JPH04148520A - Manufacturing apparatus of wire for magnetic-head winding use - Google Patents

Abstract

PURPOSE:To accurately bond a wire to a leading-in wire without leaving a whisker by a method wherein, after the wire has been cut to a prescribed length, both wire ends of the leading-in wire are piled up and bonded to both cut end parts of it. CONSTITUTION:A wire W which has been extracted from a bobbin is gripped by hands 21, 20 of a gripping and holding means 17 at the lower part of an index stand 16. A cutter 28 is slid and cuts the wire. The hand 21 is slid up to a position which is symmetric with respect to the hand 20; both cut end parts of the wire are separated in a prescribed length. The index stand 16 is turned; a holding stand 24 of a holding means 18 for a leading-in wire P is slid up to the wire together with a wire weight 25; at the same time, hands 33, 34 of a leading-in wire feed means 29 grip the leading-in wire P at a prescribed length; a guide stand 35 is slid. The leading-in wire is released; it is attracted by a magnet at the lower part of a groove in a holding stand 24; both wire ends of the leading-in wire are piled up on cut end parts of the wire held by using a gripping and holding means 17 and are held by the wire weight 25. One pair of nozzles 38, 39 discharge an adhesive in a drop shape; while they are being slid up to cut tips of the wire, piled-up parts are coated.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for manufacturing wire for winding a magnetic head.

(Prior Art) A magnetic head used in a computer magnetic recording device or a video tape recorder has a head core fixed to a head base, a coil wound around the head core, and both ends of the coil wire connected to a printed wiring board on the head base. It has a soldered structure. The head core is made by welding two blocks together, and the coil is made by passing a wire through the winding hole formed between the blocks, winding it around one of the blocks, then passing the wire through the winding hole again, and then winding the wire through the winding hole formed between the blocks. It is formed by wrapping it around the other.

One of the problems with the winding of such a magnetic head is that the head core is curved and small, and the wire is extremely thin with a wire diameter of 0.015 to 0.050 mm and easily bends. When the wire is passed through the hole, a means for always keeping the tip of the wire straight and a means for precisely aligning the wire with the winding hole are required, making the structure complicated.

For this reason, a winding device is provided in which a lead-in wire that is more rigid than the wire is connected to the tip of the wire prior to winding, and the lead-in wire is passed through the winding hole before the wire is wound.
For example, see Japanese Patent Application Laid-Open No. 60-170009, etc.), this winding device can reliably pass an extremely thin and easily bendable wire through the winding hole even if the wire and the winding hole do not match precisely. can. Furthermore, in this winding device, the lead-in wire is made of a magnetic material such as steel wire (piano wire, etc.), and the lead-in wire is moved while being absorbed by a magnet, so that the wire can be passed through the winding hole. Since the wire is wound around the head core, it is a winding system! can be configured extremely simply.

By the way, in this case, it is necessary to connect the lead-in wire to each wire to be wound, but this is done manually by connecting the lead-in wire to an extremely thin wire with a wire diameter of 0.015 to 0.050 mm. Therefore, it takes time to connect, and the yield is low. Even if winding can be done efficiently, preparation requires considerable effort.

Therefore, the present applicant has provided a means for conveying the wire intermittently, a means for supplying the lead-in wire onto the wire, and a means for applying adhesive to the overlapping portions of the lead-in wire and the wire at both ends of the lead-in wire. A manufacturing apparatus has been proposed which is equipped with a means for removing a portion of the wire that is not coated with adhesive in the middle of the lead-in wire, and is capable of automatically manufacturing a wire used for winding a magnetic head.

The wire thus produced is wound onto a reel as it is, mounted on a reel-by-reel winding device, and wound around a herad core while being pulled out from the reel. Alternatively, the wire is cut into the length required for winding in advance, and the wire is wound around the head core by supplying the wire one by one to the winding device (Japanese Patent Laid-Open No. 63
(Refer to Publication No.-155008).

(Problem to be Solved by the Invention) However, in this manufacturing device, after the wire is bonded to both ends of the lead-in wire with an adhesive, the unnecessary wire in the middle part of the lead-in wire is removed. However, this makes it difficult to remove the unnecessary wire in the middle of the lead-in wire without leaving any traces. Since the wire and lead-in wire are extremely thin, and the lead-in wire overlaps the wire, this manufacturing equipment removes the wire in the middle of the lead-in wire by pulling and cutting it using friction. It tends to remain. If there are such whiskers, the whiskers will hit the lead-in wire when passing it through the winding hole of the head core, making it difficult to wind the wire, or the wire may come off from the lead-in wire.

SUMMARY OF THE INVENTION An object of the present invention is to provide a magnetic head winding wire manufacturing apparatus that solves these problems.

(Means for Solving the Problems) The present invention includes a clamping means for grasping a wire for winding a magnetic head with a pair of hands, a cutter for cutting the wire between the two hands, and a cutter for cutting the wire after cutting. a drive means for sliding the hand so that both cut ends are separated by a predetermined length in the wire direction; a lead-in wire supply means for supplying a lead-in wire of a predetermined length between both hands; The lead-in wire holding means holds both cut ends so as to overlap with each other, and the adhesive application means applies adhesive to these overlapping parts.

(Function) Therefore, after cutting the wire, the drawing ends of the lead-in line are overlapped and bonded to both cut ends, so there is no wire in the middle of the lead-in line, and the wire removal process is unnecessary. .

(Example) Figures 1I2I and 2 show examples of the present invention.
0 is a bobbin on the supply side wound with a predetermined wire W, 11 is a conveying means for sending the wire W from the bobbin 10 to each process, 1
2 is a reel for winding up the processed wire W from the conveyance means 11, and 13 is a bobbin on the supply side of the lead-in wire (piano wire) P.

The wire W from the bobbin 10 is fed out to the conveying means 11 side via the tension mechanism 14 and the guide roller 15,
A predetermined tension is applied to the wire W by the tension mechanism 14.

The conveyance means 11 is composed of an index stand 16 made of a substantially square base frame with four planar corners, and a drive section (not shown) that rotates the index stand 16 intermittently. 90" in the direction of the arrow in the figure
It is possible to rotate and stop each time.

The index stand 16 has clamping means 17 for holding the wires W at equal positions on all four sides (on the sides), and lead-in wires P.
A holding means 18 and a cutter abutment 19 are provided.

The clamping means 17 includes a pair of hands 20. which grip the wire W.
21, one hand 20 is fixed in position near the surface-shaped portion 22 of the index stand 16, and the other hand 21 is moved from a position close to the hand 20 (initial position) via a guide 23. Symmetrical position! (a position near the surface-shaped portion 22 on the opposite side). The hands 20 and 21 each have a known configuration in which two members open and close to hold the wire W therebetween. The opening and closing of the hands 20 and 21 and the sliding of the hand 21 are performed using an air cylinder or the like (not shown).
carried out by

The holding means 18 for the lead-in wire P is composed of a holding base 24 provided with a groove for determining the position of the lead-in wire P, and a wire presser 25 that presses the lead-in wire P on the groove from above. It is possible to slide from the inside of the index stand 16 via the guide 26 onto the wire W line held by both hands 20, 21 of the holding means 17. A magnet for attracting the lead-in wire P is provided at the lower part of the groove of the holding base 24. The wire presser foot 25 is made of a lever member, and its driving and the sliding of the holding table 24 are performed by an air cylinder or the like (not shown). Note that the holding base 24 is formed to have a predetermined width smaller than the distance between the cut ends of the wire W, which will be described later.

The cutter rest 19 receives a cutter, which will be described later, when cutting the wire W, and is disposed between the hand 20 in the fixed position of the clamping means 17 and the hand 21 in the initial position, and guide 27 (not shown)
Both hands 20.2 are inserted from the inside of the index stand 16 through the
It is possible to slide to the position where the wire W is held between the wires 1 and 1.

In addition, there are only three holding means 18 for the lead-in line P in FIG.
Only one cutter stop 19 is shown.

Around the index stand 16, there is a cutter 28 for cutting the wire W, a lead-in wire supply means 29 for supplying the lead-in wire P, an adhesive application means 30, and an adhesive drying means 3.
1 is arranged.

The cutter 28 is arranged below the index stand 16 at a position facing the cutter rest 19.

The cutter 28 can be slid from below to a predetermined position via a guide 32 by an air cylinder or the like (not shown), and can move the wire W held between both hands 20 and 21 of the holding means 17 to the wire W position 1. The cutter is pressed against the slid cutter stopper 19 to cut.

The lead-in wire supply means 29 includes a guide stand 35 which has a pair of hands 33 and 34 that grip the lead-in wire P supplied from the bobbin 13 on the side of the index stand 16 (on the right side in the figure), and a guide base 35 that holds the lead-in wire P supplied from the bobbin 13. A canter 36 for cutting to length is arranged. The hands 33 and 34 each have a known configuration in which two members open and close to hold the lead-in wire P between them. The cutter 36 has a known configuration that cuts the lead-in wire P by opening and closing two blades. The guide stand 35 is slidable from a position where it grips the lead-in line P to a predetermined position on the index stand 16 via a guide 37. The hand 33 is placed on the wire W held by the hands 20 and 21.
．． 34 is opened, and the lead-in wire P is passed through the groove of the holding base 24 of the holding means 18 at the corresponding position. In this case, the lead-in wire P is attracted by the magnet at the bottom of the groove of the holding base 24. Hand 33.3
4, driving of the cutter 36, and sliding of the guide table 35 are performed by an air cylinder or the like (not shown).

The adhesive application means 30 includes a pair of nozzles (dispenser nozzles) 38 and 39 disposed above the index stand 16 for discharging adhesive sent from an adhesive tank (not shown). The nozzles 38 and 39 are inserted into the holding table 2 of the holding means 18 from a predetermined position above the indexing table 16, respectively.
It is possible to slide inward by a predetermined length along the lead-in line P near both ends of the lead-in line P held in the groove No. A predetermined small amount of adhesive is ejected in droplets from the tip of the nozzle.

The nozzles 38, 39 are slid by air cylinders or the like (not shown). Note that although an ultraviolet curing adhesive is used as the adhesive, an instant adhesive can also be used.

The adhesive drying means 31 is located on the side of the index stand 16 (
A pair of lamps 40, 41 are arranged on the flower side). A reflector plate 42 that also serves as a heat shield is installed behind the lamps 40 and 41.

Next, the operation and effect will be explained.

This apparatus performs the first to fourth steps on the four sides of the index table 16 of the conveying means 11. The wire W from the bobbin 10 on the supply side completes each process on the index table 16, and then is wound on the roll 12 on the winding side.

First, the wire W pulled out from the bobbin 11 via the tension mechanism 14 and the guide roller 15 is grabbed by the clamping means 17 at the lower part of the index stand 16 that performs the first step.
The holding means 17 is arranged such that the hand 20 near the surface-shaped portion 22 of the index stand 16 is in a fixed position, and the hand 21 is in a fixed position.
Grip the wire W at the initial position close to.

When the wire W is grabbed, the cutter rest 19 slides from the inside of the index stand 16 to the wire W position, and at the same time, the cutter 28 slides below the index stand 16 and cuts the wire between the hands 20 and 21. Pressing W against the cutter pad 19 cuts it.

After cutting the wire W, the cutter 28 and the cutter rest 19 return to their original positions, and the hand 21 slides to the symmetrical position of the hand 20. By sliding the hand 21, both cut ends of the wire W are separated by a predetermined length in the wire W direction. Further, the wire W corresponding to the slide of the hand 21 is pulled back by the tension mechanism 14 on the bobbin 10 side.

When the first step is completed, the index stand 16 is rotated at 90°.
The wire W, which is rotated in the direction of the arrow in the figure and whose cut ends are separated by a predetermined length, is moved to the right side of the index stand 16 where the second step is performed while being held by both hands 20 and 21.

When entering the second step, the holding base 24 of the holding means 18 for the lead-in wire P slides together with the wire presser foot 25 from the inside of the index stage 16 to above the wire W line, and at the same time, the pair of hands 33 and 34 of the lead-in wire supply means 29 slide. The guide table 35 slides toward the index table 16 while holding the lead-in line P of a predetermined length.

When the guide stand 35 slides to a predetermined position, both hands 3
3.34 is opened, and the lead-in wire P is attracted by the magnet at the bottom of the groove of the holding base 24.

As a result, the lead-in wire P is placed on the groove of the holding table 24,
In this state, both ends of the lead-in wire P are held by the hand 2 of the clamping means 17.
They respectively overlap the cut ends of the wire W held at 0.21 mm. This overlap part should be about 10mm,
After this standing, the lead-in wire P on the groove is clamped and firmly held by driving the wire presser 25. Also, information desk 3
5 returns to its original position.

In the lead-in wire supply means 29, when the index stand 16 is rotated, the hands 33, 34 grasp the lead-in wire P supplied from the bobbin 13, and the cutter 36 cuts the lead-in wire P immediately after that.

When the second step is completed, the index stand 16 further rotates 90 degrees in the direction of the arrow in the figure, and the hand 20 of the clamping means 17
．． The third step is performed while the wire W held by the wire W held by the wire W and the lead-in wire P held on the groove of the holding table 24 are kept in a state in which the drawing end of the lead-in line P overlaps both cut ends of the wire W. Move to the top of the index stand 16.

When entering the third step, the pair of nozzles 38 and 39 of the adhesive application means 30 descend from the position above the index table 16 to near both ends of the lead-in line P, and at this time, a predetermined amount of adhesive is applied from the tip of each nozzle. The adhesive is discharged in droplets, and both ends of the lead-in line P and the wires W at both ends of the lead-in line P are wrapped in the drops of adhesive.

Then, the nozzles 38 and 39 slide inward along the lead-in line P, that is, along the overlapping area between both ends of the lead-in line P and both cut ends of the wire W, until they reach both cut ends of the wire W. When it comes, it rises and returns to its original position.

Thereby, both ends of the lead-in wire P and both cut ends of the wire W are reliably bonded with the adhesive. That is, nozzle 38.
39, apply drop-shaped adhesive from both ends of the lead-in line P, and then slide the nozzle 38 and 39 to the cutting tip of the wire W to apply the overlapping area, so the wire W is introduced by the surface tension of the drop. It overlaps perfectly with line P,
As in the 30th example, the adhesion is completely performed in a parallel state.

In this case, even if the wire W is somewhat warped, the wire W will come into close contact with the lead-in line P due to the surface tension of the drop as the nozzle 38, 39 slides, so that the adhesion will be complete, and the wire W will be completely bonded. The cutting tip side is never exposed.

Note that the wire W is connected to the lead-in line P inside both nozzles 38 and 39.
A wire guide may be attached to the wire guide to press the wire W against the lead-in line P when applying the adhesive.The pressing surface is made of resin or the like on the side of the nozzle It is provided so as to press down the wire W from above as it descends. However, in this case, the wire W is placed above the lead-in line P! As such, the hands 20 and 21 of the clamping means 17! Alternatively, the groove position of the holding base 24 that holds the lead-in wire P is set.

When the third step is completed, the index stand 16 further rotates 90 degrees in the direction of the arrow in the figure, moves to the left side of the index stand 16, and performs the fourth step. From the second step to the fourth step, Since the lead-in wire P on the groove of the holding stand 24 is firmly held by the wire presser foot 25, the lead-in wire P will not fall or shift its position due to rotation of the index stand 16.

In the fourth step, the lamp 40 of the adhesive drying means 31.
41 is irradiated onto the bonded portion between the wire W and the lead-in wire P, the bonded portion is dried and cured, and the bonding is completed.

When the fourth step is completed, the presser foot 25 of the holding means 18 and the hands 20, 21 of the clamping means 17 are opened, the index stand 16 is further rotated by 90 degrees in the direction of the arrow in the figure, and the holding means 18 is The gripping means 17 returns the hand 21 to its original position within the stand 16. As a result, the wire W after joining the lead-in wire P is separated from the index stand 16 and enters the first step.

Each of these steps is performed in parallel, and the wire W after joining the introduction wire P is sequentially sent to the reel 12 on the winding side.
It is wound up.

The wire wound on the reel 12 is attached to the winding device for each reel, and the wire is pulled out from the reel, or it is cut to the length required for winding in advance, and then the wire is wound one by one. Used by supplying.

In this way, the wire for winding the helad core of the magnetic head is manufactured. According to this device, the overlapping portion of the wire W and the lead-in wire P is accurately bonded, so that no whiskers of the wire W remain. There are no problems such as adhesive peeling, and therefore, using the wire manufactured with this device, it is possible to wind the helad core of the magnetic head stably and accurately, greatly improving the efficiency of winding. be able to.

In addition, according to this device, after cutting the wire W, both ends of the lead-in wire P are overlapped and bonded to both cut ends of the wire W, so there is no unnecessary wire in the middle of the lead-in wire P, and The process of removing the intermediate wire becomes unnecessary. This eliminates the need for difficult post-processes that tend to leave hairs when removing the wire.
Workability and processing efficiency can be significantly improved.

Further, during manufacturing, the wire W is always held by both hands 20, 21 of the clamping means 17 and sent to the next process by the rotation of the index stand 16, so that no unreasonable tension is applied to the wire W. The wire W does not stretch, so that high reliability as a winding wire can be ensured and a high quality magnetic head can be obtained.

Although one wire manufacturing line is shown in the embodiment, a plurality of indexing tables 16 are coaxially arranged on the conveying means 11, and a cutter 28 for the wire W, a supply means 29 for the lead-in wire P, and an adhesive are arranged accordingly. It is also possible to configure a plurality of lines by disposing coating means 30 and drying means 31.6 In addition, in the embodiment, the conveying means 11 is constituted by an indexing table 16 that rotates intermittently. The wire W is placed on a conveyor that is driven intermittently without using the index table 16.
A straight line may be constructed by arranging the holding means 17 for the lead-in line P and the holding means 18 for the lead-in line P, and arranging the other means at intermittent stop positions.

(Effects of the Invention) As described above, the manufacturing apparatus of the present invention includes a clamping means for grasping the winding wire of a magnetic head between a pair of hands, a cutter for cutting the wire between the two hands, and a cutting device for cutting the wire between the two hands. a driving means for sliding a hand so as to separate both cut ends of the rear wire by a predetermined distance in the wire direction; a lead-in wire supply means for supplying a lead-in wire of a predetermined length between both hands; Since the lead-in wire is provided with a lead-in wire holding means for holding the end so that it overlaps both cut ends of the wire and an adhesive application means for applying adhesive to these overlapping parts, the lead-in wire can be accurately joined to the wire without leaving any traces. In addition to improving processability, it is also possible to supply the optimum wire for winding the magnetic head, making it possible to wind the magnetic head well and efficiently. Efficiency can be greatly improved.

[Brief explanation of the drawing]

FIG. 1 is an overall layout diagram showing an embodiment of the present invention, FIG. 2 is a configuration diagram of main parts, and FIG. 3 is a side view showing a bonded state. 11... Conveying means, 16... Index stand, 17...
... Holding means, 18... Holding means, 19... Cutter abutment, 20.21... Hand, 24... Holding stand, 2
5... Line presser, 28... Cutter, 29... Leading wire supply means, 30... Coating means, 31... Drying means, 33.3
4. Hand, 38.39... Nozzle, 40.41...
・Lamp patent applicant Nittoku Development Center Co., Ltd. Figure

Claims (1)

[Claims] 1. A clamping means for grasping a wire for winding a magnetic head with a pair of hands, a cutter for cutting the wire between the two hands, and a cutter for cutting the wire between the two hands, and cutting both cut ends of the wire after cutting. a driving means for sliding the hands so as to separate them by a predetermined length in the wire direction; a lead-in wire supply means for supplying a lead-in wire of a predetermined length between both hands; A manufacturing device for a magnetic head winding wire, comprising a lead-in wire holding means for holding the lead-in wire so as to overlap with each other, and an adhesive applying means for applying an adhesive to the overlapping portion thereof. 2. A plurality of sets of clamping means and lead-in wire holding means are arranged in series at predetermined intervals, and a conveyance means is provided for intermittently moving the sets, and a wire cutter, lead-in wire supply means, and adhesive application means are sequentially placed at intermittent stopping positions. 2. The apparatus for manufacturing a magnetic head winding wire according to claim 1, further comprising: a wire for winding a magnetic head; 3. The apparatus for producing magnetic head winding wire according to claim 2, wherein the conveying means comprises an index stand in which a plurality of sets of clamping means and lead-in wire holding means are arranged, and a drive unit that rotates the index stand intermittently.