JPS60198851A - 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ - Google Patents

半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Info

Publication number
JPS60198851A
JPS60198851A JP59055709A JP5570984A JPS60198851A JP S60198851 A JPS60198851 A JP S60198851A JP 59055709 A JP59055709 A JP 59055709A JP 5570984 A JP5570984 A JP 5570984A JP S60198851 A JPS60198851 A JP S60198851A
Authority
JP
Japan
Prior art keywords
wire
ball
aluminum alloy
hardness
alloy wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59055709A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412621B2 (enrdf_load_stackoverflow
Inventor
Masatoshi Tsuchiya
土屋　正利
Masateru Suwa
正輝 諏訪
Hitoshi Onuki
仁 大貫
Kazuo Taguchi
田口　和夫
Tomio Iizuka
飯塚　富雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59055709A priority Critical patent/JPS60198851A/ja
Publication of JPS60198851A publication Critical patent/JPS60198851A/ja
Publication of JPH0412621B2 publication Critical patent/JPH0412621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59055709A 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ Granted JPS60198851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59055709A JPS60198851A (ja) 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59055709A JPS60198851A (ja) 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Publications (2)

Publication Number Publication Date
JPS60198851A true JPS60198851A (ja) 1985-10-08
JPH0412621B2 JPH0412621B2 (enrdf_load_stackoverflow) 1992-03-05

Family

ID=13006406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59055709A Granted JPS60198851A (ja) 1984-03-23 1984-03-23 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ

Country Status (1)

Country Link
JP (1) JPS60198851A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014224283A (ja) * 2013-05-15 2014-12-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ
US10454475B2 (en) 2010-01-20 2019-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812720A (ja) * 1982-06-16 1983-01-24 Mitsubishi Plastics Ind Ltd 金属管のライニング方法
JPS5961939A (ja) * 1982-09-30 1984-04-09 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095955A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095950A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095954A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812720A (ja) * 1982-06-16 1983-01-24 Mitsubishi Plastics Ind Ltd 金属管のライニング方法
JPS5961939A (ja) * 1982-09-30 1984-04-09 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095955A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095950A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6095954A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10454475B2 (en) 2010-01-20 2019-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2014224283A (ja) * 2013-05-15 2014-12-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ

Also Published As

Publication number Publication date
JPH0412621B2 (enrdf_load_stackoverflow) 1992-03-05

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