JPH0416027B2 - - Google Patents

Info

Publication number
JPH0416027B2
JPH0416027B2 JP18130383A JP18130383A JPH0416027B2 JP H0416027 B2 JPH0416027 B2 JP H0416027B2 JP 18130383 A JP18130383 A JP 18130383A JP 18130383 A JP18130383 A JP 18130383A JP H0416027 B2 JPH0416027 B2 JP H0416027B2
Authority
JP
Japan
Prior art keywords
pattern
light emitting
base
emitting diode
mounting pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP18130383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6072281A (ja
Inventor
Toshihiko Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP58181303A priority Critical patent/JPS6072281A/ja
Publication of JPS6072281A publication Critical patent/JPS6072281A/ja
Publication of JPH0416027B2 publication Critical patent/JPH0416027B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Electronic Switches (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP58181303A 1983-09-28 1983-09-28 発光ダイオ−ド基板 Granted JPS6072281A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58181303A JPS6072281A (ja) 1983-09-28 1983-09-28 発光ダイオ−ド基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58181303A JPS6072281A (ja) 1983-09-28 1983-09-28 発光ダイオ−ド基板

Publications (2)

Publication Number Publication Date
JPS6072281A JPS6072281A (ja) 1985-04-24
JPH0416027B2 true JPH0416027B2 (enFirst) 1992-03-19

Family

ID=16098315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58181303A Granted JPS6072281A (ja) 1983-09-28 1983-09-28 発光ダイオ−ド基板

Country Status (1)

Country Link
JP (1) JPS6072281A (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0671796B2 (ja) * 1985-12-18 1994-09-14 三洋電機株式会社 光プリンタヘツド
JP3989794B2 (ja) * 2001-08-09 2007-10-10 松下電器産業株式会社 Ｌｅｄ照明装置およびｌｅｄ照明光源
AT501081B8 (de) * 2003-07-11 2007-02-15 Tridonic Optoelectronics Gmbh Led sowie led-lichtquelle
JP6083194B2 (ja) * 2012-11-06 2017-02-22 富士ゼロックス株式会社 面発光型半導体レーザアレイ装置、光源および光源モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置

Also Published As

Publication number Publication date
JPS6072281A (ja) 1985-04-24

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