JPH0418026B2 - - Google Patents
Info
- Publication number
- JPH0418026B2 JPH0418026B2 JP59259675A JP25967584A JPH0418026B2 JP H0418026 B2 JPH0418026 B2 JP H0418026B2 JP 59259675 A JP59259675 A JP 59259675A JP 25967584 A JP25967584 A JP 25967584A JP H0418026 B2 JPH0418026 B2 JP H0418026B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- weight
- properties
- bonding
- elongation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59259675A JPS61136654A (ja) | 1984-12-08 | 1984-12-08 | アルミニウム極細線の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59259675A JPS61136654A (ja) | 1984-12-08 | 1984-12-08 | アルミニウム極細線の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61136654A JPS61136654A (ja) | 1986-06-24 |
| JPH0418026B2 true JPH0418026B2 (enExample) | 1992-03-26 |
Family
ID=17337338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59259675A Granted JPS61136654A (ja) | 1984-12-08 | 1984-12-08 | アルミニウム極細線の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136654A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014173097A (ja) * | 2013-03-06 | 2014-09-22 | Auto Network Gijutsu Kenkyusho:Kk | アルミニウム合金線、アルミニウム合金撚り線、絶縁電線、及びワイヤーハーネス |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS619536A (ja) * | 1984-06-21 | 1986-01-17 | Sumitomo Electric Ind Ltd | ボンディングワイヤ用アルミ合金細線の製造方法 |
| JPS61117258A (ja) * | 1984-11-13 | 1986-06-04 | Kobe Steel Ltd | ボンディング用アルミニウムワイヤ−の製造法 |
-
1984
- 1984-12-08 JP JP59259675A patent/JPS61136654A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61136654A (ja) | 1986-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4677505B1 (ja) | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 | |
| JPH0625388B2 (ja) | 高強度、高導電性銅基合金 | |
| JPH07145441A (ja) | 超塑性アルミニウム合金およびその製造方法 | |
| WO2015029986A1 (ja) | 銅合金板材およびその製造方法並びに通電部品 | |
| TWI429768B (zh) | Cu-Co-Si based copper alloy for electronic materials and method for producing the same | |
| JP5520533B2 (ja) | 銅合金材およびその製造方法 | |
| JP3367544B2 (ja) | ボンディング用金合金細線及びその製造方法 | |
| JP6730784B2 (ja) | 電子部品用Cu−Ni−Co−Si合金 | |
| JPH0418025B2 (enExample) | ||
| JPH0418026B2 (enExample) | ||
| JPS62104061A (ja) | 半導体素子用ボンデイング線およびその製造方法 | |
| JP2012229467A (ja) | 電子材料用Cu−Ni−Si系銅合金 | |
| JP5524901B2 (ja) | 電子材料用Cu−Ni−Si−Co系銅合金 | |
| JPH084100B2 (ja) | ボンディング線 | |
| JPS62170448A (ja) | アルミニウム極細線 | |
| JP2003059964A (ja) | ボンディングワイヤ及びその製造方法 | |
| JPS60238079A (ja) | アルミニウム極細線の製造方法 | |
| JP5311715B2 (ja) | 半導体素子接続用金線 | |
| JP3302840B2 (ja) | 伸び特性及び屈曲特性に優れた導電用高力銅合金、及びその製造方法 | |
| JPS63293146A (ja) | 導電用高力耐熱アルミニウム合金の製造方法 | |
| CN121023277B (zh) | 一种高金键合金丝及其生产工艺及应用 | |
| JPH0586427A (ja) | 導電用極細銅線 | |
| JP3333654B2 (ja) | 伸び特性及び屈曲特性に優れた導電用高力銅合金、及びその製造方法 | |
| JPH0480981B2 (enExample) | ||
| JPS61157664A (ja) | アルミニウム極細線の製造方法 |