JPH0418408A - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物

Info

Publication number
JPH0418408A
JPH0418408A JP33525590A JP33525590A JPH0418408A JP H0418408 A JPH0418408 A JP H0418408A JP 33525590 A JP33525590 A JP 33525590A JP 33525590 A JP33525590 A JP 33525590A JP H0418408 A JPH0418408 A JP H0418408A
Authority
JP
Japan
Prior art keywords
maleimide
groups
group
formulas
phenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33525590A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0557284B2 (enrdf_load_stackoverflow
Inventor
Masayuki Oba
正幸 大場
Hikotada Tsuboi
坪井　彦忠
Nobushi Koga
信史 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP33525590A priority Critical patent/JPH0418408A/ja
Publication of JPH0418408A publication Critical patent/JPH0418408A/ja
Publication of JPH0557284B2 publication Critical patent/JPH0557284B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP33525590A 1990-11-30 1990-11-30 熱硬化性樹脂組成物 Granted JPH0418408A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33525590A JPH0418408A (ja) 1990-11-30 1990-11-30 熱硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33525590A JPH0418408A (ja) 1990-11-30 1990-11-30 熱硬化性樹脂組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1330182A Division JPS58132010A (ja) 1982-02-01 1982-02-01 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPH0418408A true JPH0418408A (ja) 1992-01-22
JPH0557284B2 JPH0557284B2 (enrdf_load_stackoverflow) 1993-08-23

Family

ID=18286478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33525590A Granted JPH0418408A (ja) 1990-11-30 1990-11-30 熱硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JPH0418408A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8166839B2 (en) 2004-08-07 2012-05-01 Johnson Controls Gmbh Seat adjuster

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8166839B2 (en) 2004-08-07 2012-05-01 Johnson Controls Gmbh Seat adjuster

Also Published As

Publication number Publication date
JPH0557284B2 (enrdf_load_stackoverflow) 1993-08-23

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