JPH04114441A - Gang bonding tool - Google Patents

Abstract

PURPOSE:To make possible the positional control of a semiconductor chip with leads on a gang bonding tool by a method wherein the gang bonding tool is provided with pins to be engaged with the support ring part of the chip with leads, which is provided on the inside of a gang bonding tool main body and is sucked and sticked to a suction member having a suction port. CONSTITUTION:A semiconductor chip 15 with leads is sticked to a tool 30 after pins 35 and 36 are respectively fitted in holes 43 and 41. At this time, the pins 35 and 36 function as a guide member to the holes 43 and 41 and even in a case where the attitude of the chip 15 with leads on a metal mold is slant, the attitude of the chip 15 with leads is corrected and is made horizontal in a process of fitting the pins 35 and 36 in the holes 43 and 41. Even in a case where there is some positional deviation between the chip 15 and the tool 30, this positional deviation is corrected and the chip 15 is positioned to the center of the tool 30. Moreover, the pins 35 and 36 function as a positional control member and the chip 15 is subjected to positional control in the center of the tool 30.

Description

[Detailed Description of the Invention] [Summary] Regarding a gigantic bonding tool, the present invention is formed in a support ring portion that is a part of a tape carrier for the purpose of making it possible to control the position of a semiconductor chip with leads on the tool. In a gang bonding tool that sucks a leaded semiconductor chip with a semiconductor chip bonded to the inner lead part of the lead, transports it to a mounting position, and performs gang bonding on the outer lead part of the lead, the gang bonding tool body A suction member, which is disposed inside the semiconductor chip and has a suction port, is provided with a pin that engages with a support ring portion of the lead-attached semiconductor chip.

[Industrial application field]

The present invention relates to gang bonding tools.

As electronic devices become smaller, electronic components are being mounted more densely.

One method that enables high-density packaging is the tape carrier bonding method.

This method uses an apparatus having a schematic configuration shown in FIG.

1 is a mold, and 2 is a conveyance device for rotating the gang bonding tool 3. Reference numeral 4 denotes a separate absorption member, which is incorporated into the tool main body 3a.

The inner lead-bonded tape carrier 5 shown in FIGS. 8(A) and 8(B) is fed into the mold l as shown by arrow A.

In FIGS. 8(A) and 8(B), IO is a polyimide tape, 11 is a lead, 11a is an inner lead portion, and Ilb is an outer lead portion.

10a is a support ring part, and connecting parts tab at the four corners
The lead 11 is connected to the tape IO via the tape IO, has a rectangular frame shape, and is the peripheral part of the inner lead part 11a.
supports the central part of

A semiconductor chip 12 is bonded to each pad 13 on the upper surface and an inner lead portion 11a, and is sealed with a resin 14.

Note that FIG. 8(B) is a sectional view taken along the line ■B■B in FIG. 8(A).

Inside the mold 1, the outer lead portion 11b is formed along the line 15.
, and the connecting portion 10b are cut, and the outer lead portion 11b is bent into a crank shape as shown by the reference numeral 11b-1, as shown in FIG.

The semiconductor chip in this state is called a leaded semiconductor chip 15.

This leaded semiconductor chip 15 is mounted on a tape carrier 5.
(tape 10) and placed on the mold l.

Next, the conveying device 2 in FIG. 7 is operated to bring the tool 3 to position P, and the suction member 4 suctions the support ring portion 10a as shown in FIG. 8(D). The semiconductor chip 15 with leads is picked up by suction.

Subsequently, the semiconductor chip 1 with leads is transferred by the transport device 2.
5 is transported to the mounting position P2 in the direction of arrow B in FIG.

As shown in FIG. 8(D), a semiconductor chip with leads 1
5 or the butt 18 on which the solder plating 17 on the printed wiring board 16 is formed.

In this state, the tool 3 is pressed down, and the outer lead portion 2b is pressed onto the pad 18, as shown in FIG. 8(E), and heated by the pulsed current heating method.

As a result, the solder plating 17 on each pad 17 is simultaneously melted, and all the outer lead parts 11b are simultaneously soldered and connected to the corresponding pads 18, and the printed wiring board 1
Implemented on 6.

In the tape carrier bonding method described above, in order to perform mounting with high precision, it is important that the leaded semiconductor chip 15 is regulated in position by the tool 3 with high precision.

[Conventional technology]

FIGS. 9 and 10 show an example of a conventional gang bonding tool 20. FIG.

21 is the tool body.

Reference numeral 22 denotes a suction member, which is incorporated inside the tool body 21. 23 is a suction port.

In the tool 20, as shown in FIG. 10, the suction port 23 of the suction member 22 suctions the support ring portion 10a to suction the semiconductor chip 15 with leads.

If the semiconductor chip 15 is misaligned or slanted, gigantic bonding will not be performed normally, resulting in defective mounting.

SUMMARY OF THE INVENTION An object of the present invention is to provide a gigantic bonding tool that makes it possible to control the position of a leaded semiconductor chip on the tool.

[Problem to be solved by the invention]

Since the conventional tool 20 is configured to simply perform suction using the suction member 22, the tool 20 itself may be misaligned with respect to the mold l (see Fig. 7) during suction, and vibrations received during transportation may cause damage. In some cases, the leaded semiconductor chip 15 may be displaced from the center of the tool 20.

Further, in some cases, there is a possibility that the posture of the leaded semiconductor chip 15 may be slanted while being attracted to the tool 20.

In this way, on the tool 20, the semiconductor chip is attached to the inner lead part of the lead formed in the support ring part which is a part of the tape carrier. In a gigantic bonding tool that suctions and adsorbs a semiconductor chip with leads that have been bonded, transports it to a mounting position, and performs gigantic bonding to the outer lead portion of the lead, the component is disposed inside the gigantic bonding tool body, A suction member having a suction port is provided with a bottle that engages with the support ring portion of the lead-attached semiconductor chip.

According to the second aspect of the invention, a semiconductor chip with a lead, which is bonded to an inner lead portion of a lead formed on a support ring portion that is a part of a tape carrier, is suctioned and adsorbed, and is transported to a mounting position. , in a gigantic bonding tool that performs gigantic bonding on the outer lead portion of the lead, wherein one of the leaded semiconductor chips is suctioned and adsorbed by a suction member that is disposed inside the gigantic bonding tool body and has a suction port. A bottle is provided that pierces the support ring portion.

[Effect]

The bin according to the first and second aspects of the present invention regulates the position of the leaded semiconductor chip with respect to the gigantic bonding tool.

The bottle of claim 2 eliminates the need for positioning holes or the like in the tape carrier.

[Embodiment] FIG. 1 shows the tip side of a gigantic bonding tool 30 according to an embodiment of the present invention, looking up from below.

Reference numeral 31 denotes a tool body, which has a substantially rectangular frame shape.

32 is a suction member, which is incorporated into the center of the tool body 31.

33 is a suction port.

34 is a rectangular frame-shaped end surface around the suction port 33, and has the same dimensions and shape as the support ring portion 10a.

Reference numerals 35 and 36 indicate bottles which are essential parts of the present invention, and corner portions 38 and 39 on the - diagonal line 37 of the end face 34 of the rectangular frame.
It is planted in.

FIG. 2 shows a tape carrier 4o that can be applied to the gigantic bonding tool 30 of FIG.

In the figure, parts corresponding to those shown in FIG. 8 are designated by the same reference numerals, and their explanations will be omitted.

41 to 44 are positioning holes, and support ring portion 1
They are formed at each corner portion 10a-1 to 10a4 of 0a.

These corner parts 10a-1 to 1oa-4 are lead 11
This is the part where the positioning holes 41 to 4 are not formed.
4 can be formed without any problem.

A semiconductor chip 15 with leads placed on a mold (indicated by reference numeral 1 in FIG. 7) has holes 33 and 31 connected to pins 3, respectively.
5.36 and is attracted to the tool 3.

At this time, the pins 35 and 36 perform two functions, which will be explained below.

■ In the adsorption process, as shown in Figure 3, hole 3
3.31, and even if the posture of the leaded semiconductor chip 15 on the mold is tilted, the leads will be removed in the process of fitting into the holes 33.31 and the pins 35.36, respectively. The posture of the attached semiconductor chip 15 is corrected to make it horizontal.

Further, even if there is a slight positional deviation between the leaded semiconductor chip 15 and the tool 30, this positional deviation is corrected and the leaded semiconductor chip 15 is moved to the tool 30.
Position at the center of 0.

■ In the state where suction is completed, as shown in FIG. 4, it functions as a position regulating member, and even if vibration or shock is applied to the tool 30, the position of the leaded semiconductor chip 15 will not be caused. This prevents the semiconductor chip 15 with leads from being placed in the center of the tool 30.

For this reason, the leaded semiconductor chip 15 is attached to the tool 30.
It is held in a horizontal position at the center of the board and carried to the mounting position on the printed wiring board.

In this state, the tool 30 is pressed down and the outer lead portions 11b-, are bonded with the tool and are normally mounted.

FIG. 5 shows a gigantic bonding tool 50 according to another embodiment of the present invention. In the figure, parts corresponding to those shown in FIG. 1 are denoted by the same reference numerals, and their explanations will be omitted.

Reference numerals 51 and 52 designate needle-shaped pins with sharp tips, which are provided in place of the positioning pins 35 and 36 in FIG.

As shown in FIG.
a, and functions as an anchor member to position the leaded semiconductor chip 15 at the center of the tool 50.

In this embodiment as well, even if the leaded semiconductor chip 15 is subjected to vibration during the process of being carried to the mounting position after suction,
is positioned at the center of the tool 50 without causing any displacement with respect to the tool 50, and is normally mounted.

〔Effect of the invention〕

As explained above, according to the claimed invention, it is possible to control the position of the leaded semiconductor chip on the gigantic bonding tool, and even if vibration or impact is applied after adsorption, the leaded semiconductor chip will not be damaged. Misalignment can be prevented, and suction errors due to variations in the IC sealing resin can be reduced. Therefore, it is possible to normally perform gigantic bonding at the mounting position.

According to the invention of claim 2, even if the tape carrier of the leaded semiconductor chip is not specially formed with positioning holes, the position of the leaded semiconductor chip with respect to the gigantic bonding tool can be controlled. I can do it.

[Brief explanation of drawings]

Fig. 1 is a diagram showing an embodiment of the gigantic bonding tool of the present invention, Fig. 2 is a diagram showing a vine tape carrier applied to the gigantic bonding tool of Fig. 1, and Fig. 3 is a diagram showing a leaded semiconductor chip. FIG. 4 is a diagram showing the state of the suction process, FIG. 4 is a diagram showing the completion state of suction of the leaded semiconductor chip (position regulation state), FIG. 5 is a diagram showing another embodiment of the gigantic bonding tool of the present invention, Figure 6 is a diagram showing how the leaded semiconductor chip is regulated in the tool shown in Figure 5, Figure 7 is a schematic configuration diagram of a device that implements the tape carrier bonding method, and Figure 8 is an explanation of the tape carrier bonding method. FIG. 9 is a diagram showing an example of a conventional gigantic bonding tool, and FIG. 1O is a diagram showing how the tool in FIG. 9 is used. In the figure, 1 is a mold, 2 is a transport device, 10 is a tape, 10a is a support ring part, 10b is a connecting part, II is a lead, 11a is an inner lead part, 11b is an outer lead part, 12 is a semiconductor chip, 15 30.50 is a semiconductor chip with leads, 30.50 is a gigantic bonding tool, 31 is a tool body, 32 is a suction member, 33 is a suction port, 34 is an end surface of a rectangular frame, 35.36 is a bottle, 37 is a diagonal, 38.39 is a corner 40 is a tape carrier, 41 to 44 are positioning holes, and 51 and 52 are needle-shaped bottles.

Claims (2)

[Claims] (1) A leaded semiconductor chip in which a semiconductor chip (12) is bonded to an inner lead part (11a) of a lead (11) formed in a support ring part (10a) that is a part of a tape carrier (40). (15) is arranged inside the gang bonding tool main body (31) in a gang bonding tool for sucking and transporting the lead to the mounting position (P_2) and gang bonding the outer lead part (11b) of the lead. A pin (35) that engages with the support ring portion (10a) of the leaded semiconductor chip (15) that is suctioned and suctioned by a suction member (32) having a suction port (33).
, 36). (2) A leaded semiconductor chip in which the semiconductor chip (12) is bonded to the inner lead part (11a) of the lead (11) formed in the support ring part (10a) which is a part of the tape carrier (40). (15) is arranged inside the gang bonding tool main body (31) in a gang bonding tool for sucking and transporting the lead to the mounting position (P_2) and gang bonding the outer lead part (11b) of the lead. A pin (5) that pierces the support ring portion (10a) of the leaded semiconductor chip (15) that is suctioned into the suction member (32) having the suction port (33).
1, 52)).