JPH0396396A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH0396396A JPH0396396A JP1233477A JP23347789A JPH0396396A JP H0396396 A JPH0396396 A JP H0396396A JP 1233477 A JP1233477 A JP 1233477A JP 23347789 A JP23347789 A JP 23347789A JP H0396396 A JPH0396396 A JP H0396396A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- panel
- bent
- embedded
- bent part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 5
- 239000000057 synthetic resin Substances 0.000 abstract description 2
- 229920003002 synthetic resin Polymers 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
ｒ産業上の利用分野〕
この発明は、フレームの面にパネルを結合したＩＣ力一
ドに関し、特にパネルの結合の改良にかかわる。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field] The present invention relates to an IC power supply in which a panel is bonded to the surface of a frame, and particularly relates to an improvement in the bonding of the panels.
第８図は従来のＩＣ力一ドの分解斜視図である。 FIG. 8 is an exploded perspective view of a conventional IC power supply.
図において、１は回路基板で、半導体素子など電子部品
２を装着している．３は合成樹脂戒形品からなり、回路
基板ｌを収納したフレーム、４は金属板からなる一対の
パネルで、フレーム３の両面に接着シーｌ〜や接着剤な
ど接着材料５を介し接着される。In the figure, 1 is a circuit board on which electronic components 2 such as semiconductor elements are mounted. Reference numeral 3 denotes a frame made of a synthetic resin article and containing a circuit board 1, and 4 a pair of panels made of metal plates, which are adhered to both sides of the frame 3 via an adhesive material 5 such as an adhesive seal or an adhesive. .
このように、フレーム３にパネル４が接着されてなる従
来のＩ’Ｃカードを、第９図に断面図で示す。A conventional I'C card in which the panel 4 is bonded to the frame 3 in this manner is shown in cross-section in FIG.
［発明か解決しようとする課題〕
上記のような従来のＩＣカードでは、パネル４は接着材
料５による接着力により結合されており、経年の使用に
より接着力が低下し、パネル４とフレーム３面とにすき
間が生じたり、カードが曲げられるとバネル５がはがれ
る箇所ができたりし、品質を低下するという問題点があ
った。また、接行材料５は耐熱性上難点があるなどの問
題点があった。[Problem to be solved by the invention] In the conventional IC card as described above, the panel 4 is bonded by the adhesive force of the adhesive material 5, and the adhesive force decreases with use over time, causing the panel 4 and the 3 sides of the frame to bond together. There were problems in that there were gaps between the cards, and that there were places where the panels 5 could be peeled off when the card was bent, reducing the quality. Further, the contact material 5 has problems such as poor heat resistance.
この発明は、このような問題点を解決するためになされ
たもので、パネルが接着材料によらずフレームに確実に
結合され、品質を向上したＩＣ力一ドを得ることを目的
としている。The present invention was made to solve these problems, and aims to provide an IC power supply with improved quality in which a panel is reliably joined to a frame without using an adhesive material.
この発明にかかるＩＣカードは、パネルの外周部をフレ
ーム側に折曲げ、この折曲げ部をフレームの面部に埋込
み結合したものである．〔作用〕
この発明においては、パネルの外周部の折曲げ部を、合
戊樹脂戒形品のフレームの外面部の局部加熱加圧により
埋込むか、フレームの戒形時に一体に埋込んでおり、強
固に結合される。In the IC card according to the present invention, the outer peripheral portion of the panel is bent toward the frame side, and this bent portion is embedded and connected to the surface portion of the frame. [Function] In this invention, the bent portion of the outer periphery of the panel is embedded by local heating and pressure on the outer surface of the frame of the composite resin shaped product, or is embedded integrally when the frame is shaped. , tightly coupled.
第１図はこの発明の一実施例によるＩＣカードの上部パ
ネル埋込み前の分解斜視図である。合或樹脂成形品から
なるフレームＩＩＡには、半導体素子など電子部品２を
装着した回路基板１が収納されている。ｌ２は金属板な
どからなる上，下側一対のパネルで、外周部がそれぞれ
フレーム１１ＡＩＩｔｌＪに折曲げられて折曲げ部１２
ａが形戒され、複数の樹脂結合用穴１．２ｂが設けられ
ている。FIG. 1 is an exploded perspective view of an IC card according to an embodiment of the present invention before being embedded in the upper panel. A frame IIA made of a resin molded product houses a circuit board 1 on which electronic components 2 such as semiconductor elements are mounted. 12 is a pair of upper and lower panels made of metal plates, etc., and the outer periphery thereof is bent to the frame 11AIItlJ to form a bent portion 12.
a is shaped, and a plurality of resin bonding holes 1.2b are provided.
上記バネルｌ２のフレームＩＩＡ面部への結合は、まず
、第２図に断面図で示すようにする。フレームＩＩＡの
戒形時に、下測のパネルｌ２を下金型に入れ、上金型を
結合し、合或樹脂圧入によりフレーム＋１Ａを成形する
。こうして、フレームＩＩＡの下面部に下側のバネル１
２の折曲げ部１２ａが埋込まれる。The above-mentioned panel 12 is first connected to the frame IIA surface portion as shown in a sectional view in FIG. 2. When forming the frame IIA, the lower panel 12 is placed in the lower mold, the upper mold is joined, and the frame +1A is formed by press-fitting the resin. In this way, the lower panel 1 is attached to the lower surface of the frame IIA.
The bent portion 12a of No. 2 is embedded.
フレームＩＩＡの上面部には、上側のパネル１２の折曲
げ部１２ａを後工程で埋込むための四部１１ｃ、及びこ
の外周に凸部＋１ＣＩが形成されている。On the upper surface of the frame IIA, there are formed four parts 11c for embedding the bent part 12a of the upper panel 12 in a subsequent process, and a convex part +1CI on the outer periphery of the four parts 11c.
つづいて、フレームＩＩＡ内に電子部品２を装着した回
路基板１を固定千段（図示は略す〉により固定し、上側
のパネル１２をフレームＩＩＡ上にし、折曲げ部１２ａ
を凹部Ｉ１ｃに当てる。つぎに、フレームＩＩＡの凸部
＋１ｄを局部加熱し軟化させ、戒形金型で上方から加圧
成形し、折曲げ部１２ａを埋込み上而を平面にする。Next, the circuit board 1 with the electronic components 2 mounted thereon is fixed in the frame IIA with a fixed stage (not shown), the upper panel 12 is placed on the frame IIA, and the bent portion 12a is fixed.
to the recess I1c. Next, the convex portion +1d of the frame IIA is locally heated to soften it, and is pressure-molded from above using a molding die, thereby embedding the bent portion 12a and making the body flat.
こうして、第３図に示すように、フレーム１１の上，下
面部にそれぞれバネル１２の折曲げ部１２ａを埋込み結
合した、ＩＣカードができ上る。In this way, as shown in FIG. 3, an IC card is completed in which the bent portions 12a of the panel 12 are embedded and bonded to the upper and lower surfaces of the frame 11, respectively.
第４図はこの発明の第２の実施例を示す断面図で、パネ
ル１２の外周部は内方に鋭角に折曲げられ、折曲げ部１
２ｃが形成され、複数の樹脂結合用穴１２ｂが設けられ
ている。FIG. 4 is a sectional view showing a second embodiment of the present invention, in which the outer peripheral portion of the panel 12 is bent inward at an acute angle, and the bent portion 1
2c is formed, and a plurality of resin bonding holes 12b are provided.
これらのパネル１２を、上記第１の実施例と同様な手段
によりフレーム１１の上，下面部に埋込み結合し、ＩＣ
カードが構戒される。These panels 12 are embedded and connected to the upper and lower surfaces of the frame 11 by the same means as in the first embodiment, and the IC
The card is taken into consideration.
第５図は、この発明の第３の実施例を示す。パネル１２
の外周部は直角に段付きに折曲げられ、折曲げ部＋２ｄ
が形成され、外方の水平部に複数の樹脂結合用穴＋２ｂ
が設けられている。FIG. 5 shows a third embodiment of the invention. Panel 12
The outer periphery of is bent stepwise at right angles, and the bent part +2d
is formed, and multiple resin bonding holes +2b are formed on the outer horizontal part.
is provided.
この場合のパネル１２のフレーム１１への結合も、上記
第ｌの実施例と同様な手段で行う。In this case, the panel 12 is also connected to the frame 11 by the same means as in the first embodiment.
第６図はこの発明の第４の実施例を示す。パネルｌ２の
外周部は直角に折曲げられ、さらに内側に直角に水平に
折曲げられ、折曲げ部１２ｅが形戒され、垂直部に複数
の樹脂結合用穴１２ｂが設けられている。FIG. 6 shows a fourth embodiment of the invention. The outer periphery of the panel 12 is bent at a right angle, and further horizontally bent inward at a right angle, with a bent portion 12e shaped and a plurality of resin bonding holes 12b provided in the vertical portion.
これらのバネル１２のフレーム１１面への結合は，まず
、第７図に示すようにする。フレーム１１の或形時に、
下側のパネルｌ２を下金型に入れ、上金型を結合し、合
或樹脂圧入によりフレームＩＩＢを成形する。こうして
、フレームＩＩＢの下面部にパネル１２の折曲げ部１２
ｅが埋込まれる。フレームＩＩＢの上面部には、上側の
パネル１２の折曲げ部１２ｅを後工程で埋込むための凹
部１１ｅ、及びこの外周に凸部１１ｆが形成されている
。These panels 12 are first connected to the frame 11 as shown in FIG. When the frame 11 is shaped,
The lower panel 12 is placed in a lower mold, the upper mold is combined, and the frame IIB is formed by joining or press-fitting a resin. In this way, the bent portion 12 of the panel 12 is attached to the lower surface of the frame IIB.
e is embedded. The upper surface of the frame IIB is formed with a recess 11e into which the bent portion 12e of the upper panel 12 is to be embedded in a subsequent process, and a protrusion 11f on the outer periphery of the recess 11e.
つづいて、鎖線で示すように、電子部品２を装若した回
路基板１をフレームＬＩＤ内に固意手段（図示は略す）
により固定する。鎖線で示すように、上側のパネルｌ２
をフレームＩＩＢ上にし、折曲げ部１２ｅを凹部１１ｅ
に当てる。さらに、フレームＪＩＢの凸部１１ｆを局部
加熱し軟化させ、成形金型でＬ方から加圧成形する。Subsequently, as shown by the chain line, the circuit board 1 mounted with the electronic component 2 is fixed in the frame LID by means (not shown).
Fix it by. As shown by the dashed line, the upper panel l2
on the frame IIB, and the bent part 12e is placed on the recessed part 11e.
Apply to. Further, the convex portion 11f of the frame JIB is locally heated to soften it, and then pressure molded from the L side using a molding die.
こうして、第６図に示すように、上側のパネル１２の折
曲げ部１２ｅを埋込み上面が平面にされる。In this way, as shown in FIG. 6, the bent portion 12e of the upper panel 12 is embedded and the upper surface is made flat.
こうして、フレームＩＩの上，下面部にそれぞれパネル
１２の折曲げ部１２ｅを埋込み結合した、ｆｃ力−１；
ができ上る。In this way, the bent portions 12e of the panel 12 are embedded and connected to the upper and lower surfaces of the frame II, respectively;
is completed.
なお、上記各実施例では、フレームの成形時に下面に下
１１ｔｌ＋のパネルｌ２の折曲げ部を埋込んだが、電子
部品を装着した回路基板を上，下側のパネル間に入れ、
この状態で或形金型に入れ、合或樹脂を圧入しフレーム
を形成するとともに、内部にも樹脂充てん封止したＩＣ
カードを得るようにしてもよい。In each of the above embodiments, the bent portion of the lower panel 11tl+ was embedded in the lower surface during frame molding, but the circuit board with electronic components mounted thereon was inserted between the upper and lower panels.
In this state, the IC is placed in a mold and press-fitted with resin to form a frame, and the inside is also filled with resin and sealed.
You may also receive cards.
また、上記各実施例では、パネルの外周部全辺に折曲け
部を形成したが、場合により、対向する両長辺、又はこ
の両長辺と他の一辺とに折曲げ部を形成してもよい。Furthermore, in each of the above embodiments, the bent portions were formed on all sides of the outer periphery of the panel, but in some cases, bent portions may be formed on both opposing long sides, or on both long sides and another side. You can.
さらに、上記実施例では、フレームの両面が開口してお
り、これら両面にパネル結合したが、一面のみが開口し
たフレームの場合は、この開口した面側にパネルを結合
する。Further, in the above embodiment, both sides of the frame are open, and panels are bonded to both sides, but in the case of a frame with only one side open, the panel is bonded to the open side.
以上のように、この発明によれば、パネルの外周部にフ
レーム側への折曲げ部を形成し、このパネルの折曲げ部
をフレームの面部に埋込み結合したので、接着材料を要
せず、確実に結合され、耐熱性をもち品質が向上される
。As described above, according to the present invention, a bent portion toward the frame is formed on the outer periphery of the panel, and the bent portion of the panel is embedded and bonded to the surface of the frame, so that no adhesive material is required. It is reliably bonded, has heat resistance, and improves quality.
第１図はこの発明の一実施例によるＩＣ力一ドの上側パ
ネル埋込み前の分解斜視図、第２図は第１図の下側のパ
ネルを埋込み戒形されたフレーム部力断而図、第３図は
第２図のフレーム部に回路空板部を収納し上側パネルを
結合してなるＩＣ力一ドの断面図、第４図および第５図
はこの発明の第２及び第３の実方色例によるＩｃカード
の断面図、第０図はこの発明の第４の実施例による．Ｉ
Ｃカードの断面図、第７図は第６図の下側のパネルを埋
込み或形された状態のフレーム部の断面図、第８１ｊ』
は従来のＩＣカードの分解斜視図、第９図は第８図のフ
レーム部にパネルが結合されてなるＩＣカードの断面図
である。
１・・回路基板、２・・・電子部品、１ｌ・・・フレー
ム、２・・パネル、１２ａ， １２ｃ〜＋２ｅ・・・折
曲げ部、＋２ｂ・・・樹指結合用穴
なお、図中同一符号は同一又は相当部分を示す。FIG. 1 is an exploded perspective view of an IC device according to an embodiment of the present invention before being embedded in the upper panel; FIG. 2 is a diagram of the frame section after the lower panel of FIG. 1 is embedded; FIG. 3 is a cross-sectional view of an IC power supply in which an empty circuit board part is housed in the frame part of FIG. 2 and the upper panel is connected, and FIGS. FIG. 0, a cross-sectional view of an IC card in a real color example, is according to a fourth embodiment of the present invention. I
A cross-sectional view of the C card, Fig. 7 is a cross-sectional view of the frame portion with the lower panel of Fig. 6 embedded or shaped, No. 81j.
9 is an exploded perspective view of a conventional IC card, and FIG. 9 is a sectional view of an IC card in which a panel is joined to the frame portion of FIG. 8. 1...Circuit board, 2...Electronic component, 1l...Frame, 2...Panel, 12a, 12c to +2e...Bend portion, +2b...Drink joining hole Note that it is the same in the figure Codes indicate the same or equivalent parts.
Claims (1)
、開口した面にパネルを結合してなるＩＣカードにおい
て、上記パネルの外周部に上記フレーム側への折曲げ部
を形成し、このパネルをフレームの開口した面側に当て
上記折曲げ部をフレームの面部に埋込み結合してあるこ
とを特徴とするＩＣカード。In an IC card in which a panel is bonded to the open upper and lower surfaces of a frame in which electronic components are incorporated, a bending portion toward the frame is formed on the outer periphery of the panel, and the panel The IC card is characterized in that the folded portion is embedded and bonded to the surface of the frame by placing the folded portion against the open surface of the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233477A JPH0396396A (en) | 1989-09-09 | 1989-09-09 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233477A JPH0396396A (en) | 1989-09-09 | 1989-09-09 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396396A true JPH0396396A (en) | 1991-04-22 |
Family
ID=16955628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1233477A Pending JPH0396396A (en) | 1989-09-09 | 1989-09-09 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396396A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5886402A (en) * | 1997-01-23 | 1999-03-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device card |
| US6031278A (en) * | 1997-04-16 | 2000-02-29 | Mitsubishi Denki Kabushiki Kaisha | IC card and manufacturing method thereof |
| US6481633B1 (en) | 1999-07-06 | 2002-11-19 | J. S. T. Mfg. Co., Ltd. | IC incorporating card with a grounding structure |
-
1989
- 1989-09-09 JP JP1233477A patent/JPH0396396A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5886402A (en) * | 1997-01-23 | 1999-03-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device card |
| US6031278A (en) * | 1997-04-16 | 2000-02-29 | Mitsubishi Denki Kabushiki Kaisha | IC card and manufacturing method thereof |
| US6481633B1 (en) | 1999-07-06 | 2002-11-19 | J. S. T. Mfg. Co., Ltd. | IC incorporating card with a grounding structure |
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