CN110678005A - PCB golden finger rubberizing equipment and rubberizing method - Google Patents

PCB golden finger rubberizing equipment and rubberizing method Download PDF

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Publication number
CN110678005A
CN110678005A CN201910963786.XA CN201910963786A CN110678005A CN 110678005 A CN110678005 A CN 110678005A CN 201910963786 A CN201910963786 A CN 201910963786A CN 110678005 A CN110678005 A CN 110678005A
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CN
China
Prior art keywords
clamping
pcb
glue
adhesive tape
rubberizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910963786.XA
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Chinese (zh)
Inventor
王标
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hubei Trillion Yuan Technology Co Ltd
Original Assignee
Hubei Trillion Yuan Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hubei Trillion Yuan Technology Co Ltd filed Critical Hubei Trillion Yuan Technology Co Ltd
Priority to CN201910963786.XA priority Critical patent/CN110678005A/en
Publication of CN110678005A publication Critical patent/CN110678005A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Abstract

The invention discloses a PCB golden finger rubberizing device and a rubberizing method, wherein the rubberizing device comprises a workbench, a clamping device, a glue feeding device, a negative pressure structure and a glue shearing device, and the workbench is provided with a slot extending linearly; the clamping device is arranged at the slot and is used for clamping the PCB and is provided with two clamping surfaces capable of moving relatively; the glue feeding device comprises a material roll, a glue clamping assembly and a first driving device, wherein the glue clamping assembly is used for clamping a glue tape on the material roll, and the first driving device is used for driving the glue clamping assembly to move along the groove; the negative pressure structure is arranged below the workbench and is used for forming negative pressure towards the lower part of the workbench in the area where the clamping device is located; the adhesive tape shearing device is arranged beside the material roll and used for shearing the adhesive tape pulled out by the adhesive tape clamping component. The full-automatic rubberizing is realized, the operation is simple, and the full-automatic rubberizing device is basically suitable for rubberizing of various types of PCB boards.

Description

PCB golden finger rubberizing equipment and rubberizing method
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a PCB golden finger rubberizing device and a rubberizing method.
Background
In the production and manufacturing process of a Printed Circuit Board (PCB), after electrical testing of the PCB, a high temperature adhesive tape must be adhered to the PCB with a gold finger during the processing process to protect the gold finger, so as to prevent the gold finger from being damaged by oxidation or scratching.
At present, a high-temperature adhesive tape is generally pasted on a golden finger part of a PCB by a pure manual adhesive tape or a pasting machine. The pure manual rubberizing speed is slow, pastes partially easily and produces pincher trees, rubberizing inefficiency, pastes the precision not high, and manual pasting can leave fingerprint, sweat stain in the face easily simultaneously, causes the PCB board to be oxidized to influence the yield of PCB board, still appears the consequences such as scratch face very easily simultaneously. Although the problem of manual rubberizing can be avoided to the rubberizing machine rubberizing area, the rubberizing needs the rubberizing machine of difference to carry out the rubberizing of the model of different PCB boards, and the rubberizing is with high costs, is not suitable for batch rubberizing.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a golden finger rubberizing device and a rubberizing method for a PCB, which realize full-automatic rubberizing, are simple to operate and are basically suitable for rubberizing of PCBs of various models.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows:
a PCB board golden finger rubberizing equipment, it includes:
a table provided with a linearly extending slot;
the clamping device is arranged at the groove and used for clamping the PCB, and the clamping device is provided with two clamping surfaces capable of moving relatively;
the glue feeding device comprises a material roll, a glue clamping assembly and a first driving device, wherein the glue clamping assembly is used for clamping a glue tape on the material roll, and the first driving device is used for driving the glue clamping assembly to move along the groove;
the negative pressure structure is arranged below the workbench and is used for forming negative pressure towards the lower part of the workbench in the area where the clamping device is located;
and the adhesive tape shearing device is arranged beside the material roll and is used for shearing the adhesive tape pulled out by the adhesive tape clamping component.
On the basis of the above technical solution, the clamping device includes:
the two clamping surfaces are respectively arranged on the opposite wall surfaces of the two clamping plates;
and the second driving device is connected with at least one clamping plate and is used for driving the clamping plate connected with the second driving device to be close to and far away from the other clamping plate.
On the basis of the above technical scheme, the negative pressure structure includes:
the air inlets are formed in the top of the clamping plate and are arranged at intervals along the length direction of the clamping plate;
the air outlet is arranged at the bottom or the side part of the clamping plate and communicated with the air inlet;
and the negative pressure mechanism is communicated with the air outlet.
On the basis of the technical scheme, the rubber clamping component comprises two rubber clamping heads which are arranged up and down, and the two rubber clamping heads can move in an opening and closing mode to loosen and clamp the rubber belt.
On the basis of the technical scheme, the lower surface of one of the two glue clamping heads positioned above is serrated.
On the basis of the technical scheme, one of the two rubber clamping heads which is positioned at the lower part is used for sucking and covering the rubber belt through negative pressure.
On the basis of the technical scheme, the rubber clamping head is provided with a U-shaped clamping groove for clamping the PCB.
On the basis of the above technical solution, the first driving device includes:
two driving wheels arranged at intervals;
and the belt is connected between the two driving wheels and is connected with the rubber clamping component.
On the basis of the technical scheme, the equipment further comprises a clamping device, wherein the clamping device is positioned between the material roll and the glue shearing device and is used for clamping the adhesive tape when the glue shearing device shears the glue.
The invention also provides a PCB golden finger rubberizing method which is used for rubberizing the PCB golden finger by using the PCB golden finger rubberizing equipment.
Compared with the prior art, the invention has the advantages that:
the first driving device of the PCB metal finger gluing equipment drives the gluing clamping component to move along the groove, the adhesive tape is adsorbed on the clamping device under the action of negative pressure generated by the negative pressure structure, and the length of the adhesive tape is determined according to the length of the PCB to be glued so as to control the movement path of the material roll, thereby meeting the gluing lengths of PCBs of different types and sizes; the distance between the two clamping surfaces can be adjusted according to the thickness of the PCB so as to clamp the PCB, and therefore the adhesive tape is attached to the two opposite wall surfaces of the golden finger of the PCB. The golden finger rubberizing equipment for the PCB is capable of automatically rubberizing, is basically suitable for PCBs of various models and sizes, avoids the phenomena of offset rubberizing and wrinkling, and is high in rubberizing precision and rubberizing efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a golden finger gluing device for a PCB in an embodiment of the invention;
FIG. 2 is a front view of the inner structure of the golden finger pasting device for PCB board in the embodiment of the present invention;
FIG. 3 is a rear view of the internal structure of the golden finger gluing device for PCB in the embodiment of the present invention;
FIG. 4 is an exploded view of a golden finger pasting device for PCB board in the embodiment of the present invention;
FIG. 5 is an enlarged view taken at A in FIG. 4;
fig. 6 is a schematic structural diagram of an adhesive sandwiched component in embodiment 2 of the invention.
In the figure: 1-workbench, 10-slotting, 2-clamping device, 20-clamping surface, 21-clamping plate, 22-second driving device, 3-glue feeding device, 30-material coil, 31-glue clamping component, 310-glue clamping head, 311-U-shaped clamping groove, 32-first driving device, 320-driving wheel, 321-belt, 4-negative pressure structure, 40-air inlet, 5-glue shearing device, 6-adhesive tape and 7-clamping device.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Example 1:
referring to fig. 1, embodiment 1 of the present invention provides a golden finger gluing device for a PCB, which includes a workbench 1, a clamping device 2, a glue feeding device 3, a negative pressure structure 4 and a glue shearing device 5, wherein a slot 10 extending linearly is formed in the workbench 1, the clamping device 2 is disposed at the slot 10, the clamping device 2 is not higher than the workbench 1, the clamping device 2 has two clamping surfaces 20 capable of moving relatively, the two clamping surfaces 20 are far away from each other to form a clamping space for clamping the PCB, and the distance between the two clamping surfaces 20 can be adjusted according to PCBs with different thicknesses to clamp PCBs with different thicknesses; the adhesive feeding device 3 comprises a material roll 30 for winding the adhesive tape 6, an adhesive clamping assembly 31 and a first driving device 32, wherein the adhesive clamping assembly 31 is used for clamping the adhesive tape 6 on the material roll 30 so as to draw the adhesive tape 6 to be covered on a clamping space of the clamping device 2 or the open slot 10 of the workbench 1, and the first driving device 32 is used for driving the adhesive clamping assembly 31 to move along the open slot 10; the negative pressure structure 4 is arranged below the workbench 1, the negative pressure structure 4 is used for forming negative pressure towards the lower part of the workbench 1 in the area where the clamping device 2 is located, when the adhesive tape 6 is clamped by the adhesive clamping assembly 31 to move along the slot 10, the adhesive tape 6 is adsorbed on the slot 10 or the clamping device 2 under the action of the negative pressure so as to prevent the adhesive tape 6 from deviating or wrinkling in the running direction; the adhesive tape shearing device 5 is arranged beside the material roll 30 and used for shearing the adhesive tape 6 pulled out by the adhesive tape clamping component 31, and the path distance of the adhesive tape clamping component 31 along the groove 10 is set according to the length of the PCB golden finger with different lengths needing adhesive tape sticking so as to control the length of the pulled adhesive tape 6, avoid the waste of the adhesive tape 6 and realize the comprehensive protection of the PCB golden finger.
The application principle of the PCB golden finger rubberizing equipment in the embodiment 1 of the invention is as follows: the first driving device 32 drives the glue clamping assembly 31 to move towards the direction close to the material roll 30, so that the glue clamping assembly 31 is pulled out through the glue shearing device 5 and clamps the adhesive tape 6 fed from the material roll 30; then the first driving device 32 drives the adhesive clamping component 31 to move towards the direction far away from the material roll 30, the adhesive tape 6 is adsorbed on the clamping device 2 under the action of the negative pressure generated by the negative pressure structure 4, and the length of the adhesive tape 6 is determined according to the length of the PCB to be attached, so that the movement path of the material roll 30 is controlled, and the adhesive attaching length of the PCB with different lengths is met; and then, inserting the golden fingers of the PCB into a clamping space formed by the two clamping surfaces 20, inserting the adhesive tape 6 into the clamping space along with the PCB, moving the two clamping surfaces 20 close to each other to clamp the PCB, and adjusting the distance between the two clamping surfaces 20 according to PCBs with different thicknesses, so that the adhesive tape 6 is attached to two opposite wall surfaces of the golden fingers of the PCB with different thicknesses. The golden finger gluing equipment for the PCB is used for automatically gluing, is basically suitable for PCBs of various types and sizes, does not have the phenomena of deviation and wrinkle, and is high in gluing precision and gluing efficiency.
Referring to fig. 2, the clamping device 2 includes two clamping plates 21 and a second driving device 22, which are oppositely disposed, and two clamping surfaces 20 are respectively disposed on opposite wall surfaces of the two clamping plates 21; the second driving means 22 is connected to at least one of the clamping plates 21 and serves to drive the clamping plate 21 connected thereto closer to and away from the other clamping plate 21. In embodiment 1 of the present invention, a second driving device 22 is connected to one clamping plate 21 and drives the clamping plate 21 to move closer to and away from the other clamping plate 21, and a rail is provided on the table 1, and the clamping plate 21 is driven by the second driving device 22 to move along the rail.
Referring to fig. 2 and 3, the clamping plate 21 in embodiment 1 of the present invention is a hollow plate, the negative pressure structure 4 includes a plurality of air inlets 40 opened at the top of the clamping plate 21, and the plurality of air inlets 40 are arranged along the length direction of the clamping plate 21; the device also comprises an air outlet arranged at the bottom or the side part of the clamping plate 21, the air outlet is communicated with the air inlet 40, and a negative pressure mechanism which can be an air pump is communicated with the air outlet. The air in the clamping plate 21 is pumped by the air pump to form negative pressure, so that the adhesive tape 6 passing through the clamping plate 21 is adsorbed on the clamping plate 21 under the action of the negative pressure, and the running path of the adhesive tape 6 is ensured to be a straight line and not to deviate.
Referring to fig. 4 and 5, the laminating assembly 31 includes two laminating heads 310 disposed one above the other, and the laminating heads 310 are movable toward and away from each other to release and clamp the adhesive tape 6. The laminating head 310 in embodiment 1 of the present invention includes a first section disposed along the length direction of the clamping plate 21 and a second section disposed perpendicular to the first section, and the second section is a clamping end for clamping the adhesive tape 6.
Preferably, the lower surface of one of the two adhesive applying heads 310 located above is serrated, the upper surface of the adhesive tape 6 is an adhesive surface, and the lower surface is a non-adhesive surface, so that the adhesive surface of the adhesive tape 6 is adhered to the lower surface of the adhesive applying head 310 located above, and the lower surface of the adhesive applying head 310 is serrated to reduce the adhesion between the adhesive applying head and the adhesive surface of the adhesive tape 6. And one of two doubling heads 310 that lie in the below is used for inhaling through the negative pressure and covers sticky tape 6, has seted up a passageway on this doubling head 310, and this passageway extends towards the upper surface of doubling head 310 and forms the air inlet, extends towards the lower surface of doubling head 310 and forms the gas outlet, and the gas outlet intercommunication has air exhaust device, and air exhaust device draws air to the passageway, adsorbs sticky tape 6 on one doubling head 310 that lies in the below, will press from both sides gluey head 310 fixed and press from both sides tightly.
Referring to fig. 3 and 4, the first driving device 32 includes two driving wheels 320 arranged at intervals, a belt 321 and a track, the belt 321 is connected between the two driving wheels 320 and connected to the glue-sandwiching assembly 31, the track is arranged in parallel with the belt 321, and the bottom of the glue-sandwiching assembly 31 is slidably arranged on the track and slides along the track under the driving of the belt 321, so as to realize the movement close to and away from the material roll 30.
Referring to fig. 4, the apparatus further includes a clamping device 7, and the clamping device 7 is located between the material roll 30 and the adhesive cutting device 5 and is used for clamping the adhesive tape 6 when the adhesive cutting device 5 cuts the adhesive. The clamping device 7 comprises two clamping plates which can be moved towards and away from each other in order to loosen and clamp the adhesive tape 6.
Example 2:
referring to fig. 6, the basic content of the embodiment 2 of the present invention is the same as that of the embodiment 1, except that the glue-sandwiching assembly 31 of the embodiment 2 of the present invention includes two glue-sandwiching heads 310 disposed up and down, the glue-sandwiching heads 310 are disposed along the length direction of the clamping plate 21, and the rubber clamping head 310 is provided with a U-shaped clamping groove 311 for clamping a PCB, the length of the rubber belt 6 clamped by the rubber clamping head 310 is exactly equal to the depth of the notch of the U-shaped clamping groove 311, and the clamping space formed between the U-shaped clamping slot 311 and the two clamping plates 21 is communicated, when pasting the adhesive, the PCB is inserted into the clamping space from the U-shaped slot 311, so that the adhesive tape 6 clamped by the adhesive clamping head 310 is just pasted at the edge of the PCB, the waste of the adhesive tape 6 is not caused, and the length of the adhesive tape 6 can be controlled more accurately according to the length of the PCB, so that the length of the adhesive tape 6 pulled out by the adhesive clamping component 31 just matches with the length of the PCB to be glued.
Example 3:
the embodiment 3 of the invention provides a PCB golden finger rubberizing method, which is used for rubberizing a PCB golden finger by using the PCB golden finger rubberizing equipment. The method comprises the following specific steps:
firstly, the first driving device 32 drives the glue clamping assembly 31 to move towards the direction close to the material roll 30, so that the glue clamping assembly 31 is pulled out through the glue shearing device 5 and clamps the adhesive tape 6 sent from the material roll 30; then the first driving device 32 drives the adhesive clamping component 31 to move towards the direction far away from the material roll 30, the adhesive tape 6 is adsorbed on the clamping device 2 under the action of the negative pressure generated by the negative pressure structure 4, and the length of the adhesive tape 6 is determined according to the length of the PCB to be attached, so that the movement path of the material roll 30 is controlled, and the adhesive attaching length of the PCB with different lengths is met; and then, inserting the golden fingers of the PCB into a clamping space formed by the two clamping surfaces 20, inserting the adhesive tape 6 into the clamping space along with the PCB, moving the two clamping surfaces 20 close to each other to clamp the PCB, and adjusting the distance between the two clamping surfaces 20 according to PCBs with different thicknesses, so that the adhesive tape 6 is attached to two opposite wall surfaces of the golden fingers of the PCB with different thicknesses. The golden finger gluing equipment for the PCB is used for automatically gluing, is basically suitable for PCBs of various types and sizes, does not have the phenomena of deviation and wrinkle, and is high in gluing precision and gluing efficiency.
The present invention is not limited to the above-described embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and such modifications and improvements are also considered to be within the scope of the present invention. Those not described in detail in this specification are within the skill of the art.

Claims (10)

1. The utility model provides a PCB sheet metal finger rubberizing equipment which characterized in that, it includes:
a table (1) provided with a linearly extending slot (10);
the clamping device (2) is arranged at the position of the slot (10), the clamping device (2) is used for clamping the PCB, and the clamping device (2) is provided with two clamping surfaces (20) capable of moving relatively;
the glue conveying device (3) comprises a material roll (30), a glue clamping assembly (31) and a first driving device (32), wherein the glue clamping assembly (31) is used for clamping the adhesive tape (6) on the material roll (30), and the first driving device (32) is used for driving the glue clamping assembly (31) to move along the slot (10);
the negative pressure structure (4) is arranged below the workbench (1), and the negative pressure structure (4) is used for forming negative pressure towards the lower part of the workbench (1) in the area where the clamping device (2) is located;
and the adhesive tape shearing device (5) is arranged beside the material roll (30) and is used for shearing the adhesive tape (6) pulled out by the adhesive tape clamping component (31).
2. A PCB sheet finger gluing device according to claim 1, wherein said gripping means (2) comprises:
the two clamping plates (21) are arranged oppositely, and the two clamping surfaces (20) are respectively arranged on the opposite wall surfaces of the two clamping plates (21);
a second drive means (22), said second drive means (22) being associated with at least one of said clamping plates (21) and being adapted to drive said clamping plate (21) associated therewith towards and away from the other clamping plate (21).
3. PCB golden finger gumming device according to claim 2, characterized in that said negative pressure structure (4) comprises:
the air inlets (40) are formed in the top of the clamping plate (21) and are arranged at intervals along the length direction of the clamping plate (21);
an air outlet which is arranged at the bottom or the side part of the clamping plate (21) and is communicated with the air inlet (40);
and the negative pressure mechanism is communicated with the air outlet.
4. A PCB panel finger gluing device according to claim 1, wherein said gluing assembly (31) comprises two gluing heads (310) arranged one above the other, said two gluing heads (310) being movable towards and away from each other to release and grip said adhesive tape (6).
5. The PCB sheet metal finger gluing device of claim 4, wherein the lower surface of the upper one (310) of the two glue clamping heads (310) is serrated.
6. A PCB sheet metal finger gluing device according to claim 4, characterized in that the lower one (310) of the two glue clamping heads (310) is used for sucking the adhesive tape (6) by negative pressure.
7. The finger gluing device for PCB of claim 4, wherein the glue clamping head (310) is provided with a U-shaped slot (311) for clamping the PCB.
8. A PCB sheet metal finger gluing device according to claim 1, wherein said first driving means (32) comprises:
two spaced apart drive wheels (320);
a belt (321) connected between the two drive wheels (320) and connected to the glue-sandwiching assembly (31).
9. A PCB panel finger gluing device according to claim 1, further comprising clamping means (7), said clamping means (7) being located between said roll (30) and said glue cutting means (5) and being adapted to clamp said tape (6) when the glue cutting means (5) cuts glue.
10. A method for taping a gold finger of a PCB board using the apparatus of claim 1.
CN201910963786.XA 2019-10-11 2019-10-11 PCB golden finger rubberizing equipment and rubberizing method Pending CN110678005A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910963786.XA CN110678005A (en) 2019-10-11 2019-10-11 PCB golden finger rubberizing equipment and rubberizing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910963786.XA CN110678005A (en) 2019-10-11 2019-10-11 PCB golden finger rubberizing equipment and rubberizing method

Publications (1)

Publication Number Publication Date
CN110678005A true CN110678005A (en) 2020-01-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910963786.XA Pending CN110678005A (en) 2019-10-11 2019-10-11 PCB golden finger rubberizing equipment and rubberizing method

Country Status (1)

Country Link
CN (1) CN110678005A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111300978A (en) * 2020-03-04 2020-06-19 黄碧芳 Double-sided red glue reworking, scanning and covering-pasting solder paste printing machine for circuit board
CN112235962A (en) * 2020-10-15 2021-01-15 李海珍 Automatic rubberizing device of PCB board
CN114786354A (en) * 2022-04-15 2022-07-22 刘菲菲 PCB board low temperature rubberizing equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111300978A (en) * 2020-03-04 2020-06-19 黄碧芳 Double-sided red glue reworking, scanning and covering-pasting solder paste printing machine for circuit board
CN112235962A (en) * 2020-10-15 2021-01-15 李海珍 Automatic rubberizing device of PCB board
CN114786354A (en) * 2022-04-15 2022-07-22 刘菲菲 PCB board low temperature rubberizing equipment
CN114786354B (en) * 2022-04-15 2023-09-05 宜宾卓邦科技有限公司 PCB board low temperature rubberizing equipment

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