JPH0398023A - Matrix type display device - Google Patents

Abstract

PURPOSE:To correct plural wire disconnection defects by coupling connection lines at both end parts, leading the couples of connection lines out of a display electrode substrate respectively, and connecting them mutually. CONSTITUTION:If there is a wire disconnection part 5 formed in source bus wiring 1b, the defective source bus wiring 1b and auxiliary wiring 12 are connected at an intersection part 5a by laser light irradiation, etc., and the defective source bus wiring 1b and auxiliary wiring 13 are connected similarly at an intersection part 5b. Then the auxiliary wiring 12 and a connection line 21 are connected by laser light irradiation and the auxiliary wiring 13 and a connection wire 31 are connected similarly. Further, two connection conductors connected to the connection line 21 and connection line 31 are connected electrically. Thus, electric connections are made at five places to connect the parts on both sides of the wire disconnection part 5 of the defective source bus wiring 1b electrically through the connection wiring on a circuit board. Consequently, the wire disconnection defects generated in one block is corrected up to three places.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a matrix type display device having a function of correcting disconnection of bus wiring.

(Prior Art) Matrix-type display devices using liquid crystals, EL light emitters, plasma light emitters, etc. are attracting attention as image display devices that can replace CRTs. Among these, liquid crystal display devices are widely used in portable televisions, word processors, personal computers, and the like. Display devices used in these applications are desired to be more precise and larger.

In order to display fine images using a matrix type display device, it is necessary to make the size of the picture elements constituting the matrix very small and to use a very large number of picture elements. As the number of picture elements increases, the number of bus lines that function as scanning lines and signal lines also increases. As the number of bus wiring increases, line-visit failures are more likely to occur. Moreover, as display devices become larger, the length of bus wiring becomes longer, making it increasingly difficult to manufacture bus wiring without disconnection defects.

(Problems to be Solved by the Invention) A matrix type display device having a function of correcting disconnection defects in bus wiring is disclosed in Japanese Patent Application No. 1-157956. FIG. 2A shows an example of a display electrode substrate having such a disconnection correction function.

Orthogonally to a large number of gate bus lines 2 parallel to one direction,
A large number of source bus lines 1 are provided in parallel. The source bus wiring 1 consists of two sets of source bus wiring 1a and lb, and the source bus wiring 1a and 1b are connected to different driver ICs, respectively. The gate bus wiring 2 and the source bus wiring 1 intersect with each other with an insulating film interposed therebetween in a non-conducting state.

In each rectangular area surrounded by the cell wiring 2 and the source bus wiring 11, there is a thin film transistor (TFT) which functions as a picture element electrode and a switching element.
istor), but their description is omitted in FIG. 2A for the sake of simplicity.

A preliminary wiring 3a is provided at both ends of the source bus wiring 1.
and 3b intersect with each other via an insulating film.

The preliminary wirings 3a and 3b do not intersect with the gate bus wiring 2, but are connected to wiring outside the substrate.

Liquid crystal is sealed between this substrate and a counter substrate provided with a counter electrode, thereby configuring a matrix type liquid crystal display device.

FIG. 2B shows a plan view of an example of a driver film connected to the substrate of FIG. 2A. A driver IC 8 is provided on the driver film 7, and a source path wiring 9 connected to the source bus wiring 1a is provided from the driver IC 8. In parallel to the source bus wiring 9, do you plan on the film? An R wiring 1o is provided. One end 10a of the on-film preliminary wiring 10 is connected to the end 4a of the preliminary wiring 3a on the active matrix substrate. The other end 10b of the on-film preliminary wiring 10 is connected to a connection wiring led on a circuit board (not shown).

Another set of source bus wiring 1b and auxiliary wiring 3b on the board in FIG. 2A are connected to source bus wiring on another driver film and on-film auxiliary wiring similar to those shown in FIG. 2B, respectively. There is. The preliminary wiring on the film to which the preliminary wiring 113b is connected is further connected to the connection wiring led on the circuit board. On the above circuit board, two connection wires connected to the two preliminary wires 3a and 3b are arranged so that they can be connected to each other later.

A method of correcting a disconnection defect occurring in the source bus wiring 1 of the display electrode substrate will be described below. If a disconnection 5 occurs in the source bus wiring 1b as shown in FIG. 2A,
The defective source bus wiring 1b and the spare wiring 3a intersect at the intersection 5.
Connected at a.

This connection is performed by irradiating the intersection 5a with optical energy such as a laser beam. Similarly, the defective source bus wiring 1b and the spare wiring 3b are connected at the intersection 5b. Furthermore, on the aforementioned circuit board, two connection wires connected to the preliminary wires 3a and 3b are electrically connected. By making electrical connections in three places in this way,
Portions on both sides of the disconnection portion 5 of the defective source bus wiring 1b are electrically connected via connection wiring on the circuit board.

If the correction is performed in this manner, the disconnection defective portion can be corrected without substantially increasing the load capacity and electrical resistance of the defective source bus wiring after correction. Therefore, due to this correction, the driver IC 8 will not have insufficient capacity, and no signal delay will occur on the defective source bus wiring lb.

However, in the board of FIG. 2A, if two or more disconnections occur, it is not possible to repair all the disconnections. If source bus wiring 1 and spare wiring 1a and lb are connected at two places, a signal input to one of these source bus wirings will also be input to the other source bus wiring, and these source bus wirings will be connected to the original source bus wiring. become unable to perform functions.

FIG. 3 shows a plan view of an example of a board capable of repairing two or more disconnections. In this board, the source bus wiring l is divided into two blocks.

The other block is cut out from the source bus wiring 1a and 1b,
The other block consists of source bus lines 1c and 1d. Each source bus wiring 1aS lb, IC, and ld is connected to a driver IC on a different driver film. Preparatory wiring lines 3a and 3b intersect at both ends of the blocks of source bus wiring lines 1a and 1b, respectively, with an insulating film interposed therebetween. Similarly, source path wiring 1c
Preliminary wiring 3 is provided at both ends of the block 1d and 1d.
C and 3d intersect with each other via an insulating film.

In one block consisting of the source bus wiring 1a and It), in addition to one end 4a of the preliminary wiring 3a, the other end 4c is also used for connection led onto the circuit board via the preliminary wiring 11 on the film. connected to wiring. Similarly, in addition to one end 4b of the preliminary wiring 3b, the other end 4C is also connected to the connection wiring led onto the circuit board via the preliminary wiring on the film. On the circuit board, a connection wire connected to the end 4a and a connection wire connected to the end 4d are arranged so as to be connectable to each other. Similarly, the connection wiring connected to the end 4b and the connection wiring connected to the end 4c are arranged so as to be connectable to each other. Similarly, in the other block, both ends of each of the preliminary wirings 3C and 3d are arranged so as to be connectable to each other by connection wiring led onto the circuit board via the preliminary wiring on the film. ing.

In the board shown in FIG. 3, in addition to the disconnection 5, it is also possible to repair another disconnection 15 that occurs within the same block. To correct the disconnections 5 and 15, first, the defective source bus wiring 1b causing the disconnection 5 and the spare wiring 3a and 3b are
They are connected at intersections 5a and 5b, respectively. Similarly, the defective source bus wiring 1a having the disconnected portion 15 and the spare wirings 3a and 3b are connected at the intersections 15a and 15b, respectively. Next, the intersection 5a on the preliminary wiring 3a. ! :15a, the preliminary wiring 3a is cut, for example, at a point shown at 6a. Similarly, at the point 6b between the intersections 5b and 15b on the preliminary wiring 3b, the preliminary wiring 3b
is disconnected. Furthermore, the connection wiring connected to the end 4a and the connection wiring connected to the end 4d on the circuit board described above are connected.

Similarly, the connection wiring connected to the end 4b and the end 4C
The connection wiring connected to is connected.

In this way, in the circuit board of FIG. 3, two disconnections per block can be corrected. The maximum number of disconnections that can be corrected in this entire board is four. However, if three disconnections occur in the l block, the circuit board shown in FIG. 3 cannot completely correct the problem. As described above, in the board shown in FIG. 3, depending on the position where the disconnection defects occur, it may not be possible to correct the maximum number of disconnection defects.

The present invention solves these problems, and an object of the present invention is to provide a matrix type display device that can correct a plurality of disconnection defects and is less restricted by the position where they occur. It is.

(Means for Solving the Problems) A matrix type display device of the present invention includes picture element electrodes arranged in a matrix, and scanning lines arranged vertically and horizontally in rows in one direction between the picture element electrodes. A matrix type display device including a display electrode substrate having a line and a signal line, the scanning line and the signal line having an insulating film and an insulating film at each end of at least one of the lines. and a plurality of connection lines that intersect with the plurality of preliminary wirings via an insulating film, and each of the plurality of connection lines forms a pair between the two ends. However, each of the pair of connection lines is drawn out of the display electrode substrate and arranged so as to be connectable to each other, thereby achieving the above object.

(Function) In the matrix type display device of the present invention, disconnection defects occurring in bus wiring such as scanning lines and signal lines are corrected using spare wiring and connection lines. This modification is performed as follows. First, a defective bus wiring having a disconnected portion and two spare wirings crossing both ends of the defective bus wiring are connected. This connection is made by irradiating optical energy such as laser light to the intersection of the defective bus wiring and the spare wiring. Further, each of the spare wirings connected to the defective bus wiring and the connection lines that intersect with each of the spare wirings are connected by irradiation with laser light or the like. Finally, the parts that are pulled out from each connection line and arranged so that they can be connected are electrically connected. In this way, a disconnection defect at one location is corrected.

According to the present invention, multiple disconnections occurring in different bus wirings can be corrected. In that case, both ends of each defective bus wiring in which a disconnection occurs are connected to one of the spare wirings. Next, if two or more defective bus lines are connected to the same spare line, the spare line is cut between the parts to which these defective bus lines are connected. Next, each of the cut portions of the preliminary wiring is electrically connected to a connection line that intersects the portion. in this way,
When repairing a plurality of disconnections, it is necessary that one or more connection lines intersect each disconnected portion of the spare wiring. Further, the portions drawn out from the connecting wires connected to the respective preliminary wiring portions and disposed so as to be connectable are electrically connected. As a result, the portions on both sides of the disconnected portion of the defective bus wiring are electrically connected via the spare wiring and the connection line.

In the present invention, the maximum number of disconnection defects that can be corrected is less than or equal to the number of pairs of connecting wires. This maximum number depends on the number of spare wiring lines, the number of pairs of connection lines, etc. Furthermore, whether or not all of the plurality of disconnections can be corrected depends on the positions where these disconnections occur and the positions where the connection lines are provided.

(Example) The invention will now be described with reference to examples.

FIG. 1 shows a schematic plan view of an example of a display electrode substrate used in a matrix type display device of the present invention.

An insulating film is formed over the entire surface of a large number of parallel gate bus lines 2, and a large number of parallel source bus lines 1 are provided on the insulating film so as to intersect with the gate bus lines 2. In this embodiment, the source bus wiring 1 is divided into two blocks. One block is source bus wiring 1a and Ib.
The other block consists of source bus wiring lc and 1d. Each source bus wiring 1a, lb, Ic and 1d is guided on a different driver film,
Connected to a different driver ■c. Below one end of the source bus line 1, spare lines 1l and 12 intersect with each other with the insulating film interposed therebetween.

Similarly, below the other end of the source bus line l, preliminary lines 13 and 14 intersect with each other with an insulating film interposed therebetween.

These preliminary wirings 11, 12, 13, and l4 are provided in parallel with the gate bus wiring 2, and are formed at the same time as the gate bus wiring 2. Two connection lines 22, 23 and 24 cross over the preliminary wirings 11 and 12 with the insulating film interposed therebetween. Similarly, connection lines 31, 32, 33, and 34 cross over the preliminary wirings 13 and 14 via the insulating film.

The connection lines 21 to 24 and the connection lines 31 to 34 are formed simultaneously with the source bus wiring 1. In this embodiment, the connection lines 21 to
24 is not connected to the preliminary wirings 1l and 12.

Similarly, the connection lines 31 to 34 are not connected to the preliminary wirings l3 and 14.

Each rectangular area surrounded by the gate bus wiring 2 and the ground bus wiring 1 is provided with a TPT which functions as a picture element electrode and a switching element, but their description is omitted in FIG. 1 for simplicity. . A liquid crystal is sealed between this substrate and a counter substrate having four opposing poles, thereby forming a matrix type liquid crystal display device.

The connection lines 21 and 22 and the source bus line 1a are led on the same driver film (not shown), and the connection line 2
1 and 22 are connected to connection wiring led on the circuit board. Similarly, the connection lines 31 and 32 and the source bus wiring 1b are led on the same driver film (not shown), and the connection lines 3l and 32 are connected to connection wiring led on the circuit board. There is. The connection wires connected to the connection lines 21 and 22 are arranged so as to be connectable to the connection wires connected to the connection lines 31 and 32, respectively, on the circuit board.

Similarly, connection lines 23 and 24 and connection lines 33 and 3
4 are led onto the circuit board via driver films (not shown) to which source bus lines 1c and 1d are connected, respectively. The connection wires connected to the connection lines 23 and 24 are arranged so as to be connectable to the connection wires connected to the connection lines 33 and 34, respectively.

In this embodiment, an example of a correction method when a disconnection failure occurs in one source bus wiring lI7) is shown below. 1st
As shown in the figure, if a disconnection 5 occurs in the source bus wiring 1b, the defective source bus wiring 1b and the spare wiring l2
are connected at the intersection 5a by laser beam irradiation or the like. Similarly, the defective source bus wiring 1b and the spare wiring 13 are connected at the intersection 5b. Next, the preliminary wiring 12
and the connection line 21 are connected by laser beam irradiation. Similarly, the preliminary wiring 13 and the connection line 31 are connected.

Further, on the circuit board mentioned above, the connection line 2l and the connection line 3
The two connection wirings connected to l are electrically connected. By making electrical connections at five locations in this manner, the portions on both sides of the disconnection portion 5 of the defective source bus wiring 1b are electrically connected via the connection wiring on the circuit board.

In this embodiment, up to three disconnection defects occurring in one block can be corrected. Let us take as an example a case where disconnections occur at three locations in blocks of source path wirings 1a and ib. If, in addition to the above-mentioned broken line 5, there are broken lines 15 and 25 as shown in FIG. 1, the broken line 5 is first corrected in the same manner as described above. Similarly, the defective source bus wiring 1a and the spare wiring 12 that have caused the disconnection part 15 are
Connection is made at the intersection 15a by laser beam irradiation. Similarly, the defective source bus wiring 1a and the spare wiring 13 are connected at the intersection 15b. Next, after the preliminary wirings 12 and 13 and the connection lines 22 and 32 are connected by laser beam irradiation, the two lines connected to the connection lines 22 and 32 are placed on the aforementioned circuit board. The connection wiring is electrically connected. Furthermore, at the positions shown in 6a and 6b, there are preliminary arrangements, respectively! ! iI12 and 13 are cut by laser beam irradiation.

Next, the defective source bus wiring 1a that has caused the disconnection part 25.
and the preliminary wiring 1l are connected at the intersection 25a.

Similarly, the defective source bus wiring 1a and the spare wiring 14 are
It is connected at the intersection 25b. Next, the preliminary wirings 1l and 14 and the connection lines 23 and 33 are connected by laser beam irradiation, respectively. Furthermore, two connection wirings connected to the connection line 23 and connection line 33 are connected on the aforementioned circuit board.

As described above, the portions on both sides of the disconnection portion 5 of the defective source bus wiring 1b are electrically connected by the preliminary wiring 12, the connection line 21, the connection line 31, and the preliminary wiring 13. Similarly,
The parts on both sides of the disconnection part 15 of the defective source bus wiring 1a are as follows:
Preliminary wiring 12, connection line 22, connection line 32 and preliminary wiring l
electrically connected by 3. Furthermore, the portions on both sides of the disconnected portion 25 of the defective bus wiring 1a are connected to the preliminary wiring 11,
They are electrically connected by the connection line 23, the connection line 33, and the preliminary wiring 14.

In this embodiment, in addition to the three disconnections described above, one more disconnection defect occurring in the first bus wiring IC and the block 1d can be corrected. Let us take as an example a case where a disconnection portion 35 occurs in the source bus wiring 1d. First, the defective source bus wiring 1d and the spare wirings 11 and 14 are connected by laser beam irradiation at the intersections 35a and 35b, respectively. Next, the preliminary wiring l1 and 14 and the connecting wire 2
4 and 34 are connected by laser beam irradiation, respectively. Then, on the aforementioned circuit board, the two connection wires connected to the connection line 24 and the connection line 34 are electrically connected. Further, at positions 16a and 16t), the preliminary wirings 11 and 14 are cut by laser beam irradiation, respectively.

In this way, the parts on both sides of the disconnection part 35 of the defective source bus wiring 1d are connected to the spare wiring l1, the connection line 24, and the connection line 34.
, and are electrically connected by a preliminary wiring 14.

According to the configuration of this embodiment, three disconnections can be corrected in one block. However, after the three disconnections are corrected in one block, the other block can only correct l disconnections. Considering this point, this embodiment appears to have little advantage. However, in consideration of productivity in actual production, the limit is to modify three bus wirings per one display device. Therefore, it is more advantageous to have fewer restrictions depending on the location of the disconnection than to be able to correct many defective bus wirings.

In this embodiment, if one additional spare wiring is provided at each end of the source bus wiring 1, 4
It is possible to correct disconnection defects at locations. Even if the number of spare wirings is increased in this way, the maximum number of disconnections that can be corrected is limited to the number of pairs of connection lines, which is still four. By further increasing the number of connecting wire pairs, this maximum number can be increased.

In this embodiment, a matrix type display device having a function of modifying the source bus wiring has been described, but the present invention can also be configured to be able to modify the gate bus wiring. Furthermore, it is also possible to adopt a configuration in which both the source bus wiring and the gate bus wiring can be modified.

In this embodiment, a case where a disconnection failure occurs in the source bus wiring is shown as an example, but according to the present invention, leakage failure between the source bus wiring and the gate bus wiring can also be corrected. When such a leakage defect occurs, these bus wirings are cut at both ends of the leakage point, and the cut points are corrected in the same way as in this embodiment.

(Effects of the Invention) In the matrix type display device of the present invention, a plurality of disconnection defects can be corrected, and there are fewer restrictions due to the positions where they occur. Therefore, according to the present invention, the yield of display devices can be improved and the cost of display devices can be reduced.

4 no na! 1 is a schematic plan view showing a display electrode substrate used in one embodiment of a square type display device of the present invention, and FIG. 2A is a schematic plan view of a display electrode substrate having a function of correcting disconnection defects. FIG. 2B is a plan view of a driver film connected to the substrate of FIG. 2A, and FIG. 3 is a schematic plan view of a display electrode substrate capable of correcting a plurality of disconnection defects.

1, la, lb, lc, Id --- source bus wiring, 2... gate bus wiring, 5, 15, 2
5.35...Disconnection part, 5a, 15a, 25a
, 35a, 5b, 15b, 25b, 35b
...intersection, 11, 12, 13, l4...
Preliminary wiring, 21, 22, 23, 24, 31
．． 32, 33, 34... Connection line.

that's all

Claims (1)

[Claims] 1. A matrix type including a display electrode substrate having picture element electrodes arranged in a matrix, and scanning lines and signal lines arranged vertically and horizontally in rows in one direction between the picture element electrodes. The display device includes a plurality of preliminary wirings, each of which intersects with the one column via an insulating film, at each end of at least one of the scanning line and signal line columns, and a plurality of the preliminary wirings. and multiple connection lines that intersect through an insulating film,
, each of the plurality of connection lines forms a pair between the two ends, and each of the pair of connection lines is drawn out to the outside of the display electrode substrate and arranged so as to be connectable to each other. Type display device.