JPH04135400A - Ultrasonic probe - Google Patents
Ultrasonic probeInfo
- Publication number
- JPH04135400A JPH04135400A JP2258512A JP25851290A JPH04135400A JP H04135400 A JPH04135400 A JP H04135400A JP 2258512 A JP2258512 A JP 2258512A JP 25851290 A JP25851290 A JP 25851290A JP H04135400 A JPH04135400 A JP H04135400A
- Authority
- JP
- Japan
- Prior art keywords
- face
- piezoelectric
- pedestal
- base
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 5
- 239000002585 base Substances 0.000 description 18
- 239000002131 composite material Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は超音波探触子を利用分野とし、特に微小圧電片
を二次元方向(x−y方向)に配置して構成した超音波
探触子に関する。Detailed Description of the Invention (Industrial Field of Application) The field of the present invention is an ultrasonic probe, and in particular an ultrasonic probe constructed by arranging minute piezoelectric pieces in a two-dimensional direction (x-y direction). Concerning tentacles.
(発明の背景)
超音波探触子は、例えば医用関係の超音波診断装置に超
音波の送受波部として有用される。近年では、微小圧電
片を二次元方向に詑べた1例えばマトリフックス型の超
音波探触子が注目を浴びている。(Background of the Invention) Ultrasonic probes are useful, for example, as ultrasonic wave transmitting/receiving units in medical ultrasonic diagnostic equipment. In recent years, ultrasonic probes, such as the Matrix-type ultrasonic probe, in which minute piezoelectric pieces are arranged two-dimensionally, have been attracting attention.
(従来技術) 第6図はこの種の超音波探触子を説明する図である。(Conventional technology) FIG. 6 is a diagram illustrating this type of ultrasonic probe.
超音波探触子は、図示しない平板状の圧電板を作業台1
上に固着した後、二次元方向(縦横)に切断して溝を設
け、多数の微小圧1「片2(圧電小片lP3とする)を
形成する。そして、圧電小片群3の各溝及びその外周に
エポキシ樹脂等の充填材4を埋設して微小圧電片2を結
合一体化する「第6図(a)」。なお、これを複合圧電
板5とする。The ultrasonic probe uses a flat piezoelectric plate (not shown) on the workbench 1.
After being fixed on the top, it is cut in two-dimensional directions (vertical and horizontal) to provide grooves to form a large number of micro-pressure pieces 2 (referred to as piezoelectric pieces lP3). 6(a), in which a filler 4 such as epoxy resin is buried in the outer periphery and the minute piezoelectric pieces 2 are combined and integrated. Note that this is referred to as a composite piezoelectric plate 5.
次に、複合圧電板5を作業台lから取り外して他主面の
全面に共通電極(未図示)を形成し、主面の各電極に信
号導出入用のリード線6を接続する「第6図(b)」。Next, the composite piezoelectric plate 5 is removed from the workbench l, a common electrode (not shown) is formed on the entire surface of the other main surface, and a "sixth" lead wire 6 for signal derivation/input is connected to each electrode on the main surface. Figure (b).
接続には、例えば半[43や導電性接着剤あるいはボン
ディングが使用される。For the connection, for example, a semi-conductor, a conductive adhesive, or bonding is used.
そして、複合圧電板5を図示しない保持材」二に固着し
、さらに音響整合層等を付加して構成していた。Then, the composite piezoelectric plate 5 was fixed to a holding material (not shown), and an acoustic matching layer and the like were further added.
(従来技術の問題点)
しかしながら、上記構成の配列型探触子では、微小圧電
片2の大きさ(面積)が約1. m m 2以ドになる
と、リード線6の接続作業を困難にして作業性を低下さ
せる。また、これに派生して隣接する微小圧電片2開の
絶縁不良等も発生させ、電気的性能を低下させる。そし
て、 リード線6自体も細くなり断線等の機械的強度を
損なう等の問題があった。また、リード線があるので、
微小圧電片2の保持が充分でなく、探触子の機械的強度
を損なう問題もあった。さらに、これらに付随して、微
小圧電片2の大きさは自ずと制約を受け、ブロードな指
向特性を得ることができずに、画像性能を向上し得ない
問題をも発生させていた。(Problems with the Prior Art) However, in the array type probe with the above configuration, the size (area) of the micro piezoelectric pieces 2 is approximately 1. If it exceeds m m 2, it becomes difficult to connect the lead wire 6 and reduces work efficiency. Further, this also causes insulation defects in the adjacent micro piezoelectric pieces 2, resulting in a decrease in electrical performance. Furthermore, the lead wire 6 itself becomes thinner, causing problems such as wire breakage and loss of mechanical strength. Also, since there is a lead wire,
There was also the problem that the micro piezoelectric piece 2 was not held sufficiently, which impaired the mechanical strength of the probe. Furthermore, accompanying these, the size of the micro piezoelectric piece 2 is naturally restricted, and a problem arises in which broad directivity characteristics cannot be obtained and image performance cannot be improved.
(発明の目的)
本発明は作業性、電気的特性及び機械的強度をを良好し
て、画像性能を向上させ得る超音波探触子を提供するこ
とを目的とする。(Objective of the Invention) An object of the present invention is to provide an ultrasonic probe that has good workability, electrical properties, and mechanical strength, and can improve image performance.
(解決手段)
本発明は、圧電小片群を固着する基台を、複数の導電路
が−L面から一端面に延出した信号導出体を相互に絶縁
するとともに積層して形成し、この基台の一端面上に前
記圧電小片群が固着されるとともに、該−!@面に延出
した各導電路と前記各微小圧電片における一生面の電極
とが接続して構成したことを基本的な解決手段とする。(Solution Means) In the present invention, a base for fixing a group of piezoelectric pieces is formed by mutually insulating and stacking signal deriving bodies in which a plurality of conductive paths extend from the -L plane to one end surface, and this base The piezoelectric small piece group is fixed on one end surface of the table, and the -! The basic solution is that each conductive path extending to the @ plane is connected to the electrode on the entire surface of each micro piezoelectric piece.
以下、本発明の一実施例をm造工程を示して説明する。Hereinafter, one embodiment of the present invention will be explained by showing the manufacturing process.
(実施例)
第1図乃至第5図は本発明の一実施例を説明する超音波
探触子の工程図である。(Embodiment) FIGS. 1 to 5 are process diagrams of an ultrasonic probe illustrating an embodiment of the present invention.
本実施例では、複合圧電板を作業台−1−にて形成せず
、第1図に示したように、先ず、圧電板7をバッキング
材としても兼用し得る基台8の一端面−ヒに直接固着す
る。圧電板7は前述のようにPZTからなり、両本部に
電極(未図示)が形成されている。基台8は複数の信号
導出体9の間に絶縁材10を介在させてそれぞれ接着し
て形成される。In this embodiment, the composite piezoelectric plate is not formed on the workbench-1-, but as shown in FIG. Attach directly to. The piezoelectric plate 7 is made of PZT as described above, and electrodes (not shown) are formed on both parts. The base 8 is formed by adhering a plurality of signal guide bodies 9 to each other with an insulating material 10 interposed between them.
すなわち、信号導出体9を相互に絶縁するとともに積層
してされる。信号導出体9は、第2図に示したように、
多数の信号路11を有する例えばフレキシブルプリント
基板(以下FPCとする)からなる。各信号路1■は被
膜されて主面に並行して形成される。そして、一端側1
1aが主面から一端面に延出して露出する。このように
、基台8の一端面には、露出した信号路が2次元方向に
配置される(第3図)。また、信号路11の他端側11
bは、他端面、−側端面、他側端面に延出して接続端と
なる。That is, the signal deriving bodies 9 are mutually insulated and laminated. The signal deriving body 9, as shown in FIG.
It is made of, for example, a flexible printed circuit board (hereinafter referred to as FPC) having a large number of signal paths 11. Each signal path 1 is coated and formed parallel to the main surface. And one end side 1
1a extends from the main surface to one end surface and is exposed. In this way, exposed signal paths are arranged two-dimensionally on one end surface of the base 8 (FIG. 3). In addition, the other end side 11 of the signal path 11
b extends to the other end surface, the negative end surface, and the other end surface to serve as a connection end.
次に、圧電板7−Lから、基台8に達する切断溝12を
設けて複数の単位振動体となる微小圧電片13に分割す
る(第4図)。但し、切断溝12は二次元方向の各信号
路11間に設けられる。Next, cutting grooves 12 are provided in the piezoelectric plate 7-L to reach the base 8, and the piezoelectric plate 7-L is divided into minute piezoelectric pieces 13 that become a plurality of unit vibrators (FIG. 4). However, the cutting groove 12 is provided between each signal path 11 in the two-dimensional direction.
次に、切断溝12にエポキシ樹脂等の充填材14を埋設
する。また、充填材14を含む圧電小片$ 15 、h
の全面に共通電極16を形成する(第5図)。そして、
図示しない音響整合層等を形成して超音波送受波面とす
る。また、各信号路11の他端側11bに例えばリード
線を半田付は等により接続して(未図示)超音波探触子
を構成する。Next, a filler 14 such as epoxy resin is embedded in the cutting groove 12. In addition, a piezoelectric small piece containing a filler 14 $ 15, h
A common electrode 16 is formed on the entire surface (FIG. 5). and,
An acoustic matching layer (not shown) or the like is formed to form an ultrasonic wave transmitting/receiving surface. Further, a lead wire, for example, is connected to the other end side 11b of each signal path 11 by soldering or the like (not shown) to constitute an ultrasonic probe.
このようなものでは、圧電板7を基台8の一端面上に固
着して切断することにより微小圧電片13毎の電極を導
出する。そして、基台8の他端面あるいは側端面に延出
した信号路11の他端側Ilbを接続端としてリード線
を接続する。したがって、基台8の他端面あるいは側端
面の面積に応じて接続端の間隔等を自在に決定できるの
で、リード線の接続作業を容易にする。そして、これに
より、隣接する微小圧電片13の絶縁を確実にして電気
的性能を維持する。また、電極導出用としての導電路1
1を信号導出体に形成して基台8とするので、新線等の
虞もなく機械的強度を満足する。このようなことから、
微小圧電片13の大きさは、切断精度、FPCパターン
精度及び積層精度に依存して極小にできる。したがって
、指向特性をブロードにし得て画、像性能を向1−する
。そして、付随的に、本実施例では基台8を直接バッキ
ング材として兼用できので、複合圧電板を形成するとき
の作業台を不要とする。したがって、直接圧電小片群」
;3を基台8で保持できるので、機械的強度を増すとと
もに、さらに作業性を向]−できる。In such a device, the piezoelectric plate 7 is fixed on one end surface of the base 8 and cut, thereby leading out the electrodes for each minute piezoelectric piece 13. Then, a lead wire is connected to the other end Ilb of the signal path 11 extending to the other end surface or side end surface of the base 8 as a connection end. Therefore, the interval between the connection ends and the like can be freely determined depending on the area of the other end surface or side end surface of the base 8, thereby facilitating the work of connecting the lead wires. This ensures insulation between adjacent micro piezoelectric pieces 13 and maintains electrical performance. In addition, a conductive path 1 for leading out the electrode
1 is formed into a signal deriving body to serve as the base 8, so there is no risk of new lines etc. and the mechanical strength is satisfied. From such a thing,
The size of the micro piezoelectric piece 13 can be made extremely small depending on cutting accuracy, FPC pattern accuracy, and lamination accuracy. Therefore, the directivity characteristics can be made broader and the image performance can be improved. Incidentally, in this embodiment, the base 8 can also be directly used as a backing material, so a workbench is not required when forming a composite piezoelectric plate. Therefore, the direct piezoelectric particle group'
3 can be held by the base 8, which increases mechanical strength and further improves workability.
(他の事項)
なお、」−2実施例では、接続端を積層された各信シ;
−導出体毎にの他端面、 −側端部あるいは他側端面に
導出したが、例えば次のようにしてもよい。(Other matters) In addition, in the "-2 embodiment, each signal layer in which the connection end is laminated;
Although each lead-out body is guided to the other end surface, the - side end portion, or the other end surface, it may be done as follows, for example.
すなわち、各信号導出体を相互に例えば一端面側のみを
接着して、他端面側は非接着とする。そして、非接着部
に接続端を形成するようにする。したがって、このよう
な場合でも、接続端へのリード線の接続を容易にする。That is, the respective signal deriving bodies are bonded to each other, for example, only on one end surface side, and the other end surface side is not bonded. Then, a connection end is formed in the non-bonded portion. Therefore, even in such a case, the lead wire can be easily connected to the connection end.
そして、この場合、各信号導出体の長さを変えてやれば
リード線の接続作業をさらに容易にする。このように、
接続端の位置は自在に変更できるものであり、上記実施
例に限定されるものではない。In this case, changing the length of each signal lead-out body will further facilitate the connection work of the lead wires. in this way,
The position of the connection end can be changed freely and is not limited to the above embodiment.
また、信))導出体はI” I) Cとしたが、rll
なるプリント基板でもよい。そして、基台は信号導出体
と絶縁材とを積層するとしたが、予め一体化されてあっ
てもよい。Also, the derivative is I” I) C, but rll
A printed circuit board may also be used. Although the base is described as a laminate of the signal deriving body and the insulating material, they may be integrated in advance.
また、本実施例では、基台の一端面にはそれぞれ独立し
た信号路をXY右方向設けることになるが、結果的には
切断による分割されるので基台の全面に信叶路となる電
極を形成しておいてもよいものである。In addition, in this embodiment, independent signal paths are provided in the X and Y right directions on one end surface of the base, but as a result, they are divided by cutting, so electrodes that become signal paths are provided on the entire surface of the base. may be formed in advance.
また、微小圧電片にFPCの各信号路を接続して微小圧
電片を単位振動体としたが、導電路をXY右方向複数個
毎に共通接続して単位振動体とし、m位振動体を複合化
してもよい。この場合、XY右方向みなならず、例えば
同心円上に共通接続してもよい。そして、各微小圧電片
をさらに例えばハーフカットしてもよいものである。In addition, each signal path of the FPC was connected to the minute piezoelectric piece to make the minute piezoelectric piece a unit vibrating body, but the conductive paths were commonly connected to each of the multiple pieces in the XY right direction to make a unit vibrating body, and the m-position vibrating body was made into a unit vibrating body. May be combined. In this case, the common connection may be made not only in the XY right direction but also on concentric circles, for example. Then, each micro piezoelectric piece may be further cut, for example, in half.
(発明の効果)
本発明は、圧電小片群を固着する基台を、複数の導電路
が主面から一端面に延出した信号導出体を相互に絶縁す
るとともに積層して形成し、この基台の一端面」−に前
記圧電小片群が固着されるとともに、該一端面に延出し
た各導電路と前記各微小圧電片の一平面の電極とを接続
して構成したので、作業性、電気的特性及び機械的強度
を良好にして、画像性能を向Iユし得る商音波探触−t
を提供できる。(Effects of the Invention) The present invention provides a base for fixing a group of piezoelectric pieces by forming a base by mutually insulating and laminating signal deriving bodies in which a plurality of conductive paths extend from a main surface to one end surface. The group of piezoelectric small pieces is fixed to one end surface of the table, and each conductive path extending to the one end surface is connected to the electrode on one plane of each of the micro piezoelectric pieces, so that workability is improved. Commercial sonic probe-t that can improve image performance by improving electrical properties and mechanical strength
can be provided.
第1図乃至第5Zは本発明の一実施例を製造に描図をも
って説明する図で、第1図は圧電板を基台に固着した部
分図、第2図は信号導出体の図、第3図は基台の一部平
面図、第4図は圧電板を微小圧電片に分割した一部図、
第5図は共通電極を形成した後の新面図である。
第6図(a)は従来例を説明する複合圧電板の図、同図
(b)は同複合圧電板にリード線を接続した一部図であ
る。1 to 5Z are diagrams for explaining one embodiment of the present invention with drawings for manufacturing. FIG. 1 is a partial view of a piezoelectric plate fixed to a base, FIG. Figure 3 is a partial plan view of the base, Figure 4 is a partial view of the piezoelectric plate divided into minute piezoelectric pieces,
FIG. 5 is a new view after forming the common electrode. FIG. 6(a) is a diagram of a composite piezoelectric plate illustrating a conventional example, and FIG. 6(b) is a partial diagram of the composite piezoelectric plate with lead wires connected thereto.
Claims (1)
方向にならべて圧電小片群とし、該圧電小片群を基台上
に固着して構成した超音波探触子において、 前記基台は、複数の導電路が主面から一端面に延出した
信号導出体を相互に絶縁するとともに積層して形成され
、 該基台の一端面上に前記圧電小片群が固着されるととも
に、該一端面に延出した各導電路と前記各微小圧電片に
おける一主面の電極とが接続して構成されたことを特徴
とする超音波探触子。[Claims] An ultrasonic probe configured by arranging a plurality of micro piezoelectric pieces each having electrodes formed on both principal surfaces in a two-dimensional direction to form a group of piezoelectric pieces, and fixing the group of piezoelectric pieces on a base. In the base, the base is formed by mutually insulating and stacking a plurality of signal conductive paths extending from the main surface to one end surface, and the piezoelectric small pieces are arranged on one end surface of the base. An ultrasonic probe characterized in that each conductive path that is fixed and extends to the one end surface is connected to an electrode on one main surface of each of the micro piezoelectric pieces.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2258512A JP2945980B2 (en) | 1990-09-27 | 1990-09-27 | Ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2258512A JP2945980B2 (en) | 1990-09-27 | 1990-09-27 | Ultrasonic probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04135400A true JPH04135400A (en) | 1992-05-08 |
JP2945980B2 JP2945980B2 (en) | 1999-09-06 |
Family
ID=17321243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2258512A Expired - Fee Related JP2945980B2 (en) | 1990-09-27 | 1990-09-27 | Ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2945980B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2027818A1 (en) * | 2006-06-12 | 2009-02-25 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
-
1990
- 1990-09-27 JP JP2258512A patent/JP2945980B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2027818A1 (en) * | 2006-06-12 | 2009-02-25 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
EP2027818A4 (en) * | 2006-06-12 | 2010-03-03 | Olympus Medical Systems Corp | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
Also Published As
Publication number | Publication date |
---|---|
JP2945980B2 (en) | 1999-09-06 |
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