alignment mark | |
US3673018A (en) | Method of fabrication of photomasks | |
JPH0458167B2 (enrdf_load_stackoverflow) | ||
JPH04284620A (ja) | 半導体装置の製造方法 | |
US6686128B1 (en) | Method of fabricating patterned layers of material upon a substrate | |
JPH01128522A (ja) | レジストパターンの形成方法 | |
JPS63307739A (ja) | 半導体装置の製造方法 | |
JPS5857908B2 (ja) | 薄膜構造体の形成方法 | |
JPS59128540A (ja) | フオトマスク | |
JP2752022B2 (ja) | 微細パターン形成方法 | |
JPH01216525A (ja) | 半導体装置のパターン形成方法 | |
JP2000150419A (ja) | 金属膜の堆積方法、配線パターンの形成方法及び配線パターンの構造 | |
JPS62163340A (ja) | 半導体集積回路の配線形成法 | |
JPH01304457A (ja) | パターン形成方法 | |
JPS59103343A (ja) | 半導体装置の製造方法 | |
US20060105550A1 (en) | Method of depositing material on a substrate for a device | |
JPS6081830A (ja) | アルミニウム膜のテ−パ−エツチング方法 |