JPH0414930Y2 - - Google Patents
Info
- Publication number
- JPH0414930Y2 JPH0414930Y2 JP5763886U JP5763886U JPH0414930Y2 JP H0414930 Y2 JPH0414930 Y2 JP H0414930Y2 JP 5763886 U JP5763886 U JP 5763886U JP 5763886 U JP5763886 U JP 5763886U JP H0414930 Y2 JPH0414930 Y2 JP H0414930Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- etch
- package
- semiconductor package
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000005530 etching Methods 0.000 claims description 16
- 239000007921 spray Substances 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 22
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5763886U JPH0414930Y2 (enrdf_load_stackoverflow) | 1986-04-18 | 1986-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5763886U JPH0414930Y2 (enrdf_load_stackoverflow) | 1986-04-18 | 1986-04-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62170630U JPS62170630U (enrdf_load_stackoverflow) | 1987-10-29 |
| JPH0414930Y2 true JPH0414930Y2 (enrdf_load_stackoverflow) | 1992-04-03 |
Family
ID=30887531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5763886U Expired JPH0414930Y2 (enrdf_load_stackoverflow) | 1986-04-18 | 1986-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414930Y2 (enrdf_load_stackoverflow) |
-
1986
- 1986-04-18 JP JP5763886U patent/JPH0414930Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62170630U (enrdf_load_stackoverflow) | 1987-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02130922A (ja) | 半導体基板エッチング装置 | |
| JPS63185029A (ja) | ウエハ処理装置 | |
| JP2001104861A (ja) | 液処理装置及びその方法 | |
| JPH0414930Y2 (enrdf_load_stackoverflow) | ||
| JPS6448171U (enrdf_load_stackoverflow) | ||
| CN213612183U (zh) | 一种含顶盖激光雷达外表面加硬处理装置 | |
| JPH0416430Y2 (enrdf_load_stackoverflow) | ||
| JPH0416428Y2 (enrdf_load_stackoverflow) | ||
| JP5520991B2 (ja) | 基板の処理装置及び処理方法 | |
| JPH043624Y2 (enrdf_load_stackoverflow) | ||
| JPH02192717A (ja) | レジスト除去装置 | |
| CN215462114U (zh) | 一种防止料液溢出的精馏回流比控制装置 | |
| JPS5952563A (ja) | コ−テイング装置 | |
| JPS63137427A (ja) | 半導体製造装置 | |
| CN210875252U (zh) | 一种用于半导体晶片加工的化蜡装置 | |
| CN211829010U (zh) | 一种圆柱锂电池注液夹具 | |
| CN215494540U (zh) | 一种用于均匀涂覆光刻胶的装置 | |
| JP2004063584A (ja) | スピン処理装置及びスピン処理方法 | |
| JPH0458182B2 (enrdf_load_stackoverflow) | ||
| NO752141L (enrdf_load_stackoverflow) | ||
| JPS6395626A (ja) | レジストの塗布装置 | |
| JP4076110B2 (ja) | 複合半導体装置の製造方法 | |
| JP3740396B2 (ja) | 膜形成方法 | |
| JPS6040601Y2 (ja) | 耐酸化被膜生成装置 | |
| JPH04118176U (ja) | スピンコーター装置 |