CN114793316A - Sound production module and electronic equipment - Google Patents

Sound production module and electronic equipment Download PDF

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Publication number
CN114793316A
CN114793316A CN202110106218.5A CN202110106218A CN114793316A CN 114793316 A CN114793316 A CN 114793316A CN 202110106218 A CN202110106218 A CN 202110106218A CN 114793316 A CN114793316 A CN 114793316A
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CN
China
Prior art keywords
electrode
layer
thin film
layers
module
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Pending
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CN202110106218.5A
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Chinese (zh)
Inventor
陈静
古蒋林
杨大军
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Beijing Xiaomi Mobile Software Co Ltd
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Beijing Xiaomi Mobile Software Co Ltd
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Application filed by Beijing Xiaomi Mobile Software Co Ltd filed Critical Beijing Xiaomi Mobile Software Co Ltd
Priority to CN202110106218.5A priority Critical patent/CN114793316A/en
Publication of CN114793316A publication Critical patent/CN114793316A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

Abstract

The disclosure relates to a sound production module and an electronic device. The sound production module includes: the sounding module comprises a sounding module, a plurality of piezoelectric thin film layers and a plurality of sounding modules, wherein each piezoelectric thin film layer comprises a thin film main body and electrode lugs connected with the edge of the thin film main body; the circuit board is connected with the electrode layers with the same polarity of the plurality of electrode bumps which are stacked.

Description

Sound production module and electronic equipment
Technical Field
The disclosure relates to the technical field of terminals, in particular to a sounding module and electronic equipment.
Background
In order to enrich the use experience of the user, the display panel of part of the electronic equipment can vibrate and sound. In the related art, a piezoelectric material may be provided on a non-display side of a display panel of an electronic device, and the display panel is driven to vibrate by vibration of the piezoelectric material to generate sound.
Disclosure of Invention
The present disclosure provides a sound module and an electronic device to solve the deficiencies in the related art.
According to a first aspect of the embodiments of the present disclosure, there is provided a sound emitting module, including:
the sounding module comprises a sounding module, a plurality of piezoelectric thin film layers and a plurality of sounding modules, wherein each piezoelectric thin film layer comprises a thin film main body and electrode lugs connected with the edge of the thin film main body;
the circuit board is connected with the electrode layers of which the electrode bumps are stacked and have the same polarity.
Optionally, the sound generating module further includes a first insulating layer, and the first insulating layer is bonded between the electrode layers of the two adjacent film bodies with different polarities.
Optionally, the two adjacent film bodies are arranged in direct contact with electrode layers with the same polarity; or, the sound production module still includes the conducting layer, the conducting layer bonds and is in between the electrode layer of same polarity between two adjacent film main parts.
Optionally, the sound module further includes a second insulating layer, and in the stacking direction of the film main body, the second insulating layer is bonded between the electrode layers of which the two adjacent electrode bumps are of different polarities.
Optionally, each piezoelectric thin film layer includes a first electrode bump and a second electrode bump both connected to an edge of the thin film body, and a plurality of the first electrode bumps are stacked and a plurality of the second electrode bumps are stacked;
the circuit board comprises a positive electrode input end and a negative electrode input end, the positive electrode input end is connected with the positive electrode layers of the first electrode bumps, and the negative electrode input ends are connected with the negative electrode layers of the second electrode bumps.
Optionally, the lengths of the first electrode bump and the second electrode bump included in the same piezoelectric film layer, which protrude from the film body, are equal;
in a direction from the first side to the second side of the multi-layered film body, lengths of the plurality of first electrode bumps and the plurality of second electrode bumps protruding out of the corresponding film body are increased.
Optionally, the protruding lengths of the first electrode bumps and the second electrode bumps of the same piezoelectric thin film layer are different, and the protruding lengths of the plurality of first electrode bumps are gradually increased from the first side of the multilayer thin film body to the second side of the multilayer thin film body;
the protruding lengths of the plurality of second electrode bumps increase in a direction from the second side toward the first side of the multi-layer film body.
Optionally, the first electrode bump and the second electrode bump included in the same piezoelectric thin film layer are connected to the same edge or different edges of the thin film body.
Optionally, the first insulating layer includes a first adhesive layer, a metal layer, and a second adhesive layer stacked together, the metal layer is bonded between the first adhesive layer and the second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively connected to the piezoelectric thin film layer;
or the first insulating layer comprises a third adhesive layer, and the upper surface and the lower surface of the third adhesive layer are respectively connected with different piezoelectric thin film layers.
Optionally, the thickness of the first insulating layer is greater than or equal to 15um and less than or equal to 45 um.
According to a second aspect of the embodiments of the present disclosure, there is provided an electronic apparatus including:
a display panel;
the sound-emitting module according to any one of the above embodiments, wherein the sound-emitting module is attached to the non-display side of the display panel.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
known from the above embodiment, in the technical scheme of the present disclosure, the electrode bumps with the same polarity included in the plurality of piezoelectric thin film layers are stacked, and one of the two adjacent electrode bumps is used as a support for the other electrode bump, so that the deformation in the transportation, processing or bonding process is reduced, and the risk of bending failure of the electrode bumps is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic diagram illustrating a structure of a sound module according to an exemplary embodiment.
Fig. 2 is an exploded schematic view of a sound module according to an exemplary embodiment.
Fig. 3 is a schematic diagram of a laminated structure of the sound emitting module in fig. 2.
Fig. 4 is a schematic diagram showing a stack of first and second piezoelectric thin film layers of another sound emitting module according to an example embodiment.
Fig. 5 is a schematic diagram showing a stack of a first piezoelectric thin film layer and a second piezoelectric thin film layer of yet another sound emitting module according to an example embodiment.
Fig. 6 is a top view of the sound emitting module of fig. 2 pointing from the first side to the second side.
Fig. 7 is a top view of the sound emitting module of fig. 2 pointing from the second side in the direction of the first side.
Fig. 8 is a top view of yet another sound module shown in a stacking orientation in accordance with an exemplary embodiment.
Fig. 9 is a schematic diagram illustrating a first insulating layer of a sound module according to an exemplary embodiment.
Fig. 10 is a schematic structural diagram illustrating another first insulating layer of a sound module according to an exemplary embodiment.
Fig. 11 is a schematic structural diagram of an electronic device according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
Fig. 1 is a schematic structural diagram illustrating a sound module 100 according to an exemplary embodiment, fig. 2 is an exploded schematic diagram illustrating the sound module 100 according to an exemplary embodiment, and fig. 3 is a schematic structural diagram illustrating a laminated structure of the sound module 100 in fig. 2. As shown in fig. 1 to 3, the sound module 100 may include a first piezoelectric thin film layer 1, a second piezoelectric thin film layer 2, a third piezoelectric thin film layer 3, and a fourth piezoelectric thin film layer 4. Each of the piezoelectric thin film layers may include a film body, a first electrode bump, and a second electrode bump, for example, the first piezoelectric thin film layer 1 may include a first film body 11, a first electrode bump 12, and a second electrode bump 13, and similarly, the second piezoelectric thin film layer 2 may include a second film body 21, a first electrode bump 22, and a second electrode bump 23; the third piezoelectric thin film layer 3 may include a third film body 31, first electrode bumps 32, and second electrode bumps 33; the fourth piezoelectric thin film layer 4 may include a fourth thin film body 41, a first electrode bump 42, and a second electrode bump 43.
From the material structure of the piezoelectric thin film layer, each piezoelectric thin film layer can include a piezoelectric material layer, a positive electrode layer located on one side of the piezoelectric material layer, and a negative electrode layer located on the other opposite side, as shown in fig. 1, if the positive electrode layer of each piezoelectric thin film layer is located on the upper surface and the negative electrode layer is located on the lower surface, a first insulating layer 5 can be arranged between the electrode layers of which two adjacent film main bodies are different in polarity, and the positive electrode layer and the negative electrode layer belonging to different piezoelectric thin film layers are insulated by the first insulating layer 5. For example, the first insulating layer 5 is provided between the first film body 11 and the second film body 21, between the second film body 21 and the third film body 31, and between the third film body 31 and the fourth film body 41, respectively. Of course, in other embodiments, as shown in fig. 4, electrode layers of different adjacent piezoelectric thin film layers with the same polarity may be disposed in direct contact, and taking the first piezoelectric thin film layer 1 and the second piezoelectric thin film layer 2 as an example, if the upper surface of the first piezoelectric thin film layer 1 is a negative electrode layer, the lower surface of the first piezoelectric thin film layer 1 is a positive electrode layer, and the upper surface of the second piezoelectric thin film layer 2 is a positive electrode layer, and the lower surface of the second piezoelectric thin film layer 2 is a negative electrode layer, the positive electrode layer of the first piezoelectric thin film layer 1 and the positive electrode layer of the second piezoelectric thin film layer 2 may be disposed in direct contact, and in still other embodiments, the negative electrode layer of the first piezoelectric thin film layer 1 and the negative electrode layer of the second piezoelectric thin film layer 2 may also be disposed in direct contact. In other embodiments, as shown in fig. 5, the sound module 100 may further include a conductive layer 8, and the conductive layer 8 may be disposed between electrode layers of different piezoelectric thin film layers with the same polarity, for example, if the upper surface of the first piezoelectric thin film layer 1 is a negative electrode layer, the lower surface is a positive electrode layer, and the upper surface of the second piezoelectric thin film layer 2 is a positive electrode layer, and the lower surface is a negative electrode layer, the conductive layer 8 may be disposed between the positive electrode layer of the first piezoelectric thin film layer 1 and the positive electrode layer of the second piezoelectric thin film layer 2 to enhance the conductivity. The other piezoelectric thin film layers may refer to the arrangement manner between the first piezoelectric thin film layer 1 and the second piezoelectric thin film layer 2 in any of the above embodiments, the same sounding module 100 may also include insulation layers arranged between different piezoelectric thin film layers, or may include an embodiment in which electrode layers with the same polarity are arranged in direct contact with different piezoelectric thin film layers, and a conductive layer 8 is arranged between electrode layers with the same polarity on different piezoelectric thin film layers, which is not limited in this disclosure.
Still referring to fig. 1, if the positive electrode layer of each piezoelectric thin film layer is located on the upper surface and the negative electrode layer is located on the lower surface, as shown in fig. 2 and 6, in the stacking direction from the first side to the second side of the multilayer thin film body, i.e., in the direction indicated by arrow a in fig. 2, the first electrode bump 12, the first electrode bump 22, the first electrode bump 32, and the first electrode bump 42 extend out of the multilayer thin film body by increasing lengths corresponding to the thin film body, and the four first electrode bumps are stacked in the stacking direction of the multilayer thin film body, the sound module 100 may further include a circuit board 7, and the positive electrode layers of the first electrode bump 12, the first electrode bump 22, the first electrode bump 32, and the first electrode bump 42 located on the upper surface are exposed and may be electrically connected to the circuit board 7, specifically, the electrical conduction may be achieved by a conductive adhesive; similarly, as shown in fig. 7, in the stacking direction from the second side to the first side of the multilayer film body, i.e., in the direction indicated by the arrow B in fig. 2, the lengths of the second electrode bumps 13, the second electrode bumps 23, the second electrode bumps 33 and the second electrode bumps 43 extending out of the corresponding film body are increased, and the four layers of the second electrode bumps are stacked along the stacking direction of the multilayer film body, the sound-generating module 100 may further include a circuit board 7, and the exposed positive electrode layers of the second electrode bumps 13, the second electrode bumps 23, the second electrode bumps 33 and the second electrode bumps 43 on the lower surfaces may be electrically connected to the circuit board 7, and particularly, the point conduction may be achieved through the conductive adhesive 6. Of course, in other embodiments, the negative electrode layers of the first electrode bump 12, the first electrode bump 22, the first electrode bump 32 and the first electrode bump 42 may be respectively conducted with the circuit board 7, and the positive electrode layers of the second electrode bump 13, the second electrode bump 23, the second electrode bump 33 and the second electrode bump 43 may be respectively conducted with the circuit board 7, which is not limited by the disclosure
In the embodiment provided in the present disclosure, as shown in fig. 6 and 7, the sound module 100 may include two different circuit boards 7, wherein one circuit board 7 is electrically connected to the electrode layer of each first electrode bump through a conductive paste, and the other circuit board 7 is electrically connected to the negative electrode layer of each second electrode bump through a conductive paste. Of course, in other embodiments, as shown in fig. 7, the sound module 100 may also include a single circuit board, and the single circuit board may include a positive input terminal and a negative input terminal, where the positive input terminal may be electrically connected to the positive electrode layer of each first electrode bump, and each negative input terminal may be electrically connected to the negative electrode layer of each second electrode bump, or the positive input terminal may be electrically connected to the positive electrode layer of each second electrode bump, and each negative input terminal may be electrically connected to the negative electrode layer of each first electrode bump, which is not limited by the disclosure. The conductive adhesive may include an anisotropic conductive adhesive, an anisotropic conductive film, or a double-sided conductive adhesive, and the double-sided conductive adhesive may include a 3M-5112 conductive adhesive, or may be other types of double-sided conductive adhesives, which is not limited by the present disclosure.
In the embodiments provided in the present disclosure, the first electrode bump and the second electrode bump of the same piezoelectric thin film layer are connected to different edges of the film body as an example, and actually, in other embodiments, as shown in fig. 8, the first electrode bump and the second electrode bump may also be connected to the same edge of the film body, which is not limited by the present disclosure. Similarly, the present disclosure describes an example of the relative arrangement of the electrode layers with different polarities in different piezoelectric thin film layers, in fact, when the electrode layers with the same polarity in different piezoelectric thin film layers are directly disposed in contact with each other, the stacked first electrode bumps may be disposed to conduct the electrode layers with the same polarity to the circuit board, and the stacked second electrode bumps may be disposed to conduct the electrode layers with the other polarity to the circuit board 7. In some embodiments, the sound module may also be formed by stacking only a plurality of first electrode bumps, the electrode layers of the first electrode bumps having the same polarity are conducted to the input terminal of any polarity of the circuit board 7, and the second electrode bumps of the piezoelectric thin film layers are staggered and respectively conducted to the input terminal of the other polarity of the circuit board 7.
In the embodiment of the present disclosure, the length of the first electrode bump and the second electrode bump included in the same piezoelectric thin film layer is not equal to each other, and in fact, in other embodiments, as shown in fig. 7, the lengths of the first electrode bumps and the second electrode bumps included in the same piezoelectric thin film layer may be equal, and in a direction from the first side to the second side of the multi-layered thin film body, the lengths of the first electrode bumps extending out of the corresponding thin film body of different piezoelectric thin film layers are increased, the lengths of the second electrode bumps extending out of the corresponding thin film body are increased, or in the stacking direction in which the second side of the multiple piezoelectric thin film layers points to the first side, the lengths of the first electrode bumps of different piezoelectric thin film layers extending out of the corresponding thin film bodies are increased progressively, and the lengths of the second electrode bumps extending out of the corresponding thin film bodies are increased progressively, which is not limited by the disclosure.
According to the embodiment, in the technical scheme of the disclosure, the electrode bumps with the same polarity, which are included in the piezoelectric thin film layers, are stacked, so that one of the two adjacent electrode bumps is used as a support for the other electrode bump, thereby being beneficial to reducing deformation in the transportation, processing or bonding process and reducing the risk of bending failure of the electrode bumps.
In the embodiment provided in the present disclosure, since the plurality of first electrode bumps of different piezoelectric thin film layers are stacked, and the plurality of first electrode bumps are stacked, if in fig. 1, the positive electrode layer of each piezoelectric thin film layer is located on the upper surface, and the negative electrode layer is located on the lower surface, then, in order to avoid series connection between the first electrode bumps of different piezoelectric thin film layers, the sound module 100 may further include a second insulating layer (not shown), where the second insulating layer is bonded between the electrodes with different polarities and between the two adjacent second electrode bumps. Of course, in some embodiments, the electrode layers with the same polarity between two adjacent electrode bumps may be disposed in direct contact, for example, the upper surface of the first piezoelectric film layer is a negative electrode layer, the lower surface of the first piezoelectric film layer is a positive electrode layer, the upper surface of the second piezoelectric film layer is a positive electrode layer, and the lower surface of the second piezoelectric film layer is a negative electrode layer, so that the first electrode bump 12 may be disposed in direct contact with the first electrode bump 22, and in order to avoid the positive electrode layer on the upper surface of the first electrode bump 22 from touching the negative electrode layer on the upper surface of the first electrode bump 12 by mistake, a third insulating layer may also be disposed on the positive electrode layer of the first electrode bump 22, that is, a third insulating layer may be disposed between the electrode layers with the same polarity on different piezoelectric film layers.
In the above embodiment, the piezoelectric material layer may include a polyvinylidene fluoride film layer; or, the piezoelectric material layer may include a polyvinylidene fluoride film composite film layer, for example, a polyvinylidene fluoride film and carbon nanotube composite film layer, or a polyvinylidene fluoride film and piezoelectric ceramic composite film layer; or the piezoelectric material layer may comprise a polyvinylidene fluoride membrane copolymer, such as PVDF + TrFE copolymer. The thickness of this piezoelectric material layer can be more than or equal to 30um, and is less than or equal to 50um, avoids the excessive thickness of piezoelectric material layer to lead to the whole excessive thickness of sound production module 100, influences the interior space layout of the electronic equipment who disposes this sound production module 100. The piezoelectric material layer may be disposed in a square shape, and a ratio of a width dimension to a length dimension of the piezoelectric material layer is greater than 0.5 and less than 1, for example, the width dimension may be 40um, and the length dimension may be 70um, so as to be adapted to a structural dimension of a screen to which the sound module 100 is bonded. The positive electrode layer or the negative electrode layer may include a metal layer, for example, a metal copper layer or a metal nickel layer or a metal silver layer or a metal sodium layer, or the positive electrode layer and the negative electrode layer may further include a metal oxide layer, for example, an indium tin oxide layer, and the materials of the positive electrode layer and the negative electrode layer may be the same or different, which is not limited by the present disclosure.
As shown in fig. 9, the first insulating layer 5 may include a first adhesive layer 51, a metal layer 52 and a second adhesive layer 53 stacked together, the metal layer 52 is disposed between the first adhesive layer 51 and the second adhesive layer 53, the first adhesive layer 51 and the second adhesive layer 52 may be respectively bonded to adjacent piezoelectric thin film layers, and the metal layer 52 is disposed between the first adhesive layer 51 and the second adhesive layer 52, so as to improve the strength of the first insulating layer 5 and further reduce the risk of deformation of the sound module 100. In another embodiment, as shown in fig. 10, the first insulating layer may also include a third adhesive layer, and an upper surface and a lower surface of the third adhesive layer are respectively bonded to different piezoelectric thin film layers, which is not limited by the present disclosure.
Wherein, the thickness of first insulating layer 5 can be more than or equal to 15um, and be less than or equal to 45um, avoids the too thick whole thickness that increases sounding module 100 of first insulating layer 5. Here, only the first insulating layer 5 is taken as an example for description, and the insulating layer included in the sounding module 100 and disposed between two adjacent piezoelectric thin film layers can refer to the structure of the first insulating layer 5, which is not repeated herein.
In the embodiment provided in the present disclosure, only the example that the sounding module 100 includes four piezoelectric thin film layers, such as the first piezoelectric thin film layer 1, the second piezoelectric thin film layer 2, the third piezoelectric thin film layer 3, and the fourth piezoelectric thin film layer 4, is taken as an example for explanation, in other embodiments, the sounding module 100 may include less than four piezoelectric thin film layers or may include more than four piezoelectric thin film layers, which is not limited by the present disclosure.
As shown in fig. 11, the present disclosure further provides an electronic device 200, where the electronic device 200 may include a display panel 201, a main board 202, and the sound-generating module 100 described in any of the above embodiments, the sound-generating module 100 may be attached to the non-display side of the display panel 201, and the circuit board 7 may be electrically connected to the main board 202, so that when the sound-generating module 100 receives an electrical signal and vibrates, the display panel 201 may be driven to vibrate and generate sound, and a user may receive audio information. The electronic device 200 may include a mobile phone terminal, a tablet terminal, a wearable device, and the like, which is not limited by the present disclosure.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice in the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (11)

1. A sound production module, comprising:
the sounding module comprises a sounding module, a plurality of piezoelectric thin film layers and a plurality of sounding modules, wherein each piezoelectric thin film layer comprises a thin film main body and electrode lugs connected with the edge of the thin film main body;
the circuit board is connected with the electrode layers with the same polarity of the plurality of electrode bumps which are stacked.
2. The sound production module of claim 1, further comprising a first insulating layer bonded between the electrode layers of two adjacent film bodies with different polarities.
3. The acoustic module of claim 1, wherein at least one group of adjacent electrode layers of the multi-layer piezoelectric film layers are disposed in direct contact with each other, and the adjacent electrode layers have the same polarity; or, the sounding module further comprises a conductive layer, and the conductive layer is bonded between the electrode layers of which at least one group of adjacent film bodies in the multilayer piezoelectric film layer are of the same polarity.
4. The sound production module of claim 1, further comprising a second insulating layer bonded between the electrode layers of two adjacent electrode bumps with different polarities in the stacking direction of the film main body.
5. The voicing module of claim 4, wherein each piezoelectric film layer comprises a first electrode bump and a second electrode bump both connected to an edge of the film body, a plurality of first electrode bumps arranged in a stack, and a plurality of second electrode bumps arranged in a stack;
the circuit board comprises a positive electrode input end and a negative electrode input end, the positive electrode input end is connected with the positive electrode layers of the first electrode bumps, and the negative electrode input end is connected with the negative electrode layers of the second electrode bumps.
6. The sound generating module of claim 5, wherein the same piezoelectric film layer comprises the first electrode bump and the second electrode bump that extend out of the film body by the same length;
in a direction from the first side to the second side of the multi-layered film body, lengths of the plurality of first electrode bumps and the plurality of second electrode bumps protruding out of the corresponding film body are increased.
7. The acoustic module of claim 5, wherein the first electrode bumps and the second electrode bumps of the same piezoelectric film layer have different protruding lengths, and the protruding lengths of the first electrode bumps are gradually increased from the first side to the second side of the multilayer film body;
the protruding lengths of the plurality of second electrode bumps increase in a direction from the second side toward the first side of the multi-layer film body.
8. The sound generation module of claim 5, wherein the same piezoelectric film layer includes the first electrode bump and the second electrode bump connected to the same edge or different edges of the film body.
9. The acoustic module of claim 2, wherein the first insulating layer comprises a first adhesive layer, a metal layer and a second adhesive layer, which are stacked, the metal layer is bonded between the first adhesive layer and the second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively connected to different piezoelectric thin film layers;
or the first insulating layer comprises a third adhesive layer, and the upper surface and the lower surface of the third adhesive layer are respectively connected with different piezoelectric thin film layers.
10. The sound generating module of claim 2, wherein the thickness of the first insulating layer is greater than or equal to 15um and less than or equal to 45 um.
11. An electronic device, comprising:
a display panel;
the sound module of any of claims 1-10, attached to a non-display side of the display panel.
CN202110106218.5A 2021-01-26 2021-01-26 Sound production module and electronic equipment Pending CN114793316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110106218.5A CN114793316A (en) 2021-01-26 2021-01-26 Sound production module and electronic equipment

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Application Number Priority Date Filing Date Title
CN202110106218.5A CN114793316A (en) 2021-01-26 2021-01-26 Sound production module and electronic equipment

Publications (1)

Publication Number Publication Date
CN114793316A true CN114793316A (en) 2022-07-26

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Country Status (1)

Country Link
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