JPH04145645A - Resin sealed type semiconductor device - Google Patents

Abstract

PURPOSE:To improve the accuracy of a resin sealed central point by providing an opening which reaches the surface of an internal drawn out lead at the top die resin sealed part of the lead drawn out from the resin sealed interface of a point positioned on the diagonal of facing sides. CONSTITUTION:An opening 4 whose width is 1.0mm and a length is 1.0mm and reaches internal drawn out lead 11 is provided on the top die resin sealed part 9 of the leads, for example, an A pin 6 and a B pin 7, which are drawn out from the resin sealed interface 8 of a point positioned on the diagonal of facing sides. Thus, influence on the leads such as torsion, etc., is prevented by surface acknowledgement by a binary-image using the surface points A, B, C and D of the lead 11. Therefore, the highly accurate resin sealed central point 3 is obtained, and accurate automatic mounting on a mount pad arranged on a printed board is allowed without deviation.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

In conventional resin-sealed semiconductor devices, for example, Q F P
(Quad Flat Package) Printed circuit board mounting has become increasingly automated in recent years, and is usually carried out automatically.

Generally, the semiconductor device mounting method during automatic mounting involves surface recognition (binary image) of points A, B, C, and D on the printed circuit board contact surfaces of the A bin 6 and B bin 7, as shown in Figure 4. It has been usual to find the center point 3 of resin sealing, and based on this center point, mount it on a printed circuit board with high precision and solder it.

[Problem to be solved by the invention]

The conventional method for recognizing the mounting position of a semiconductor device described above uses the printed circuit board contact surface 5, which is the tip of the external lead. The center point of the resin sealing will be misaligned, resulting in a problem that the printed circuit board will not be mounted at the correct position.

As a result, there is a misalignment between the printed circuit board contact surface, which is the tip of the external lead, and the printed circuit board butt, resulting in disadvantages such as poor soldering and increased man-hours due to remounting.

An object of the present invention is to provide a resin-sealed semiconductor device that can obtain a highly accurate resin-sealed center point.

[Means to solve the problem]

The resin-sealed semiconductor device of the present invention is a resin-sealed semiconductor device in which external leads are led out at a predetermined pitch in four directions, and the tips of the external leads are in parallel contact with a conductor layer on a mounting board. The device is characterized in that the upper mold resin stopper on the upper surface of at least two of the external lead-out leads located diagonally on opposite sides is provided with an opening that reaches the surface of the inner lead-out lead.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) to (c) are a front view, a plan view, and a side view showing one embodiment of the present invention, respectively, and FIG. 2 is a partially enlarged view of section A shown in FIG. 1. This chip consists of an element mounting part on which the semiconductor element is fixedly mounted, a plurality of lead parts extending to the vicinity of the element mounting part, and a main part including the semiconductor element by wire bonding the lead tips and the semiconductor element. It is constructed by resin sealing using upper and lower molds. The external lead-out leads 1 are led out at a predetermined pitch in four directions, and are processed so that the tips of the external lead-out leads come into parallel contact with the conductor layer on the mounting board to maintain electrical conduction.

In such a chip, a lead with a width of 1.0 m is attached to the upper mold resin sealing portion 9 of the A-bin 6 and the B-bin 7, which are led out from the resin-sealing interface 8 at points located diagonally on the opposite sides.
An opening 4 reaching an internal lead-out lead portion 11 having a length of about 1.0 mm and a length of about 1.0 mm is provided.

By adopting such a structure, the internal lead-out lead 11
By performing surface recognition using a binary image using the surface points A, B, C, and D, the influence of twisting of the lead portion, etc. is eliminated, so that it is possible to obtain the resin-sealing center point 3 with high accuracy.

FIGS. 3(a) to 3(c) are a front view, a plan view, and a side view, respectively, showing a second embodiment of the present invention.

The upper mold resin sealing portion 9 of the lead 1, which is led out from the resin sealing interface 8 at a point located on the diagonal of two pairs of opposing sides, has a width of 1. An opening 4 with a length of about 1.0 mm is provided, and a total of 4 openings are provided.
Surface recognition using binary images at points.

In this embodiment, since four points are recognized, it is possible to obtain the resin sealing center point 3 with higher accuracy.

In the embodiment described above, the size of the opening is set to 1.
Qmm, the length was explained as 1.0mm, but in the present invention, the width is 1.0m from 0.5mm, which is used as a normal bin width.
If the size is about m, the same effect as described above can be obtained. Further, the width and length of the opening need not be equal, and even if the two values are different, the accuracy of determining the center point will not be affected.

〔Effect of the invention〕

As explained above, in the present invention, the external leads are led out at a predetermined pitch in four directions, and the tips of the external lead leads are processed in parallel to the conductor layer on the mounting board to maintain electrical conduction. In a certain resin-sealed semiconductor device, an opening extending to the surface of the inner lead-out lead is provided in the upper mold resin stopper of the lead led out from the resin-sealed interface at a point located on the diagonal of the opposing sides. By performing surface recognition of the opening using a binary image, a highly accurate resin sealing center point can be obtained.

This has the effect of enabling highly accurate automatic mounting without misalignment of the mount pads arranged on the printed circuit board.

[Brief explanation of drawings]

FIGS. 1(a) to 1(c) are a front view, a top view, and a side view of a resin-sealed semiconductor device showing an embodiment of the present invention, respectively;
Figure 2 is an enlarged projected view of part A shown in Figure 1, and Figure 3 (a
) to (c) are respectively a front view, a plan view, and a side view showing the second embodiment of the present invention, and FIGS. 4(a) to (c) are front views of a conventional resin-sealed semiconductor device, respectively. , a plan view and a side view. 1...External lead-out lead, 2...Resin sealing, 3...
Resin sealing center point, 4... Resin sealing opening, 5... Board contact surface, 6... A pin, 7... B bottle, 8...
Resin sealing interface, 9... Upper mold resin sealing part, 10...
Lower mold resin sealing part, 11...internal lead-out lead.

Claims (1)

[Claims] 1. In a resin-sealed semiconductor device in which external leads are led out at a predetermined pitch in four directions, and the tips of the external leads are in parallel contact with a conductor layer on a mounting board, A resin-sealed semiconductor device characterized in that an upper mold resin stopper on the upper surface of at least two external lead-out leads located on a diagonal line of a side thereof is provided with an opening that reaches a surface of the inner lead-out lead. 2. The resin-sealed semiconductor device according to claim 1, wherein the width and length of the opening are each 0.5 mm or more and 1.0 mm or less.