JPH04130445U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPH04130445U JPH04130445U JP3560291U JP3560291U JPH04130445U JP H04130445 U JPH04130445 U JP H04130445U JP 3560291 U JP3560291 U JP 3560291U JP 3560291 U JP3560291 U JP 3560291U JP H04130445 U JPH04130445 U JP H04130445U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- resin
- view
- reinforcing member
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 6
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【構成】 リードフレーム２上にＩＣチップ１をダイボ
ンドし、ワイヤ３で結線したものをモールド樹脂４で封
止して成る樹脂封止型半導体装置に於いて、枠状の補強
部材５をパッケージ内に収める構成とする。
【効果】 装置外部からの応力に対する強度を増すこと
ができ、信頼性を大幅に向上させることができる。
(57) [Summary] [Structure] In a resin-sealed semiconductor device in which an IC chip 1 is die-bonded onto a lead frame 2, connected with wires 3, and sealed with mold resin 4, a frame-shaped The reinforcing member 5 is housed in a package. [Effect] Strength against stress from outside the device can be increased, and reliability can be greatly improved.
Description
【０００１】0001
本考案は、樹脂封止型の半導体装置に関するものである。 The present invention relates to a resin-sealed semiconductor device.
【０００２】0002
図５は従来の半導体装置の断面図であり、リードフレーム２上にＩＣチップ１ がダイボンドされ、チップの電極とリードフレームのインナーリードはワイヤ３ により結線されている。これをトランスファーモールド法により樹脂４によって 封止している。 FIG. 5 is a cross-sectional view of a conventional semiconductor device, in which an IC chip 1 is mounted on a lead frame 2. are die-bonded, and the electrodes of the chip and the inner leads of the lead frame are wire 3. are connected by. This is molded using resin 4 using the transfer molding method. It's sealed.
【０００３】0003
上記従来のパッケージ構造では、外部からの応力に対して弱く、パッケージの 厚みが薄くなると特に顕著となり、パッケージクラックに到ることがあった。ま た、特に信頼性を必要とされるＩＣカード用モジュールにおいては、実装後のカ ードを曲げることによりモジュール自体が割れることがあった。 The conventional package structure mentioned above is weak against external stress, and the package This problem becomes especially noticeable when the thickness becomes thinner, and may lead to package cracks. Ma In addition, especially for IC card modules that require reliability, The module itself could break due to bending the cord.
【０００４】0004
本考案においては、前述の問題を除去するため、枠状の補強部材をパッケージ 内に収める構成とした。 In this invention, in order to eliminate the above-mentioned problem, a frame-shaped reinforcing member is packaged. It was designed to fit inside.
【０００５】[0005]
枠状の補強部材をパッケージ内に収めることにより、パッケージに対する外部 からの応力に対しパッケージのソリが悪くなった。 By placing the frame-shaped reinforcing member inside the package, the external The package became warped due to stress from
【０００６】[0006]
以下、実施例に基づいて本考案を詳細に説明する。 Hereinafter, the present invention will be described in detail based on examples.
【０００７】 図１は本考案の一実施例の構成図であり、同図（ａ）は断面図、同図（ｂ）は 平面図である。ダイボンド及びワイヤボンドがされた後、パッケージ内に収まる 大きさの枠状補強部材５をチップ周辺にセットし、樹脂モールドを行ったもので ある。図に於いて、１はＩＣチップ。２はリードフレーム、３はボンディングワ イヤ、４はモールド樹脂である。この場合の補強部材５は絶縁物が使用されるが 、導電物を使用する場合は、絶縁物を介しセットするか、または、図２，図３に 示すように樹脂表面にセットされる。図４は、本考案の他の実施例であるＩＣカ ード用モジュールの断面図であり、１はＩＣチップ、３はボンディングワイヤ、 ４はモールド樹脂、５は枠状の補強部材、６はワイヤボンディング端子、７は基 板、８はＩＣカードコンタクト端子である。[0007] FIG. 1 is a block diagram of an embodiment of the present invention, in which (a) is a cross-sectional view, and (b) is a cross-sectional view. FIG. Fits inside the package after die bonding and wire bonding A frame-shaped reinforcing member 5 of the same size is set around the chip and resin molded. be. In the figure, 1 is an IC chip. 2 is the lead frame, 3 is the bonding wire 4 is mold resin. In this case, an insulating material is used as the reinforcing member 5. , When using a conductive material, set it through an insulating material or as shown in Figures 2 and 3. It is set on the resin surface as shown. FIG. 4 shows an IC card according to another embodiment of the present invention. 1 is a cross-sectional view of a module for a board, 1 is an IC chip, 3 is a bonding wire, 4 is a molded resin, 5 is a frame-shaped reinforcing member, 6 is a wire bonding terminal, and 7 is a base. Board 8 is an IC card contact terminal.
【０００８】[0008]
本考案により、装置外部からの応力に対し、強度が増し、信頼性を大幅に向上 することができた。 This invention increases the strength against stress from outside the device and significantly improves reliability. We were able to.
【図１】本考案の一実施例の構成図であり、（ａ）は断
面図、（ｂ）は平面図である。FIG. 1 is a configuration diagram of an embodiment of the present invention, in which (a) is a cross-sectional view and (b) is a plan view.
【図２】本考案の他の実施例の断面図である。FIG. 2 is a sectional view of another embodiment of the present invention.
【図３】本考案の他の実施例の断面図である。FIG. 3 is a sectional view of another embodiment of the present invention.
【図４】本考案の更に他の実施例の断面図である。FIG. 4 is a cross-sectional view of yet another embodiment of the present invention.
【図５】従来の半導体装置の断面図である。FIG. 5 is a cross-sectional view of a conventional semiconductor device.
１ ＩＣチップ ２ リードフレーム ３ ボンディングワイヤ ４ モールド樹脂 ５ 枠状の補強部材 ６ ワイヤボンディング端子 ７ 基板 ８ ＩＣカードコンタクト端子 1 IC chip 2 Lead frame 3 Bonding wire 4 Mold resin 5 Frame-shaped reinforcing member 6 Wire bonding terminal 7 Board 8 IC card contact terminal
Claims (1)
の補強部材をパッケージ内に収めたことを特徴とする半
導体装置。1. A resin-sealed semiconductor device, characterized in that a frame-shaped reinforcing member is housed within a package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3560291U JPH04130445U (en) | 1991-05-21 | 1991-05-21 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3560291U JPH04130445U (en) | 1991-05-21 | 1991-05-21 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04130445U true JPH04130445U (en) | 1992-11-30 |
Family
ID=31917718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3560291U Pending JPH04130445U (en) | 1991-05-21 | 1991-05-21 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04130445U (en) |
-
1991
- 1991-05-21 JP JP3560291U patent/JPH04130445U/en active Pending
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