JPH04119658A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To obtain a hybrid integrated circuit excellent in heat dissipating properties by a method wherein the hybrid integrated circuit is provided with a metal cap, a bridge is built on a circuit board, and the upper metal cap is jointed to the bridge concerned. CONSTITUTION:A board 3 is soldered to a heat dissipating plate 6 with solder or the like, and a heat releasing body 5 such as a transistor or the like is bonded onto the board 3. A bridge 2 of Cu small in thermal resistance is provided partially surrounding the heat releasing body 51, and the upper part of the bridge 2 is bonded to a metal cap 1 which covers all the hybrid integrated circuit with solder or the like. Leads 4 serving as signal input-output terminals for the outside are connected to the board 3. Heat released from the heat releasing body 5 is conducted to heat releasing fins 6 through the board 3 and also to the external metal cap 1 through the bridge 2. By this setup, heat induced inside a hybrid integrated circuit is dissipated from a heat releasing body to an upper metal cap, the hybrid integrated circuit can be improved in heat dissipating properties, so that a package can be miniaturized.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to the structure of hybrid integrated circuits.

[Conventional technology]

Figure 2 is a structural diagram showing a conventional hybrid integrated circuit. 'It is an enlarged cross-sectional view of the shaft portion.

In the figure, (8) is a substrate, (4) is a lead, (5) is a heating element, (6) is a radiation fin, and (γ) is a metal cap.

Next, the operation will be explained.

Most of the heat generated by the heating element (6) is radiated as a heat flow to the lower radiation fins (6) through the substrate (8) directly below the heating element (5) in the cross-sectional view shown in FIG.

[Problem to be solved by the invention]

Conventional hybrid integrated circuits are configured as described above.
In response to the recent demand for smaller packages, there has been a problem in that the heat generated internally cannot be sufficiently dissipated.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a hybrid integrated circuit with good heat dissipation characteristics.

[Means to solve the problem]

In the hybrid integrated circuit according to the present invention, the periphery of the heating element is covered with a bridge, and the upper part of the bridge is connected to a metal cap.

[Effect]

In the hybrid integrated circuit according to the present invention, heat generated by the internal heating element is also radiated to the metal cap through the bridge.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In Figure 1, (a) is an external view, (b) is an external view of the internal board (8) when the metal cap (1) is removed, and (C) is f
It is a sectional view seen from the A part of the X-Ga axis on Figure a1.

In the figure, (1) is a metal cap, (2) is a bridge* (
81Vi board, 14) is lead, (6) is heating element, C6
) are heat dissipation fins.

Next, the operation will be explained - A substrate (8) is fused onto the heat sink (6) by solder, etc., and a heating element (6), such as a transistor, is bonded onto the substrate (8). The area is surrounded by a bridge (2), for example, a small heat resistor, and the upper part of the bridge (2) is connected with a metal cap (1) that covers the entire hybrid integrated circuit with solder or the like. ing.

Further, the lead (4) is a terminal for inputting and outputting signals with the outside, and is connected to the board (8).

Now, the heat generated by the heating element (6) flows to the radiation fin (6) through the substrate (81), and from the substrate (3) to the bridge (2).
) is also dissipated to the external metal cap (1).

In addition, in the above embodiment, the bridge was constructed on the substrate, but
The structure may be configured on the heat dissipation fin or on the heating element and connected to the upper metal cap, and the same effect as in the above embodiment can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, the heat generated inside is radiated from the vicinity of the heating element to the upper metal cap, so that the heat radiation characteristics are improved and the pancage can be made smaller.

[Brief explanation of drawings]

FIG. 1 is an external view showing a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is an external view showing a conventional hybrid integrated circuit. In the figure (al is an external view, (b) is an external view of the internal circuit board, (
0] is an enlarged cross-sectional view taken from part A on the X-X' axis of the (al figure).
) is the board, (4) is the lead, (6) is the heating element, (6) is the radiation fin, and (7) is the metal cap. In addition, the same symbols in the figures indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1

Claims (1)

[Claims] 1. A hybrid integrated circuit using a metal cap, characterized in that a bridge is provided on a circuit board, and the upper metal cap and the bridge are connected.