JPH0412638B2 - - Google Patents

Info

Publication number
JPH0412638B2
JPH0412638B2 JP58085947A JP8594783A JPH0412638B2 JP H0412638 B2 JPH0412638 B2 JP H0412638B2 JP 58085947 A JP58085947 A JP 58085947A JP 8594783 A JP8594783 A JP 8594783A JP H0412638 B2 JPH0412638 B2 JP H0412638B2
Authority
JP
Japan
Prior art keywords
adhesive
copper foil
adhesive layer
weight
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58085947A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59213196A (ja
Inventor
Kenji Oosawa
Masami Ishii
Masayuki Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP58085947A priority Critical patent/JPS59213196A/ja
Publication of JPS59213196A publication Critical patent/JPS59213196A/ja
Publication of JPH0412638B2 publication Critical patent/JPH0412638B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58085947A 1983-05-18 1983-05-18 接着剤付き銅箔 Granted JPS59213196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58085947A JPS59213196A (ja) 1983-05-18 1983-05-18 接着剤付き銅箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58085947A JPS59213196A (ja) 1983-05-18 1983-05-18 接着剤付き銅箔

Publications (2)

Publication Number Publication Date
JPS59213196A JPS59213196A (ja) 1984-12-03
JPH0412638B2 true JPH0412638B2 (enrdf_load_html_response) 1992-03-05

Family

ID=13872953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58085947A Granted JPS59213196A (ja) 1983-05-18 1983-05-18 接着剤付き銅箔

Country Status (1)

Country Link
JP (1) JPS59213196A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259812B (en) * 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
JP3362804B2 (ja) * 1993-10-25 2003-01-07 日立化成工業株式会社 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103182A (en) * 1975-03-10 1976-09-11 Nippon Catalytic Chem Ind Dobarisekisobanno seizoho

Also Published As

Publication number Publication date
JPS59213196A (ja) 1984-12-03

Similar Documents

Publication Publication Date Title
JP2001196743A (ja) 接着フィルムを用いた多層プリント配線板の製造法
JP4691763B2 (ja) プリント配線板の製造方法
TW526694B (en) Multilayer flexible wired circuit board and producing method thereof
JP3251711B2 (ja) 印刷配線板および印刷配線板の製造方法
JP4286060B2 (ja) 絶縁層付き銅箔の製造方法
JP2000077850A (ja) 多層配線基板およびその製造方法
JPH0412638B2 (enrdf_load_html_response)
JP2001024323A (ja) 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法
JP2001352171A (ja) 接着シート、接着シートを用いた回路基板及びその製造方法
JP5299206B2 (ja) 回路基板の製造方法
JPH11204942A (ja) 多層配線板の製造方法
JP2004241427A (ja) 配線基板の製造方法
JP4076324B2 (ja) 電子部品実装用接着剤層を有する電子部品実装用フィルムキャリアテープの製造方法
JPH05857B2 (enrdf_load_html_response)
JP4200664B2 (ja) 積層基板およびその製造方法
JP3786616B2 (ja) 多層回路基板及びその製造方法
JPH09246720A (ja) 多層印刷配線板およびその製造方法
JP2002353597A (ja) 金属転写シート、その製造方法および配線回路基板
WO2003032701A1 (fr) Procede de fabrication d'une plaquette de circuit multicouche et plaquette de circuit multicouche obtenue par ce procede
JP4301152B2 (ja) バイアホール形成金属張積層板及びスルーホール形成アンクラッド板
JP2000294933A (ja) 多層回路基板及びその製造方法
JPH0728124B2 (ja) 両面回路基板の製造方法
JP3474911B2 (ja) 印刷配線板用素材、印刷配線板及びその製造方法
JP2001230550A (ja) 多層プリント配線板用回路基板の製造方法
JP2002344135A (ja) 配線板製造用絶縁層転写シート及びビルドアッププリント配線板及びその製造方法