JPH039950B2 - - Google Patents
Info
- Publication number
- JPH039950B2 JPH039950B2 JP60028222A JP2822285A JPH039950B2 JP H039950 B2 JPH039950 B2 JP H039950B2 JP 60028222 A JP60028222 A JP 60028222A JP 2822285 A JP2822285 A JP 2822285A JP H039950 B2 JPH039950 B2 JP H039950B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- epoxy resin
- epoxy
- adhesives
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 60
- 230000001070 adhesive effect Effects 0.000 claims description 60
- 239000000203 mixture Substances 0.000 claims description 36
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 229930185605 Bisphenol Natural products 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 3
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000004831 Hot glue Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920006332 epoxy adhesive Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 125000000466 oxiranyl group Chemical group 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- -1 alkyl phenol Chemical compound 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- HVJCQQVEQFABIA-UHFFFAOYSA-M benzyl(trimethyl)phosphanium;iodide Chemical compound [I-].C[P+](C)(C)CC1=CC=CC=C1 HVJCQQVEQFABIA-UHFFFAOYSA-M 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2822285A JPS61188478A (ja) | 1985-02-18 | 1985-02-18 | 接着剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2822285A JPS61188478A (ja) | 1985-02-18 | 1985-02-18 | 接着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61188478A JPS61188478A (ja) | 1986-08-22 |
| JPH039950B2 true JPH039950B2 (zh) | 1991-02-12 |
Family
ID=12242585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2822285A Granted JPS61188478A (ja) | 1985-02-18 | 1985-02-18 | 接着剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188478A (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912179A (en) * | 1988-03-30 | 1990-03-27 | Toa Nenryo Kogyo Kabushiki Kaisha | Bisphenol A epoxy resin mixtures with aromatic di-secondary amine |
| DE3827626A1 (de) * | 1988-08-10 | 1990-03-08 | Teroson Gmbh | Reaktiver schmelzklebstoff |
| JPH0823691B2 (ja) * | 1989-02-24 | 1996-03-06 | 日本合成化学工業株式会社 | 感光性樹脂組成物 |
| WO2014054631A1 (ja) * | 2012-10-02 | 2014-04-10 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
| US10066135B2 (en) | 2012-12-28 | 2018-09-04 | Dai Nippon Printing Co., Ltd. | Adhesive composition and adhesive sheet using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5936126A (ja) * | 1982-08-24 | 1984-02-28 | Mitsubishi Electric Corp | 樹脂組成物 |
| JPS59108072A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | 常温粘着性を有する熱硬化性接着シ−ト |
-
1985
- 1985-02-18 JP JP2822285A patent/JPS61188478A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5936126A (ja) * | 1982-08-24 | 1984-02-28 | Mitsubishi Electric Corp | 樹脂組成物 |
| JPS59108072A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | 常温粘着性を有する熱硬化性接着シ−ト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61188478A (ja) | 1986-08-22 |
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