JPH0412621B2 - - Google Patents

Info

Publication number
JPH0412621B2
JPH0412621B2 JP59055709A JP5570984A JPH0412621B2 JP H0412621 B2 JPH0412621 B2 JP H0412621B2 JP 59055709 A JP59055709 A JP 59055709A JP 5570984 A JP5570984 A JP 5570984A JP H0412621 B2 JPH0412621 B2 JP H0412621B2
Authority
JP
Japan
Prior art keywords
wire
ball
aluminum alloy
hardness
corrosion resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59055709A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60198851A (ja
Inventor
Masatoshi Tsucha
Masateru Suwa
Hitoshi Oonuki
Kazuo Taguchi
Tomio Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59055709A priority Critical patent/JPS60198851A/ja
Publication of JPS60198851A publication Critical patent/JPS60198851A/ja
Publication of JPH0412621B2 publication Critical patent/JPH0412621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59055709A 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ Granted JPS60198851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59055709A JPS60198851A (ja) 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59055709A JPS60198851A (ja) 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Publications (2)

Publication Number Publication Date
JPS60198851A JPS60198851A (ja) 1985-10-08
JPH0412621B2 true JPH0412621B2 (enrdf_load_stackoverflow) 1992-03-05

Family

ID=13006406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59055709A Granted JPS60198851A (ja) 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Country Status (1)

Country Link
JP (1) JPS60198851A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY187143A (en) 2010-01-20 2021-09-03 Semiconductor Energy Lab Semiconductor device
JP5680138B2 (ja) * 2013-05-15 2015-03-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812720A (ja) * 1982-06-16 1983-01-24 Mitsubishi Plastics Ind Ltd 金属管のライニング方法
JPS5961939A (ja) * 1982-09-30 1984-04-09 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095954A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095955A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095950A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Also Published As

Publication number Publication date
JPS60198851A (ja) 1985-10-08

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