JPH0412664Y2 - - Google Patents

Info

Publication number
JPH0412664Y2
JPH0412664Y2 JP1987132977U JP13297787U JPH0412664Y2 JP H0412664 Y2 JPH0412664 Y2 JP H0412664Y2 JP 1987132977 U JP1987132977 U JP 1987132977U JP 13297787 U JP13297787 U JP 13297787U JP H0412664 Y2 JPH0412664 Y2 JP H0412664Y2
Authority
JP
Japan
Prior art keywords
bent
main body
gap
plate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987132977U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6437019U (US06235095-20010522-C00021.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987132977U priority Critical patent/JPH0412664Y2/ja
Publication of JPS6437019U publication Critical patent/JPS6437019U/ja
Application granted granted Critical
Publication of JPH0412664Y2 publication Critical patent/JPH0412664Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Filters And Equalizers (AREA)
JP1987132977U 1987-08-31 1987-08-31 Expired JPH0412664Y2 (US06235095-20010522-C00021.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987132977U JPH0412664Y2 (US06235095-20010522-C00021.png) 1987-08-31 1987-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987132977U JPH0412664Y2 (US06235095-20010522-C00021.png) 1987-08-31 1987-08-31

Publications (2)

Publication Number Publication Date
JPS6437019U JPS6437019U (US06235095-20010522-C00021.png) 1989-03-06
JPH0412664Y2 true JPH0412664Y2 (US06235095-20010522-C00021.png) 1992-03-26

Family

ID=31390430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987132977U Expired JPH0412664Y2 (US06235095-20010522-C00021.png) 1987-08-31 1987-08-31

Country Status (1)

Country Link
JP (1) JPH0412664Y2 (US06235095-20010522-C00021.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037946U (US06235095-20010522-C00021.png) * 1989-06-05 1991-01-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037946U (US06235095-20010522-C00021.png) * 1989-06-05 1991-01-25

Also Published As

Publication number Publication date
JPS6437019U (US06235095-20010522-C00021.png) 1989-03-06

Similar Documents

Publication Publication Date Title
JPH0412664Y2 (US06235095-20010522-C00021.png)
JPS58148510A (ja) 印刷基板上に於けるリ−ド端子の形成方法
JP2527411Y2 (ja) 三端子電子部品
JP2000100836A (ja) 半導体チップの実装方法
JPH0617317Y2 (ja) 混成集積回路の接続構造
JPH0414914Y2 (US06235095-20010522-C00021.png)
JPH0443437B2 (US06235095-20010522-C00021.png)
JP2914577B2 (ja) 表面実装電子デバイスの製造方法
JPH0537529Y2 (US06235095-20010522-C00021.png)
JPS634690A (ja) 厚膜混成集積回路基板
JPH0579176B2 (US06235095-20010522-C00021.png)
JP2568788Y2 (ja) 表面実装型電子部品
JPS6236345Y2 (US06235095-20010522-C00021.png)
JPS60107817A (ja) チツプ型電子部品の実装構造
JPH0547442Y2 (US06235095-20010522-C00021.png)
JPH0273687A (ja) 表面実装部品の実装構造
JPH0621276U (ja) セラミックコンデンサの実装
JPH06216504A (ja) プリント配線板への端子の接続方法
JPH0356175U (US06235095-20010522-C00021.png)
JPH0369269U (US06235095-20010522-C00021.png)
JPH0414858A (ja) 電子部品のリード端子構造
JPH0577972U (ja) 電子部品の接続構造
JPH0641169U (ja) 表面実装部品の実装構造
JPH01187901A (ja) チップ形電子部品
JPS63237594A (ja) プリント板