JPH04155934A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPH04155934A JPH04155934A JP28250090A JP28250090A JPH04155934A JP H04155934 A JPH04155934 A JP H04155934A JP 28250090 A JP28250090 A JP 28250090A JP 28250090 A JP28250090 A JP 28250090A JP H04155934 A JPH04155934 A JP H04155934A
- Authority
- JP
- Japan
- Prior art keywords
- head
- lead frame
- chip
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000007246 mechanism Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造装置に関し、特に半導体チッ
プをリードフレームに固定する装置に間する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing semiconductor devices, and particularly to an apparatus for fixing a semiconductor chip to a lead frame.
従来、この種の半導体装置の製造装置は、第３図（ａ＞
、（ｂ）の側面図および正面図に示すような構造を有し
ている。即ち、引き伸ばされたシート８に接着された半
導体チップ３を供給するテーブル６と、リードフレーム
４を載せるリードフレーム台６と、ヘッド１及び半導体
チップセンサー５を有する装置本体２とから構成され、
突き上げ治具９で突き上げられた半導体チップ３を半導
体チップ吸着治具（以下ヘッド１と称す）で吸着し、リ
ードフレーム４上へ移動してリードフレーム４に半導体
チップ３を加圧、固定（以下この動作をマウントと称す
）させる動作を行なうようになっている。Conventionally, this type of semiconductor device manufacturing apparatus is shown in FIG. 3 (a>
, has a structure as shown in the side and front views of (b). That is, it is composed of a table 6 for supplying semiconductor chips 3 bonded to a stretched sheet 8, a lead frame stand 6 on which a lead frame 4 is placed, and an apparatus main body 2 having a head 1 and a semiconductor chip sensor 5.
The semiconductor chip 3 pushed up by the push-up jig 9 is adsorbed by a semiconductor chip adsorption jig (hereinafter referred to as head 1), moved onto the lead frame 4, and the semiconductor chip 3 is pressurized and fixed to the lead frame 4 (hereinafter referred to as head 1). This operation is called mounting.
上述した従来の半導体装置の製造装置は、半導体チップ
を吸着しリードフレームヘマウントする動作を提供する
ヘッドを含む機構が単体となっているため、１回のマウ
ント動作を終了させてから次のマウント動作を実行する
のに時間を要し、装置当りの作業能力が低いという欠点
を有する。The conventional semiconductor device manufacturing equipment described above has a single mechanism including a head that suctions the semiconductor chip and mounts it onto the lead frame, so it is necessary to complete one mounting operation before starting the next mounting operation. It has the disadvantage that it takes time to perform the operation and the working capacity per device is low.
本発明の半導体装置の製造装置は、半導体チップを吸着
しリードフレームにマウントする動作を行なうヘッドを
複数有し、−ヘッドの動作中に次のヘッドの動作を開始
する機構を備えている。The semiconductor device manufacturing apparatus of the present invention has a plurality of heads that perform an operation of sucking a semiconductor chip and mounting it on a lead frame, and is provided with a mechanism that starts the operation of the next head while one head is in operation.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の実施例１の側面図およ
び正面図である。FIGS. 1(a) and 1(b) are a side view and a front view of Embodiment 1 of the present invention.
この実施例の基本動作について説明する。始めに、テー
ブル６上に半導体チップ３をシート８に装着させた状態
で供給する。又、リードフレーム４もリードフレーム台
７上に供給する１次に、テーブル６をＸ−Ｙ方向に移動
させ、半導体チップセンサー５により半導体チップ３を
認識し、ヘッド１ａの吸着部を半導体チップ３上にくる
ように位置決めする。The basic operation of this embodiment will be explained. First, the semiconductor chips 3 mounted on the sheet 8 are supplied onto the table 6. Further, the lead frame 4 is also supplied onto the lead frame stand 7. Next, the table 6 is moved in the X-Y direction, the semiconductor chip 3 is recognized by the semiconductor chip sensor 5, and the suction part of the head 1a is placed on the semiconductor chip 3. Position it so that it is on top.
次にヘッド１ａを降下させ、同時に突き上げ治具９ａに
より突き上げられた半導体チップ３を吸着し、再び上昇
させる０次に、ヘッドｌａの吸着部をリードフレーム４
の上部に移動し、ヘッド１ａの吸着部を降下させ、リー
ドフレーム４上に半導体チ・ｙプ３をマウントする。そ
の後、ヘッド１ａは元の位置に移動し、同様の動作を再
び開始する。一方、ヘッド１ｂは、ヘッド１ａが突き上
げ治具９ａにより突き上げられた半導体チップ３を吸着
後回様の動作を開始し、両ヘッドによりこの動作をシー
ト８上の半導体チップ３が全てリードフレーム上にマウ
ントされるまで繰り返す。Next, the head 1a is lowered, and at the same time it adsorbs the semiconductor chip 3 pushed up by the push-up jig 9a, and is raised again.
, lower the suction part of the head 1a, and mount the semiconductor chip 3 on the lead frame 4. Thereafter, the head 1a moves to its original position and starts the same operation again. On the other hand, the head 1b starts a similar operation after the head 1a adsorbs the semiconductor chip 3 pushed up by the push-up jig 9a, and both heads perform this operation until all the semiconductor chips 3 on the sheet 8 are placed on the lead frame. Repeat until mounted.
第２図（ａ）、（ｂ）は本発明の実施例２の側面図およ
び正面図である。FIGS. 2(a) and 2(b) are a side view and a front view of Embodiment 2 of the present invention.
次にこの実施例の基本動作について説明する。Next, the basic operation of this embodiment will be explained.
始めに、テーブル６上に半導体チップ３をシート８に装
着した状態で供給する。リードフレーム４もリードフレ
ーム台７上に供給する０次に半導体チップセンサー５ａ
を移動させることにより、図（ｂ）の向って左側より半
導体チップ３を認識する０次に、ヘッド１ａの吸着部を
半導体チップセンサー５ａで認識した半導体チップ３上
に移動し、ヘッド１ａの吸着部を降下させると同時に突
き上げ治具９ａによって突き上げられた半導体チップ３
を吸着する。First, the semiconductor chip 3 mounted on the sheet 8 is supplied onto the table 6. The lead frame 4 is also supplied with the zero-order semiconductor chip sensor 5a on the lead frame stand 7.
Then, the suction part of the head 1a is moved over the semiconductor chip 3 recognized by the semiconductor chip sensor 5a, and the suction part of the head 1a is The semiconductor chip 3 is pushed up by the pushing up jig 9a at the same time as the part is lowered.
adsorbs.
吸着後、ヘッド１ａの吸着部を上昇させ、リードフレー
ム４上部に移動する０次に、ヘッド１ａの吸着部を降下
させ、半導体チップ３をリードフレーム４上にマウント
する。マウント後、ヘッド１ａの吸着部を元の位置に移
動し、同様の動作を再び開始する。一方、ヘッド１ｂは
、半導体チップセンサー５ａと突き上げ治具９ｂの組み
合せにより、同様の動作を図（ｂ）の向って右側より行
なう、以後、この動作をシート８上の半導体チップ３が
全てマウントされるまで、ヘッド１ａ、ヘッド１ｂ共に
それぞれ別々に同じタイミングで繰り返す。After suction, the suction part of the head 1a is raised and moved to the top of the lead frame 4.The suction part of the head 1a is then lowered to mount the semiconductor chip 3 on the lead frame 4. After mounting, the suction part of the head 1a is moved to its original position and the same operation is started again. On the other hand, the head 1b performs a similar operation from the right side in FIG. The process is repeated separately at the same timing for both heads 1a and 1b until the process is completed.
以上説明したように本発明は、半導体チップを吸着しリ
ードフレームヘマウントする動作を提供する機構を複数
有することにより、装置の作業能力を向上させる効果が
ある。As described above, the present invention has the effect of improving the working ability of the device by having a plurality of mechanisms that provide the operation of sucking a semiconductor chip and mounting it on a lead frame.
第１図（ａ）、（ｂ）は本発明の実施例１の側面図およ
び正面図、第２図（ａ）、（ｂ）は本発明の実施例２の
側面図および正面図、第３図（ａ）、（ｂ）は従来の製
造装置の側面図および正面図である。
１、ｌａ、ｌｂ・・・ヘッド、２・・・装置本体、３・
・・半導体チップ、４・・・リードフレーム、５．５ａ
。
５ｂ・・・半導体チップセンサー、６・・・テーブル、
７・・・リードフレーム台、８・・・シート、９．９ａ
。
９ｂ・・・突き上げ治具。FIGS. 1(a) and (b) are a side view and a front view of Embodiment 1 of the present invention, FIGS. 2(a) and (b) are a side view and a front view of Embodiment 2 of the present invention, and FIG. Figures (a) and (b) are a side view and a front view of a conventional manufacturing device. 1, la, lb...head, 2...device body, 3.
...Semiconductor chip, 4...Lead frame, 5.5a
. 5b...Semiconductor chip sensor, 6...Table,
7... Lead frame stand, 8... Sheet, 9.9a
. 9b... Push-up jig.
Claims (1)
の製造装置において、半導体チップを吸着しリードフレ
ームに固定する動作を行なうヘッドを複数有し、一ヘッ
ドの動作中に次のヘッドの動作を開始することを特徴と
する半導体装置の製造装置。A semiconductor device manufacturing apparatus that fixes a semiconductor chip to a lead frame has a plurality of heads that perform the operation of attracting the semiconductor chip and fixing it to the lead frame, and it is possible to start the operation of the next head while one head is operating. Features: Semiconductor device manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28250090A JPH04155934A (en) | 1990-10-19 | 1990-10-19 | Production of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28250090A JPH04155934A (en) | 1990-10-19 | 1990-10-19 | Production of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04155934A true JPH04155934A (en) | 1992-05-28 |
Family
ID=17653250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28250090A Pending JPH04155934A (en) | 1990-10-19 | 1990-10-19 | Production of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04155934A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188194A (en) * | 2001-12-18 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
-
1990
- 1990-10-19 JP JP28250090A patent/JPH04155934A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188194A (en) * | 2001-12-18 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
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