CN115022778A - Sound production module and electronic equipment - Google Patents
Sound production module and electronic equipment Download PDFInfo
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- CN115022778A CN115022778A CN202110240310.0A CN202110240310A CN115022778A CN 115022778 A CN115022778 A CN 115022778A CN 202110240310 A CN202110240310 A CN 202110240310A CN 115022778 A CN115022778 A CN 115022778A
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- piezoelectric
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Abstract
The disclosure relates to a sounding module and an electronic device. The sound production module includes: a plurality of piezoelectric substrates stacked in a first direction; the piezoelectric substrate comprises a plurality of conductive layers which are stacked along the first direction, and a layer of piezoelectric substrate is arranged between two adjacent conductive layers; the conductive layers arranged on the opposite surfaces of the same piezoelectric substrate are different in polarity, and the conductive layers between two adjacent piezoelectric substrates are the same in polarity.
Description
Technical Field
The disclosure relates to the technical field of terminals, in particular to a sounding module and electronic equipment.
Background
In order to enrich the use experience of the user, the display panel of part of the electronic equipment can vibrate and sound. In the related art, a piezoelectric material may be disposed on a non-display side of a display panel of an electronic device, and the display panel is driven to vibrate by vibration of the piezoelectric material to generate sound.
Disclosure of Invention
The present disclosure provides a sound module and an electronic device to solve the deficiencies in the related art.
According to a first aspect of the embodiments of the present disclosure, there is provided a sound module, including:
a plurality of piezoelectric substrates stacked in a first direction;
the piezoelectric substrate comprises a plurality of conductive layers which are stacked along the first direction, and a layer of piezoelectric substrate is arranged between two adjacent conductive layers;
the conductive layers arranged on the opposite surfaces of the same piezoelectric substrate are different in polarity, and the conductive layers between two adjacent piezoelectric substrates are the same in polarity.
Optionally, the multiple conductive layers include at least one conductive adhesive layer, and each conductive adhesive layer is bonded to a corresponding piezoelectric substrate.
Optionally, the multiple conductive layers include at least one inner conductive adhesive layer, each inner conductive adhesive layer is arranged between two adjacent piezoelectric base materials, and the inner conductive adhesive layers are respectively bonded with the two adjacent piezoelectric base materials.
Optionally, the multiple conductive layers include at least one outer layer of conductive glue adhered to an outer surface of the piezoelectric substrate located outside in the first direction.
Optionally, the multilayer conductive layer further includes at least one sputtering polar layer, and each sputtering polar layer is formed on the surface of the piezoelectric substrate by a sputtering process.
Optionally, each conductive layer includes a conductive body and first bumps connected to an edge of the conductive body, the first bumps are arranged side by side along a second direction, and the second direction is perpendicular to the first direction;
the sound production module still includes the circuit board, the circuit board includes positive terminal and negative pole end, the positive terminal is connected with the first lug electricity that is anodal polarity, the negative pole end is connected with the first lug that is negative polarity.
Optionally, a distance between the first bump having the positive polarity along the first direction and an edge of the corresponding conductive main body arranged along a third direction increases progressively, a distance between the first bump having the negative polarity along the first direction and an edge of the corresponding conductive main body arranged along the third direction increases progressively, and the third direction is perpendicular to the first direction and the second direction;
in the second direction, the plurality of first bumps with positive polarity are sequentially arranged, and the plurality of first bumps with negative polarity are sequentially arranged on the same side of the plurality of first bumps with positive polarity.
Optionally, each piezoelectric substrate includes a piezoelectric body and a second bump connected to an edge of the piezoelectric body, and each second bump and any first bump of the conductive layer connected to the piezoelectric substrate to which the second bump belongs are stacked.
Optionally, the inner conductive adhesive comprises a first adhesive layer, a metal layer and a second adhesive layer, the metal layer is bonded between the first adhesive layer and the second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively bonded with different piezoelectric substrates.
Optionally, the inner layer conductive adhesive includes a third adhesive layer, and the upper surface and the lower surface of the third adhesive layer are respectively bonded to different piezoelectric substrates.
Optionally, the piezoelectric substrate comprises a piezoelectric ceramic or a PVDF film.
According to a second aspect of an embodiment of the present disclosure, there is provided an electronic apparatus including:
display panel
As in any one of the above embodiments, the sound module is adhered to the non-display side of the display panel.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
known from above-mentioned embodiment, among the technical scheme of this disclosure, the conducting layer that sets up between the adjacent piezoelectricity substrate is the same polarity, for the technical scheme that sets up the conducting layer of different polarities between the adjacent piezoelectricity substrate among the correlation technique, need not to set up the insulating layer through the technical scheme of this disclosure and prevent the short circuit, is favorable to reducing the whole thickness of sound production module, optimizes the internal layout who disposes the electronic equipment of this sound production module.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic cross-sectional view of a sound module according to an exemplary embodiment.
Figure 2 is an exploded view of a sound module according to an exemplary embodiment.
Fig. 3 is a schematic arrangement diagram of first bumps of a sound module according to an exemplary embodiment.
Fig. 4 is a schematic structural diagram illustrating a first inner layer conductive adhesive according to an exemplary embodiment.
Fig. 5 is a schematic structural diagram of another first inner layer conductive adhesive according to an exemplary embodiment.
Figure 6 is a cross-sectional schematic view of another sound module shown in accordance with an exemplary embodiment.
FIG. 7 is a cross-sectional schematic diagram illustrating an electronic device in accordance with an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
Fig. 1 is a schematic cross-sectional view of a sound module 100 according to an exemplary embodiment. As shown in fig. 1, the sound module 100 may include a first piezoelectric substrate 1, a second piezoelectric substrate 2, a third piezoelectric substrate 3, and a fourth piezoelectric substrate 4, and the sound module 100 may further include a first outer conductive adhesive 5, a second outer conductive adhesive 9, a first inner conductive adhesive 6, a second inner conductive adhesive 7, and a third inner conductive adhesive 8. Wherein the first piezoelectric substrate 1, the second piezoelectric substrate 2, the third piezoelectric substrate 3, and the fourth piezoelectric substrate 4 are stacked in a first direction indicated by an arrow a in fig. 1; the first outer layer conductive adhesive 5, the second outer layer conductive adhesive 9, the first inner layer conductive adhesive 6, the second inner layer conductive adhesive 7 and the third inner layer conductive adhesive 8 are also stacked along a first direction indicated by an arrow a, where the first direction is a thickness direction of the sound module 100.
The first inner conductive adhesive 6 is disposed between the first piezoelectric substrate 1 and the second piezoelectric substrate 2 and is bonded to the surfaces of the first piezoelectric substrate 1 and the second piezoelectric substrate 2 perpendicular to the first direction, and similarly, the second inner conductive adhesive 7 is disposed between the second piezoelectric substrate 2 and the third piezoelectric substrate 3 and is bonded to the surfaces of the second piezoelectric substrate 2 and the third piezoelectric substrate 3 perpendicular to the first direction, and the third inner conductive adhesive 8 is disposed between the third piezoelectric substrate 3 and the fourth piezoelectric substrate 4 and is bonded to the surfaces of the third piezoelectric substrate 3 and the fourth piezoelectric substrate 4 perpendicular to the first direction. The first outer layer conductive paste 5 is bonded to the outer surface of the first piezoelectric substrate 1 located on the outer side in the first direction indicated by the arrow a, and the second outer layer conductive paste 9 is bonded to the outer surface of the fourth piezoelectric substrate 4 located on the outer side in the first direction indicated by the arrow a, the outer surfaces being perpendicular to the first direction.
The conductive layers arranged on the opposite surfaces of the same piezoelectric substrate are different in polarity, and the conductive layers between two adjacent piezoelectric substrates are the same in polarity. Based on this, assuming that the first outer layer conductive adhesive 5 is a conductive adhesive with a positive polarity, the first inner layer conductive adhesive 6 may be a conductive adhesive with a negative polarity, the second inner layer conductive adhesive 7 may be a conductive adhesive with a positive polarity, the third inner layer conductive adhesive 8 may be a conductive adhesive with a negative polarity, and the second outer layer conductive adhesive 9 may be a conductive adhesive with a positive polarity, so that one of two opposite sides of each piezoelectric substrate along the first direction a is a positive electrode, and the other is a negative electrode, thereby forming a potential. In the technical scheme of the disclosure, because the two adjacent piezoelectric base materials are bonded by the same inner conductive adhesive, on one hand, fixation can be realized, on the other hand, the two adjacent piezoelectric base materials can share the same polarity layer, which is beneficial to reducing the number of electrodes led out by the sounding module 100, and the electric conduction is realized through the inner layer conductive adhesive and the outer layer conductive adhesive, compared with the scheme that a polar layer is formed on the surface of the piezoelectric substrate through a sputtering process in the related technology, can simplify the production process, reduce the risk of breakdown of the piezoelectric substrate in the sputtering process, reduce the production cost, and because the conducting layer that sets up between two adjacent layers of piezoelectricity substrate is the same polarity, therefore for the technical scheme that sets up the conducting layer of different polarities between two adjacent layers of piezoelectricity substrate among the correlation technique, need not to set up the insulating layer, be favorable to reducing the thickness of sound production module 100, optimize the interior space overall arrangement of this sound production module 100's electronic equipment. In other embodiments, the first outer layer conductive adhesive 5, the second inner layer conductive adhesive 7, and the second outer layer conductive adhesive 9 may be of a negative polarity, and the first inner layer conductive adhesive 6 and the third inner layer conductive adhesive 8 may be of a positive polarity, which is not limited by the disclosure.
In order to realize the vibration of the sound module 100 when receiving the audio signal, as shown in fig. 2, the first outer layer conductive adhesive 5 may include a first outer layer conductive body 51 and a first bump 52, and the first bump 52 is connected to the edge of the first outer layer conductive body 51; the second outer conductive paste 9 may include a second outer conductive body 91 and a first bump 92, the first bump 92 being connected to an edge of the second outer conductive body 91; the first inner conductive paste 6 may include a first inner conductive body 61 and a first bump 62, the first bump 62 being connected to an edge of the first inner conductive body 61; the second inner conductive paste 7 may include a second inner conductive body 71 and a first bump 72, the first bump 72 being connected to an edge of the second inner conductive body 71; the third inner conductive paste 8 may include a third inner conductive body 81 and a first bump 82, and the first bump 82 is connected to an edge of the third inner conductive body 81.
The first bump 52 included in the first outer layer conductive adhesive 5, the first bump 72 included in the second inner layer conductive adhesive 7, and the first bump 92 included in the second outer layer conductive adhesive 9 are of positive polarity; the first bump 62 included in the first inner layer conductive adhesive 6 and the first bump 82 included in the third inner layer conductive adhesive 8 have negative polarities. The sound production module 100 may further include a circuit board 10, and the circuit board 10 may include a positive terminal (not shown) and a negative terminal (not shown), and the positive terminal may be electrically connected to the first bump 52 included in the first outer layer conductive adhesive 5, the first bump 72 included in the second inner layer conductive adhesive 7, and the first bump 92 included in the second outer layer conductive adhesive 9, respectively; the negative terminal may be electrically connected to the first bump 62 included in the first inner layer conductive adhesive 6 and the first bump 82 included in the third inner layer conductive adhesive 8, respectively, so as to implement a parallel arrangement between different piezoelectric substrates.
Further, as shown in fig. 2 and 3, the first outer conductive body 51, the second inner conductive body 71, and the second outer conductive body 91 may include an edge disposed along the second direction indicated by the arrow B and an edge disposed along the third direction indicated by the arrow C, respectively, the first bump 52 is connected to the edge of the first outer conductive body 51 disposed along the third direction indicated by the arrow B, the first bump 72 is connected to the edge of the second inner conductive body 71 disposed along the third direction indicated by the arrow B, the first bump 92 is connected to the edge of the second outer conductive body 91 disposed along the third direction indicated by the arrow B, and along the first direction a, a distance between the first bump 52 and the edge of the first outer conductive body 51 disposed along the third direction indicated by the arrow C, a distance between the first bump 72 and the edge of the second inner conductive body 71 disposed along the third direction indicated by the arrow C, a, The first bump 92 is spaced from the edge of the second outer conductive body 91 in the third direction indicated by the arrow C by an increasing distance, so that the first bump 52, the first bump 72, and the first bump 92 may be arranged side by side in the second direction B. The first direction, the second direction and the third direction are perpendicular to each other.
Similarly, the first inner conductive body 61 and the third inner conductive body 81 may include an edge disposed along the second direction indicated by the arrow B and an edge disposed along the third direction indicated by the arrow C, respectively, the first bump 62 is connected to the edge of the first inner conductive body 61 disposed along the third direction indicated by the arrow B, and the first bump 82 is connected to the edge of the third inner conductive body 81 disposed along the third direction indicated by the arrow B; and the spacing distance between the first bump 62 and the edge of the first inner layer conductive body 61 arranged along the third direction indicated by the arrow C and the spacing distance between the first bump 82 and the edge of the third inner layer conductive body 81 arranged along the third direction indicated by the arrow C are increased progressively, so that the first bump 62 and the first bump 82 can be arranged side by side along the second direction B.
In order to facilitate connection between the positive terminal and the negative terminal of the circuit board 10 and the first bump, as shown in fig. 3, in the second direction B, the first bump 52, the first bump 72, and the first bump 92 with positive polarity are sequentially arranged, and the first bump 62 and the first bump 82 with negative polarity are located on the same side of the first bump 52, the first bump 72, and the first bump 92, so that the positive bump is located on one side in the second direction B, and the negative bump is located on the other side in the second direction B, which facilitates connection of the circuit board 10, and facilitates automation of production line production. Of course, in other embodiments, the first bump 52, the first bump 72, the first bump 92, the first bump 62 and the first bump 82 may also be arranged with positive and negative electrodes at intervals, which is not limited in this disclosure.
Still as shown in fig. 2, the first piezoelectric substrate 1 may include a first piezoelectric body 11 and a second bump 12 connected to an edge of the first piezoelectric body 11, the second piezoelectric substrate 2 may include a second piezoelectric body 21 and a second bump 22 connected to an edge of the second piezoelectric body 21, the third piezoelectric substrate 3 may include a thirteenth piezoelectric body 31 and a second bump 32 connected to an edge of the third piezoelectric body 31, the fourth piezoelectric substrate 4 may include a fourth piezoelectric body 41 and a second bump 42 connected to an edge of the fourth piezoelectric body 41, the second bump 12 may be stacked with the first bump 52, the second bump 22 is stacked with the first bump 62, the second bump 32 is stacked with the first bump 72, the second bump 42 is stacked with the first bump 82, whereby, on the one hand, it is possible to ensure that one surface of the first bump is exposed to be electrically connected to the circuit board 10, on the other hand, based on the characteristics that the first bump is used as a support of a second bump arranged in a stacking mode with the first bump, and the flexibility of the conductive adhesive is larger than that of the polar layer formed by sputtering, the risk of electrode breakage can be reduced.
In the embodiments provided in the present disclosure, taking the example of forming one second bump on each piezoelectric substrate, the second bump and any first bump stacked in the conductive layer connected to the piezoelectric substrate to which the second bump belongs are described as an example, and the second bump may be stacked with the first bump of the conductive layer located above the piezoelectric substrate as shown in fig. 2, or stacked with the first bump of the conductive layer located below the piezoelectric substrate as shown in fig. 2.
Based on the technical scheme of the present disclosure, the structure of the conductive adhesive is described by taking the first inner layer conductive adhesive 6 as an example. As shown in fig. 4, in an embodiment, the first inner conductive adhesive 6 may include a first adhesive layer 63, a metal layer 64 and a second adhesive layer 65, the metal layer 64 is adhered between the first adhesive layer 63 and the second adhesive layer 65, the first adhesive layer 63 is adhered to the first piezoelectric substrate 1, and the second adhesive layer 65 is connected to the second piezoelectric substrate 2. Therefore, by disposing the metal layer 64 in the first inner conductive adhesive 6, the strength of the first inner conductive adhesive 6 can be improved, the deformation and the deformation of the first bump 62 can be reduced, and the risk of electrode fracture can be reduced. In another embodiment, as shown in fig. 5, the first inner layer conductive adhesive 6 may also include only a third adhesive layer, and the upper surface of the third adhesive layer is connected to the first piezoelectric substrate 1, and the lower surface is connected to the second piezoelectric substrate 2, so as to simplify the process. The structures of the first outer layer conductive adhesive 5, the second inner layer conductive adhesive 7, the third inner layer conductive adhesive 8 and the second outer layer conductive adhesive 9 can refer to the two embodiments of the first inner layer conductive adhesive 6, and the structures thereof can be the same as or different from the first inner layer conductive adhesive 6, and are not repeated here.
It should be noted that, in the embodiment provided in the present disclosure, the layout of the multilayer conductive adhesive is exemplarily described by taking the example that the sound module 100 includes four piezoelectric substrates, i.e., the first piezoelectric substrate 1, the second piezoelectric substrate 2, the third piezoelectric substrate 3 and the fourth piezoelectric substrate 4, actually, in other embodiments, the sound module 100 may also include two piezoelectric substrates, three piezoelectric substrates, or five or more piezoelectric substrates, and the specific structure may refer to the embodiment provided in the disclosure.
In the embodiments provided in the present disclosure, the connection and the conduction between each two adjacent piezoelectric substrates are realized by the inner layer conductive adhesive, and the outer layer conductive adhesive is disposed on the outer surface of the piezoelectric substrate located outside along the first direction. In fact, in other embodiments, as shown in fig. 6, taking the example that the sound-generating module 100 includes the first piezoelectric substrate 1, the second piezoelectric substrate 2, the third piezoelectric substrate 3 and the fourth piezoelectric substrate 4 which are stacked in the first direction as an example, the sound-generating module 100 may further include a first sputtering polarity layer 101, a second sputtering polarity layer 102, a third sputtering polarity layer 103, a fourth sputtering polarity layer 104, a fifth sputtering polarity layer 105, a sixth sputtering polarity layer 106, a seventh sputtering polarity layer 107 and an eighth sputtering polarity layer 108, wherein the first sputtering polarity layer 101 is formed on the upper surface of the first piezoelectric substrate 1 shown in fig. 6 by a sputtering process, the second sputtering polarity layer 102 is formed on the lower surface of the first piezoelectric substrate 1 shown in fig. 6 by a sputtering process, similarly, the third sputtering polarity layer 103 and the fourth sputtering polarity layer 104 are formed on a set of opposite surfaces of the second piezoelectric substrate 2, a fifth sputtered polar layer 105 and a sixth sputtered polar layer 106 are formed on a set of opposing surfaces of the third piezoelectric substrate 3, and a seventh sputtered polar layer 107 and an eighth sputtered polar layer 108 are formed on a set of opposing surfaces of the fourth piezoelectric substrate 4. The first sputtering polar layer 101, the fourth sputtering polar layer 104, the fifth sputtering polar layer 105 and the eighth sputtering polar layer 108 are in negative polarity; second sputtering polarity layer 102, third sputtering polarity layer 103, sixth sputtering polarity layer 106, and seventh sputtering polarity layer 107 are in a positive polarity. The sputtering polar layer may be formed by a sputtering process to form a piezoelectric substrate, and may be designed as needed, which is not limited by the present disclosure. As shown in fig. 6, the sputtered polar layers with the same polarity between two adjacent piezoelectric substrates may be directly contacted to conduct electricity, or in other embodiments, other conductive material layers may also be disposed between the sputtered polar layers with the same polarity between two adjacent piezoelectric substrates, which is not limited by the disclosure, and other structures such as the first bump of the sputtered polar layer in the embodiment of fig. 6 may refer to the first bump structure of the inner conductive adhesive and the outer conductive adhesive in the embodiment of fig. 1, and are not described in detail herein.
In the embodiment of fig. 1, the conductive layers of the sound module 100 are all conductive adhesives, and in the embodiment of fig. 6, the conductive layers of the sound module 100 are all sputtered polar layers. Actually, in other embodiments, the conductive layer of the sound module 100 may also include a conductive adhesive and a sputtered polar layer, the conductive adhesive may be adhered between two adjacent piezoelectric substrates, or may be adhered to the outer surface of the piezoelectric substrate located outside in the first direction, the sputtered polar layer may also be disposed between two adjacent piezoelectric substrates, or may be formed on the outer surface of the piezoelectric substrate located outside in the first direction, or the conductive adhesive and the sputtered polar layer having the same polarity may be disposed between two adjacent piezoelectric substrates, and the conductive adhesive and the sputtered polar layer are adhered, which may be specifically designed as needed to perform the arrangement of the conductive adhesive and the sputtered polar layer according to the principle that the polarities of a group of opposite surfaces of the same piezoelectric substrate are different, and the polarities of the conductive layers between the adjacent piezoelectric substrates are the same.
As shown in fig. 7, the present disclosure further provides an electronic device 200, where the electronic device 200 may include a display panel 201, a main board 202, and the sound-generating module 100 described in any of the above embodiments, the sound-generating module 100 may be attached to the non-display side of the display panel 201, and the circuit board 10 may be electrically connected to the main board 202, so that when the sound-generating module 100 receives an electrical signal and vibrates, the display panel 201 may be driven to vibrate and generate sound, and a user may receive audio information. The electronic device 200 may include a mobile phone terminal, a tablet terminal, a wearable device, and the like, which is not limited by the present disclosure.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. A sound generating module, comprising:
a plurality of piezoelectric substrates stacked in a first direction;
the piezoelectric substrate comprises a plurality of conductive layers which are stacked along the first direction, and a layer of piezoelectric substrate is arranged between two adjacent conductive layers;
the conductive layers arranged on the opposite surfaces of the same piezoelectric substrate are different in polarity, and the conductive layers between two adjacent piezoelectric substrates are the same in polarity.
2. The acoustic module of claim 1 wherein the plurality of conductive layers includes at least one conductive adhesive, each adhesive bonded to a corresponding piezoelectric substrate.
3. The acoustic module of claim 1, wherein the plurality of conductive layers includes at least one inner conductive layer, each inner conductive layer is disposed between two adjacent piezoelectric substrates, and the inner conductive layer is bonded to the two adjacent piezoelectric substrates respectively.
4. The acoustic module of claim 1 wherein the plurality of conductive layers includes at least one outer conductive adhesive bonded to an outer surface of the piezoelectric substrate that is outward in the first direction.
5. The acoustic module of claim 1, wherein the plurality of conductive layers further comprises at least one sputtered polar layer, each sputtered polar layer formed on the surface of the piezoelectric substrate by a sputtering process.
6. The sound production module of claim 1, wherein each conductive layer comprises a conductive body and first bumps connected to edges of the conductive body, the first bumps being arranged side by side along a second direction, the second direction being perpendicular to the first direction;
the sound production module still includes the circuit board, the circuit board includes positive terminal and negative pole end, the positive terminal is connected with the first lug electricity that is anodal polarity, the negative pole end is connected with the first lug that is negative polarity.
7. The sound generating module of claim 6, wherein the first protrusions with positive polarity along the first direction are increasingly spaced from the corresponding edge of the conductive body along a third direction, and the first protrusions with negative polarity along the first direction are increasingly spaced from the corresponding edge of the conductive body along the third direction, the third direction being perpendicular to the first direction and the second direction;
in the second direction, the plurality of first bumps with positive polarity are sequentially arranged, and the plurality of first bumps with negative polarity are sequentially arranged on the same side of the plurality of first bumps with positive polarity.
8. The acoustic module of claim 6 wherein each piezoelectric substrate includes a piezoelectric body and second bumps attached to edges of the piezoelectric body, each second bump being stacked with any first bump of the conductive layer attached to the piezoelectric substrate to which the second bump is attached.
9. The sound production module of claim 2, wherein the conductive adhesive comprises a first adhesive layer, a metal layer and a second adhesive layer, the metal layer is adhered between the first adhesive layer and the second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively adhered to different piezoelectric substrates.
10. The acoustic module of claim 2, wherein the conductive adhesive comprises a third adhesive layer, and the upper surface and the lower surface of the third adhesive layer are respectively bonded to different piezoelectric substrates.
11. The sound generation module of claim 1, wherein the piezoelectric substrate comprises a piezoelectric ceramic or a PVDF film.
12. An electronic device, comprising:
display panel
The sound module of any one of claims 1-11, adhered to a non-display side of the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110240310.0A CN115022778A (en) | 2021-03-04 | 2021-03-04 | Sound production module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110240310.0A CN115022778A (en) | 2021-03-04 | 2021-03-04 | Sound production module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115022778A true CN115022778A (en) | 2022-09-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110240310.0A Pending CN115022778A (en) | 2021-03-04 | 2021-03-04 | Sound production module and electronic equipment |
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|---|---|
| CN (1) | CN115022778A (en) |
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2021
- 2021-03-04 CN CN202110240310.0A patent/CN115022778A/en active Pending
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