JPH04170036A - Manufacture of anisotropic conductive film - Google Patents

Manufacture of anisotropic conductive film

Info

Publication number
JPH04170036A
JPH04170036A JP29755590A JP29755590A JPH04170036A JP H04170036 A JPH04170036 A JP H04170036A JP 29755590 A JP29755590 A JP 29755590A JP 29755590 A JP29755590 A JP 29755590A JP H04170036 A JPH04170036 A JP H04170036A
Authority
JP
Japan
Prior art keywords
holes
bump
electrode
base material
conductive members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29755590A
Other languages
Japanese (ja)
Inventor
Takeshi Kozuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP29755590A priority Critical patent/JPH04170036A/en
Publication of JPH04170036A publication Critical patent/JPH04170036A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE: To mount an LSI chip or other components on a circuit board, etc. with high reliability without any necessity of alignments by forming conductive members by electrodeposition so that the conductive members may fill through holes formed in electrodes for electrolysis while being formed in the shape of a bump on an insulated base material.
CONSTITUTION: On the surface of an insulated base material piece 1 in which minute through holes are formed, a mask pattern 3 is so formed that the specified through holes 2 may be masked. At the same, an opening 4 is also formed where the through holes 2 are exposed. Then, an electrode for electrolysis 5 is formed as to cover the opening 4. With the electrode 5 being a cathode, conductive members 6 are formed by electrodeposition so that they may fill the through holes 2 on the electrode 5 while being formed in the shape of a bump on the insulated base material 1. By this method, the conductive part 6 with a bump which is patterned into the specified shape can be formed only in necessary parts. Consequently, an LSI chip with recessed electrodes or other components can be mounted on a circuit board, etc., with high reliability without any necessity of alignments.
COPYRIGHT: (C)1992,JPO&Japio
JP29755590A 1990-11-01 1990-11-01 Manufacture of anisotropic conductive film Pending JPH04170036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29755590A JPH04170036A (en) 1990-11-01 1990-11-01 Manufacture of anisotropic conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29755590A JPH04170036A (en) 1990-11-01 1990-11-01 Manufacture of anisotropic conductive film

Publications (1)

Publication Number Publication Date
JPH04170036A true JPH04170036A (en) 1992-06-17

Family

ID=17848065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29755590A Pending JPH04170036A (en) 1990-11-01 1990-11-01 Manufacture of anisotropic conductive film

Country Status (1)

Country Link
JP (1) JPH04170036A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0798772A1 (en) * 1996-03-26 1997-10-01 Commissariat A L'energie Atomique Process for realizing a deposition on a detachable support, and realized deposition on a support
USRE37840E1 (en) * 1994-11-21 2002-09-17 International Business Machines Corporation Method of preparing a printed circuit board
DE102004061853A1 (en) * 2004-12-22 2006-03-02 Infineon Technologies Ag Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board
WO2009113486A1 (en) 2008-03-14 2009-09-17 富士フイルム株式会社 Probe guard

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE37840E1 (en) * 1994-11-21 2002-09-17 International Business Machines Corporation Method of preparing a printed circuit board
EP0798772A1 (en) * 1996-03-26 1997-10-01 Commissariat A L'energie Atomique Process for realizing a deposition on a detachable support, and realized deposition on a support
FR2746678A1 (en) * 1996-03-26 1997-10-03 Commissariat Energie Atomique METHOD FOR MAKING A DEPOSIT ON A REMOVABLE MEDIUM, AND DEPOSIT CARRIED OUT ON A MEDIUM
DE102004061853A1 (en) * 2004-12-22 2006-03-02 Infineon Technologies Ag Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board
WO2009113486A1 (en) 2008-03-14 2009-09-17 富士フイルム株式会社 Probe guard

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