JPH04246852A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPH04246852A
JPH04246852A JP3011742A JP1174291A JPH04246852A JP H04246852 A JPH04246852 A JP H04246852A JP 3011742 A JP3011742 A JP 3011742A JP 1174291 A JP1174291 A JP 1174291A JP H04246852 A JPH04246852 A JP H04246852A
Authority
JP
Japan
Prior art keywords
bonding
leads
lead
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3011742A
Other languages
Japanese (ja)
Inventor
Yukio Kasuya
Kenji Sugawara
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP3011742A priority Critical patent/JPH04246852A/en
Publication of JPH04246852A publication Critical patent/JPH04246852A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Abstract

PURPOSE: To obtain a semiconductor device package where bonding inner leads are prevented from being wrongly recognized and lessened in trouble such as bonding deviation by a method wherein at least an inner lead provided with a pattern recognition recess is provided.
CONSTITUTION: A lead frame 1 and a window frame 3 are fixed onto a ceramic board 7 through the intermediary of low melting point glass 2, a CCD long chip 4 is fixed on the ceramic board 7, electrodes 8 provided onto the CCD long chip 4 are electrically connected to the tips of inner leads 1b and an inner lead 1c provided with a bonding pattern recognition recess P with metal fine wires 5, and then a cap is fixed through the intermediary of thermosetting resin. In this semiconductor device package, the inner lead 1c provided with a bonding pattern recognition recess P is provided and discriminated from the other inner leads 1b, whereby inner leads are prevented from being wrongly recognized and lessened in defective bonding.
COPYRIGHT: (C)1992,JPO&Japio
JP3011742A 1991-02-01 1991-02-01 Package for semiconductor device Pending JPH04246852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3011742A JPH04246852A (en) 1991-02-01 1991-02-01 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3011742A JPH04246852A (en) 1991-02-01 1991-02-01 Package for semiconductor device

Publications (1)

Publication Number Publication Date
JPH04246852A true JPH04246852A (en) 1992-09-02

Family

ID=11786479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3011742A Pending JPH04246852A (en) 1991-02-01 1991-02-01 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPH04246852A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888209B2 (en) 2002-09-20 2005-05-03 Casio Computer Co., Ltd. Semiconductor package and method of fabricating the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242254B2 (en) * 1976-09-20 1987-09-07 Intaanashonaru Bijinesu Mashiinzu Corp
JPH02246256A (en) * 1989-03-20 1990-10-02 Hitachi Device Eng Co Ltd Semiconductor element package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242254B2 (en) * 1976-09-20 1987-09-07 Intaanashonaru Bijinesu Mashiinzu Corp
JPH02246256A (en) * 1989-03-20 1990-10-02 Hitachi Device Eng Co Ltd Semiconductor element package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888209B2 (en) 2002-09-20 2005-05-03 Casio Computer Co., Ltd. Semiconductor package and method of fabricating the same

Similar Documents

Publication Publication Date Title
KR970001928B1 (en) Process for flip-chip connection of a semiconductor chip
EP0977251A4 (en) Resin sealed semiconductor device and method for manufacturing the same
JPS6149432A (en) Manufacture of semiconductor device
JPH0394459A (en) Semiconductor chip module and manufacture thereof
JPH03225854A (en) Semiconductor device and manufacture thereof
KR950001365B1 (en) Substrate for packaging a semiconductor device, packaging structure and method
JPS60115247A (en) Semiconductor device
JPH01251747A (en) Semiconductor device and manufacture thereof
JPS58158950A (en) Semiconductor device
JPH02187054A (en) Construction of hybrid integrated circuit
JPH0417343A (en) Manufacture of thin-type semiconductor device
JPH04229693A (en) Surface-mounting method for electronic device
JPS63188964A (en) Integrated circuit package
JPH0191442A (en) Semiconductor package
JPH0378236A (en) Carrier tape and manufacture of semiconductor device using the same
JPH03203300A (en) Device for mounting integrated circuit on base
EP0154562A3 (en) Two terminal axial lead suppressor and diode device and method of making
JPS6068639A (en) Resin-sealed semiconductor device
KR950004512A (en) Semiconductor device and manufacturing method
JPS62264659A (en) Solid-state image sensing device
JPS60244034A (en) Atmosphere forming device for wire bonding
JPH01191455A (en) Semiconductor device
IT1165447B (en) Method for soldering metal wires to conductors of passivated microcircuits on chips
JPH04155854A (en) Semiconductor integrated circuit device and lead frame therefor
JPS6329973A (en) Semiconducotr integrated circuit device

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19970506