JPH0397976U

JPH0397976U -

Info

Publication number: JPH0397976U
Application number: JP623590U
Authority: JP
Priority date: 1990-01-26
Filing date: 1990-01-26
Publication date: 1991-10-09

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例によるプリント配
線板を示す断面図、第２図はこの考案の一実施例
によるプリント配線板を各層に分離して示した斜
視図、第３図はこの考案の一実施例の改造後のプ
リント配線板を示す断面図、第４図はこの考案に
よる他の実施例の改造後のプリント配線板を示す
断面図、第５図は従来のプリント配線板を各層に
分離して示した斜視図である。図において、１……第１層、２……第２層、３
……第３層、４……第４層、５……電子部品のリ
ード挿入用スルーホール、６……パターン、６ａ
……切断すべき内層パターン、７……内層パター
ン改造用バイアホール、８……改造用ドリル、９
……ドリル径、１０……改造用バイアホールのラ
ンド径、１１……改造用バイアホールの下穴径、
１２……切断箇所である。なお、図中、同一符号
は同一、又は相当部分を示す。 Fig. 1 is a sectional view showing a printed wiring board according to an embodiment of this invention, Fig. 2 is a perspective view showing the printed wiring board according to an embodiment of this invention separated into layers, and Fig. 3 is a sectional view showing a printed wiring board according to an embodiment of this invention. FIG. 4 is a sectional view showing a modified printed wiring board of one embodiment, FIG. 4 is a sectional view showing a modified printed wiring board of another embodiment according to this invention, and FIG. FIG. In the figure, 1...first layer, 2...second layer, 3
...Third layer, 4...Fourth layer, 5...Through hole for inserting leads of electronic components, 6...Pattern, 6a
... Inner layer pattern to be cut, 7 ... Via hole for modifying inner layer pattern, 8 ... Drill for modification, 9
...Drill diameter, 10... Land diameter of via hole for modification, 11... Pilot hole diameter of via hole for modification,
12...This is the cutting location. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims

[Scope of utility model registration request]

A printed wiring board characterized in that when through holes for inserting leads of electronic components are connected to each other by an inner layer pattern, a via hole necessary for switching the running layer of the pattern is provided in the middle of the inner layer pattern for modifying the inner layer pattern. .