JPH0397934U - - Google Patents
Info
- Publication number
- JPH0397934U JPH0397934U JP623990U JP623990U JPH0397934U JP H0397934 U JPH0397934 U JP H0397934U JP 623990 U JP623990 U JP 623990U JP 623990 U JP623990 U JP 623990U JP H0397934 U JPH0397934 U JP H0397934U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor component
- radiator
- mounting
- shape
- presser plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
Description
第１図はこの考案の一実施例による半導体部品
の取付装置を示す断面側面図、第２図は第１の正
面図、第３図は第２図の断面平面図、第４図は第
３図の取付説明用断面平面図である。第５図は従
来の半導体部品の取付装置を示す断面側面図であ
り、第６図は第５図の正面図である。第７図は他
の従来の半導体部品の取付装置を示す断面側面図
であり、第８図は第７図の正面図である。
図において、１は放熱器、１ａは固定用穴、２
は半導体部品、２ａは半導体絶縁部、３は固定ネ
ジ、４はプリント基板、５は半導体部品足、６は
押え金具、７は絶縁シート、８は押え板、８ａは
押え板バネ部、６は押え金具、７は絶縁シート、
８は押え板、８ａは押え板バネ部、８ｂは固定用
突起である。なお、図中、同一符号は同一または
相当部分を示す。
FIG. 1 is a cross-sectional side view showing a semiconductor component mounting device according to an embodiment of the invention, FIG. 2 is a front view of the first, FIG. 3 is a cross-sectional plan view of FIG. 2, and FIG. FIG. 3 is a cross-sectional plan view for explaining the installation of the figure. FIG. 5 is a cross-sectional side view showing a conventional semiconductor component mounting device, and FIG. 6 is a front view of FIG. 5. FIG. 7 is a sectional side view showing another conventional semiconductor component mounting device, and FIG. 8 is a front view of FIG. 7. In the figure, 1 is a heat sink, 1a is a fixing hole, 2
1 is a semiconductor component, 2a is a semiconductor insulating part, 3 is a fixing screw, 4 is a printed circuit board, 5 is a semiconductor component leg, 6 is a holding metal fitting, 7 is an insulating sheet, 8 is a holding plate, 8a is a holding plate spring part, 6 is Holder metal fitting, 7 is an insulating sheet,
8 is a holding plate, 8a is a holding plate spring portion, and 8b is a fixing projection. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
付装置において、上記放熱器の所定位置に、上記
半導体部品の取付け用貫通穴を設けるとともに、
内面側の奥面が上記半導体部品の外壁絶縁部に当
接するよう略コ字状に折曲げ形成されコ字状の両
先端を略レ字状に折り曲げて突起を形成した弾性
部材で構成された押え板と、この押え板の略レ字
状突起を上記放熱器の取付け用貫通穴の一側から
他側に貫通させ、他側で弾性力をもどして放熱器
に係合させるとともに、上記押え板を介して上記
半導体部品を上記放熱器に弾性力により押圧固定
するようにしたことを特徴とする半導体部品の取
付装置。 In a semiconductor component mounting device for mounting a semiconductor component on a heat sink, a through hole for mounting the semiconductor component is provided at a predetermined position of the heat sink, and
It is composed of an elastic member that is bent into a substantially U-shape so that the back surface on the inner side abuts the outer wall insulation portion of the semiconductor component, and both ends of the U-shape are bent into a substantially V-shape to form a protrusion. A presser plate and a substantially L-shaped protrusion of the presser plate are passed through from one side of the through hole for mounting the radiator to the other side, and the elastic force is restored on the other side to engage the radiator, and the presser plate is inserted into the radiator. A mounting device for a semiconductor component, characterized in that the semiconductor component is pressed and fixed to the heat radiator via a plate by elastic force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623990U JPH0397934U (en) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623990U JPH0397934U (en) | 1990-01-26 | 1990-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397934U true JPH0397934U (en) | 1991-10-09 |
Family
ID=31509917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP623990U Pending JPH0397934U (en) | 1990-01-26 | 1990-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397934U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4743536B2 (en) * | 2006-10-16 | 2011-08-10 | 株式会社デンソー | Semiconductor mounting structure |
-
1990
- 1990-01-26 JP JP623990U patent/JPH0397934U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4743536B2 (en) * | 2006-10-16 | 2011-08-10 | 株式会社デンソー | Semiconductor mounting structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0397934U (en) | ||
| CA2256141A1 (en) | Component mounting arrangement, clip and assembly | |
| JPS5886752A (en) | Mounting device for heating part | |
| JPH08139475A (en) | Heat dissipation device of fixed unit | |
| JPS5927099Y2 (en) | Printed circuit board mounting device | |
| JPS6023996Y2 (en) | Heat generating parts mounting device | |
| JPH0353892U (en) | ||
| JPS6234448Y2 (en) | ||
| JPH0410720Y2 (en) | ||
| JPS6416642U (en) | ||
| JPS6023984Y2 (en) | IC mounting device | |
| JPH0617310Y2 (en) | Heat sink fixing structure | |
| JPH0371696U (en) | ||
| JPH0117684Y2 (en) | ||
| JPH0359643U (en) | ||
| JPH02102741U (en) | ||
| JPH0451148U (en) | ||
| JPH056697U (en) | Terminal block attachment | |
| JPH02789U (en) | ||
| JPS62142889U (en) | ||
| JPS63157993U (en) | ||
| JPH0448690U (en) | ||
| JPH02104698U (en) | ||
| JPS5951416A (en) | Switch droplet preventive structure for electric device | |
| JPS622256U (en) |