JP3717701B2 - Manufacturing method of hybrid IC card - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a hybrid IC card that can be used in both a contact type and a non-contact type.
[0002]
[Prior art]
In recent years, instead of the conventional contact IC card and the IC card with a non-contact antenna, a hybrid IC card having both a contact type and a non-contact type has attracted attention.
[0003]
This hybrid IC card enables the use of both contact type and non-contact type by connecting a contact type IC module and a non-contact type inlet with an antenna and sharing one IC chip information. Is.
[0004]
In such a hybrid IC card, for example, an inlet provided with an antenna and an antenna terminal is sandwiched between two vinyl chloride resins, laminated and embedded in the resin, and then the resin is ground to expose the antenna terminal. It was formed by carrying out counterboring to form a recess having a shape corresponding to the IC module and storing the IC module in the obtained recess.
[0005]
However, in the IC module manufacturing method using counterbore processing, during grinding,
The antenna terminal and the antenna are easily damaged, and the antenna is adversely affected by heating and pressing during lamination. Further, when the heating and pressurization and the thickness of the inlet is, for example, 20 to 30 μm, the thickness of the vinyl chloride resin sheet itself used varies by about 50 μm. Among them, it is difficult to form the antenna terminal at a fixed position of the IC card because the position is shifted in the vertical, horizontal, and height directions. Further, the counterbore processing for individually grinding the IC card molded body takes time, and further, the above-described defects are likely to occur, so that the production efficiency is poor and unsuitable for mass production.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above circumstances, and the inlet terminal can be resin-sealed in place without damaging the antenna terminal and the antenna, and the antenna terminal and the IC module can be formed at an accurate position. An object of the present invention is to provide a method for manufacturing a hybrid IC card with good quality.
[0007]
[Means for Solving the Problems]
The present invention includes, firstly, an inlet having an antenna and an antenna terminal connected to the antenna, an external connection terminal having a built-in IC chip and connected to an external device, and a contact connected to the antenna terminal on a multi-end surface. A method for manufacturing an IC card including an IC module having a pad,
Preparing a first upper mold and a lower mold having at least one of the concave portions of the IC card shape, and disposing the inlet in close contact with the bottom of the first upper mold with the antenna terminal facing up ,
Arranging the first upper mold and the lower mold in alignment and forming a first cavity between the two molds;
Injecting a molding resin into the cavity and integrally forming the inlet and the molding resin to form a preliminary card substrate;
The IC card-shaped concave portion and the second upper mold formed in the concave portion and having a convex portion corresponding to the IC module shape are aligned with the lower mold on which the spare card base material is arranged. Arranging the second cavity between the molds,
A step of injecting molding resin into the second cavity, integrally molding the spare card base material and resin, and forming an IC card body having a concave shape suitable for the IC module; and conforming to the IC module There is provided a method of manufacturing a hybrid IC card, comprising a step of joining the IC module in a recess having a shape to be formed.
[0008]
Secondly, the present invention includes an inlet having an antenna and an antenna terminal connected to the antenna, an external connection terminal having a built-in IC chip and connected to an external device, and a contact pad connected to the antenna terminal. A method for manufacturing an IC card including an IC module,
The first upper mold having the IC card-shaped first recess is closely attached to the bottom of the first mold with the first recess and the inlet facing the antenna terminal. The step of placing,
Disposing the first upper mold and the lower mold provided with the IC card-shaped second recess by aligning the first recess and the second recess;
A step of injecting molding resin into a cavity between the first recess and the second recess, and integrally forming the inlet and the resin to form a preliminary card substrate;
The IC card-shaped third recess, and a second upper mold formed in the third recess and having a protrusion corresponding to the IC module shape, and the lower part in which the spare card base material is disposed Placing the mold in alignment with the third recess and the spare card substrate;
An IC card having a fourth recess having a shape that fits the IC module by injecting molding resin into a cavity between the third recess and the spare card substrate, and integrally molding the spare card substrate and the resin. Provided is a method for manufacturing a hybrid IC card, comprising a step of forming a main body and a step of bonding the IC module in the fourth recess.
[0009]
Third, the present invention includes an antenna, an antenna terminal connected to the antenna, and an inlet having a joint hole with the IC module, an IC chip, and an external device connected to an external device on one end surface of the IC module body. A method for manufacturing an IC card including a connection terminal, a contact pad connected to the antenna terminal on the other end surface, and an IC module provided with a projection adapted to the joint hole,
The first upper mold having the first concave portion of the IC card shape and the first convex portion provided in the first concave portion and having a shape adapted to the joint hole is disposed below the first concave portion. A step of arranging the inlet on the bottom of the first upper mold in close contact with the antenna terminal facing up and fitting the joint hole with the first protrusion,
Disposing the first upper mold and the lower mold provided with the IC card-shaped second recess by aligning the first recess and the second recess;
A step of injecting molding resin into a cavity between the first recess and the second recess, and integrally forming the inlet and the resin to form a preliminary card substrate;
The IC card-shaped third recess, and at least two-stage projections provided in the third recess, the projections corresponding to the IC module main body being stacked with projections that fit the joint holes. A second upper mold having a second convex part and the lower mold provided with a spare card base material, the projection and the joining hole are matched, and the third concave part and the spare card A step of aligning and arranging the base material;
An IC card having a fourth recess having a shape that fits the IC module by injecting molding resin into a cavity between the third recess and the spare card substrate, and integrally molding the spare card substrate and the resin. Provided is a method for manufacturing a hybrid IC card, comprising a step of forming a main body and a step of bonding the IC module in the fourth recess.
[0010]
Fourth, the present invention includes an antenna, an antenna terminal connected to the antenna, an inlet having a joint hole with the IC module, an external connection terminal connected to an external device on one end surface of the IC module body, and a peripheral edge. IC having a latching portion extending horizontally from the portion to the end surface, and having a protrusion having a contact pad connected to the antenna terminal and an IC chip adapted to the joint hole provided on the other end surface facing each other A method for manufacturing an IC card including a module,
The first upper mold having the first concave portion of the IC card shape and the first convex portion provided in the first concave portion and having a shape adapted to the joint hole is disposed below the first concave portion. A step of arranging the inlet on the bottom of the first upper mold in close contact with the antenna terminal facing up and fitting the joint hole with the first protrusion,
Disposing the first upper mold and the lower mold provided with the IC card-shaped second recess by aligning the first recess and the second recess;
A step of injecting molding resin into a cavity between the first recess and the second recess, and integrally forming the inlet and the resin to form a preliminary card substrate;
A third recess of the IC card shape, and a projection provided in the third recess, the projection corresponding to the locking portion, a projection corresponding to the shape of the IC module main body, and a projection adapted to the joint hole. A second upper mold having a second convex portion having a three-step projection shape, and a lower mold on which a spare card base material is disposed, the projection and the joint hole are matched, and A step of aligning and arranging the third recess and the spare card substrate;
An IC card having a fourth recess having a shape that fits the IC module by injecting molding resin into a cavity between the third recess and the spare card substrate, and integrally molding the spare card substrate and the resin. The method includes a step of forming a main body and a step of bonding the IC module in the fourth recess.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
The method of the present invention includes a first upper mold provided with three molds for forming an IC card shape, that is, a lower mold and, if necessary, a convex part for forming a concave part of a desired shape on the antenna terminal. Using a mold and a second upper mold, basically
(1) a step of placing an antenna and an inlet having an antenna terminal connected to the antenna in close contact with the first upper mold; (2) aligning the first upper mold with the lower mold; A step of placing, (3) a step of injecting molding resin into a cavity between the first upper mold and the lower mold, and integrally molding the inlet and the resin to form a spare card substrate; (4) second (5) A molding resin is injected into the cavity between the second upper mold and the lower mold, and the desired upper mold and the lower mold on which the spare card base material is arranged are aligned. A step of forming an IC card main body having a recess having a shape, and (6) a step of bonding an IC module in the recess having a desired shape.
[0012]
An inlet refers to a structure in which an antenna and an antenna terminal are formed on an insulating substrate such as a resin sheet by, for example, printing or photolithography.
[0013]
The steps (1) to (3) and the steps (4) to (6) are continuously performed by automatically replacing the upper mold with the first upper mold and the second upper mold. It can be carried out. Alternatively, after the steps (1) to (3) are repeated, the steps (4) to (6) can be continuously performed using the obtained spare card base material.
[0014]
According to this method, as shown in the steps (1) to (3), since the inlet is disposed in close contact with the first upper mold, the preliminary card base material is formed with the inlet fixed, No misalignment of the inlet. By using this spare card base, it is possible to form a highly accurate IC card body that can accurately form the antenna terminal of the IC card at a predetermined position.
[0015]
Further, in this method, as shown in steps (4) to (6), a desired recess can be easily provided on the antenna terminal using the spare card base and the second upper mold. In this step, grinding is not performed as in the prior art, and unnecessary heating or pressurization is not involved, so that the antenna and the antenna terminal are not damaged or adversely affected.
[0016]
Furthermore, when this method is used, a series of manufacturing steps can be performed by injection molding without performing grinding, so that a highly accurate IC card can be efficiently manufactured.
[0017]
In addition, by setting the outer dimensions of the inlet at least 0.5 mm smaller than the outer dimensions of the IC card both vertically and horizontally, it is possible to sufficiently cover the periphery of the inlet with the molding resin.
[0018]
Examples of the molding resin preferably used in the present invention include acrylonitrile butadiene styrene-polycarbonate alloy, acrylonitrile butadiene styrene-polybutylene terephthalate alloy, acrylonitrile butadiene styrene-polycarbonate-polybutylene terephthalate alloy, polycarbonate, and acrylonitrile butadiene styrene. These thermoplastic resins are examples.
[0019]
【Example】
Hereinafter, the present invention will be specifically described with reference to the drawings.
[0020]
Example 1
1, FIG. 3, FIG. 5, FIG. 6, and FIG. 8 are diagrams for explaining each step of the first example of the IC card manufacturing method of the present invention.
[0021]
FIG. 2 shows a front view for explaining the configuration of an example of the inlet used in the present invention.
[0022]
As shown in FIG. 1, a first upper mold 1 having a first recess 3 having the same dimensions as one surface of an IC card, a bottom having the same dimensions as one surface of the IC card, and a predetermined height. As shown in FIG. 2, the lower mold 2 having the second recess 4, and an antenna 12 and a pair of antenna terminals 13 are formed on one surface of an insulating substrate 11 made of, for example, resin. An inlet 10 having a thickness of 70 mm and a thickness of 20 to 30 μm was prepared.
[0023]
First, the inlet 10 is arranged at a predetermined position of the first upper mold 1 with the antenna terminal 13 facing upward, and air is extracted from an exhaust hole (not shown), whereby the inlet 10 is placed at the bottom of the first upper mold 1. Were vacuum-adsorbed.
[0024]
Next, the cavity 5 was formed between the first recess 3 and the second recess 4 by aligning the first recess 3 and the second recess 4.
Thereafter, a molding resin was poured into the cavity 5 and solidified to integrally mold the inlet 10 and the resin.
As shown in FIG. 3, when the first upper mold 1 is removed, the inlet 10 is arranged at a predetermined position on the surface thereof with the antenna terminal 13 facing upward, and the other portions are covered with the resin 14. A card substrate 20 was obtained.
[0025]
FIG. 4 is a view of the obtained spare card substrate 20 as viewed from above. As shown in the figure, the spare card substrate 20 is the same as the target IC card in the vertical and horizontal dimensions, and is thinner than that, and the antenna 12 and the antenna terminal 13 are provided on the surface at predetermined positions on the upper surface. Inlet 10 having the above was provided, and the other part was made of resin.
[0026]
Thereafter, as shown in FIG. 5, the bottom of the same size as the one surface of the IC card, the third recess 17 having a predetermined height, and the same outer shape as the IC module at a predetermined position of the third recess. By preparing a second upper mold 15 having a convex part 16 and a lower mold 2 provided with a spare card base material 20, and aligning the third concave part 17 and the spare card base material 20, A cavity 18 was formed between the three recesses 17 and the spare card substrate 20.
[0027]
Thereafter, as shown in FIG. 6, a molding resin was injected into the cavity 18 and solidified, and the preliminary card base 20 and the resin were integrally molded to obtain an IC card main body 30.
A schematic cross-sectional view of the obtained IC card main body 30 is shown in FIG.
[0028]
As shown in the figure, the IC card main body 30 has an IC card main body-shaped resin having a concave portion 19 shaped to fit the IC module, and a region including the antenna terminal is exposed at the bottom of the concave portion 19. Had a configuration including an inlet 10 embedded in the resin.
[0029]
Finally, as shown in FIG. 8, the obtained IC card main body 30 is joined to an IC module 40 having an external terminal 23 on its upper surface and a contact pad 21 and an IC chip 22 on its lower surface, for example, approximately 54. A hybrid IC card 50 of 0 mm × 85.6 mm × 0.76 mm was obtained.
[0030]
When the IC card is repeatedly manufactured in the same process, the antenna terminal is always formed at a predetermined position of the IC card, there is no problem in joining with the IC module, and the antenna and the antenna terminal are not damaged. Could be manufactured efficiently.
[0031]
Example 2
9, FIG. 11, FIG. 13, FIG. 14 and FIG. 16 are diagrams for explaining each step of the second example of the IC card manufacturing method of the present invention.
[0032]
FIG. 10: shows the front view for demonstrating the structure of another example of the inlet used for this invention.
[0033]
As shown in FIG. 9, a first upper mold 101 having a first concave portion 103 having the same dimensions as one surface of the IC card and a first convex portion 26 that fits the joint hole 27 of the IC module, A lower mold 2 having a bottom portion having the same dimensions as one surface of the IC card and a second recess 4 having a predetermined height, and one surface of an insulating substrate 111 made of resin, for example, as shown in FIG. For example, an inlet 110 having a length and width of 40 mm × 70 mm and a thickness of 20 to 30 μm in which a joint hole 27 with an IC module provided between the antenna 12, the pair of antenna terminals 13 and the pair of antenna terminals 13 is formed was prepared.
[0034]
First, the inlet 110 is placed at a predetermined position of the first upper mold 1 with the antenna terminal 13 facing upward, the joint hole 27 is fitted into the first convex portion 26, and air is extracted from an exhaust hole (not shown). As a result, the inlet 110 was vacuum-sucked to the bottom of the first upper mold 101.
[0035]
Next, the lower mold 2 is arranged below the first upper mold 101 with the second concave portion 4 facing upward, and the first concave portion 103 and the second concave portion 4 are aligned. A cavity 105 is formed between the first recess 103 and the second recess 4.
Thereafter, a molding resin was poured into the cavity 105 and solidified to integrally mold the inlet 110 and the resin.
As shown in FIG. 11, when the first upper mold 1 is removed, the inlet 110 having the antenna terminal 13 on the upper surface and the joint hole 27 therebetween is disposed at a predetermined position on the surface, and the other portions are made of resin. Thus, a preliminary card substrate 120 covered with was obtained.
[0036]
FIG. 12 is a view of the obtained spare card substrate 120 as viewed from above. As shown in the figure, the spare card base 120 is the same as the target IC card in the vertical and horizontal dimensions, and is thinner than that, with the antenna 112 and the antenna terminal 13 on the surface at a predetermined position on the upper surface thereof. And an inlet 110 having a joining hole 27 between them, and the other part is made of the resin 14.
[0037]
After that, as shown in FIG. 13, the bottom of the same size as the one surface of the IC card, the third recess 117 having a predetermined height, and the protrusion of the shape of the IC module main body at the predetermined position of the third recess. A second upper mold 115 having a second protrusion 116 having a two-step protrusion shape obtained by superimposing a protrusion in the shape of a resin mold 122 provided on the IC module main body, and a spare card substrate 120. 14 is prepared, and the third recess 117 and the spare card substrate 120 are aligned, so that a cavity is formed between the third recess 117 and the spare card substrate 120 as shown in FIG. 118 was constructed.
[0038]
Thereafter, as shown in FIG. 14, a molding resin was poured into the cavity 118 and solidified, and the preliminary card base 120 and the resin were integrally molded to obtain an IC card main body 130.
[0039]
A schematic cross-sectional view of the obtained IC card main body 130 is shown in FIG.
[0040]
As shown in the figure, the IC card main body 130 is exposed to an IC card main body-shaped resin having a two-stage concave portion 119 adapted to an IC module, and a region including the antenna terminal is exposed at the bottom of the concave portion 119. Other than that, it had the structure containing the inlet 110 embedded in resin. The two-stage concave portion 119 has the same shape as the concave portion 19 used in the first embodiment except that a concave portion constituted by the IC module joint hole 27 is further provided.
[0041]
Finally, an IC module 140 having an external terminal 23 on its upper surface and a contact pad 21 and a resin mold 122 on its lower surface is joined to the obtained IC card main body 130, for example, about 54.0 mm × 85.6 mm × 0. A 76-mm hybrid IC card 150 was obtained.
[0042]
Compared with the IC card according to the first embodiment, the hybrid IC card 150 is bonded to the concave portion formed by the bonding hole 27 by fitting the resin mold 122 of the IC module to the card body and the IC module. The bonding area can be increased. For this reason, the bonding strength between the card body and the IC module is good.
[0043]
In addition, when the IC card is repeatedly manufactured in the same process, the antenna terminal is always formed at a predetermined position of the IC card, there is no problem in joining with the IC module, and the antenna and the antenna terminal are damaged. And was able to be manufactured efficiently.
[0044]
Example 3
17 and 18 are diagrams for explaining each process of still another example of the IC card manufacturing method of the present invention.
[0045]
A spare card substrate 120 was obtained in the same manner as in Example 2.
[0046]
After that, as shown in FIG. 17, the bottom of the same size as the one surface of the IC card, the third recess 217 having a predetermined height, and the predetermined position of the third recess 217 from the periphery of the IC module main body. A three-stage structure in which a protrusion having a shape corresponding to the locking portion 28 extending horizontally on the end surface, a protrusion in the shape of the IC module main body, and a protrusion in the shape of the resin mold 122 provided on the IC module main body are stacked. A second upper mold 215 having a second convex portion 216 having a protruding shape and a lower mold 2 provided with a spare card base 120 are prepared, and the third concave 217 and the spare card base 120 are arranged. By aligning, a cavity 218 was formed between the third recess 217 and the spare card substrate 120 as shown in FIG.
[0047]
Thereafter, as shown in FIG. 18, a molding resin was injected into the cavity 218 and solidified, and the preliminary card base 120 and the resin were integrally molded to obtain an IC card main body 230.
[0048]
A schematic cross-sectional view of the obtained IC card main body 230 is shown in FIG.
[0049]
As shown in the figure, the IC card main body 230 has an IC card main body-shaped resin having a three-stage concave portion 219 adapted to the IC module shape, and a region including the antenna terminal 12 exposed at the bottom of the concave portion 219. Other than that, it had the structure containing the inlet 110 embedded in resin. The shape of the recess 219 is the same as that of the fourth recess 119 of the second embodiment, except that a recess 29 corresponding to the locking portion 28 is provided above the recess corresponding to the IC module main body.
[0050]
Finally, an IC module 240 having an external terminal 23 and a locking portion 28 on the upper surface thereof and a contact pad 21 and a resin mold 122 on the lower surface thereof is joined to the obtained IC card main body 230, for example, about 54.0 mm × A hybrid IC card 250 of 85.6 mm × 0.76 mm was obtained.
[0051]
In the hybrid IC card 250 according to the third embodiment, a sufficient bonding area can be obtained by providing the concave portion 29 in the card body and providing the locking portion 28 in the IC module. The adhesive strength can be significantly improved.
[0052]
In addition, when the IC card is repeatedly manufactured in the same process, the antenna terminal is always formed at a predetermined position of the IC card, there is no problem in joining with the IC module, and the antenna and the antenna terminal are damaged. And the IC card could be manufactured efficiently.
[0053]
Other Application Examples FIG. 21 is a view for explaining still another example of the inlet used in the present invention.
[0054]
As shown in the figure, this inlet 310 is similar to that shown in FIG. 10 except that a plurality of through-holes 31 are provided in the vicinity of the center portion of the substrate 211 at the antenna and the antenna terminal at a sufficient distance. It has the same configuration as.
[0055]
For example, an IC card was manufactured in the same manner as in Example 3 except that the above-described inlet 310 was used instead of the inlet 110. A schematic cross-sectional view showing the configuration of the obtained IC card is shown in FIG.
[0056]
As shown in the figure, in the obtained IC card, the resin introduced into the through-hole 31 serves as a pillar, strengthening the bonding between the inlet 31 and the surrounding resin, and further improving the card strength. Can do.
[0057]
【The invention's effect】
By using the hybrid IC card manufacturing method of the present invention, the inlet can be resin-sealed at a fixed position without damaging the antenna terminal and the antenna, the antenna terminal and the IC module can be formed at an accurate position, and the production efficiency can be improved. Becomes better.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining each step of a first example of the present invention. FIG. 2 is a front view for explaining a configuration of an example of an inlet used in the present invention. The figure for demonstrating each process of the example of 1 [FIG. 4] The figure which looked at the spare card base material concerning a 1st example from the top [FIG. 5] In order to demonstrate each process of the 1st example of this invention FIG. 6 is a diagram for explaining each step of the first example of the present invention. FIG. 7 is a schematic cross-sectional view of the IC card main body according to the first example of the present invention. The figure for demonstrating each process of the example of 1 [FIG. 9] The figure for demonstrating each process of the 2nd example of this invention [FIG. 10] The structure of another example of the inlet used for this invention FIG. 11 is a front view for explaining the steps of the second example of the present invention. FIG. 12 is a top view of the spare card substrate according to the second example. FIG. 13 is a diagram for explaining each process of the second example of the present invention. FIG. 14 is a diagram for explaining each process of the second example of the present invention. FIG. 16 is a schematic cross-sectional view of a card body according to an example of the present invention. FIG. 16 is a diagram for explaining the steps of a second example of the IC card manufacturing method of the invention. FIG. 18 is a diagram for explaining each step of the third example of the present invention. FIG. 19 is a schematic sectional view of the card body according to the third example of the present invention. FIG. 21 is a front view showing a configuration example of an inlet according to another application example of the present invention. FIG. 22 is an IC according to another application example of the present invention. Schematic cross section of card [description of symbols]
DESCRIPTION OF SYMBOLS 1,101 ... 1st upper metal mold | die 2 ... Lower metal mold | die 3,103 ... 1st recessed part 4 ... 2nd recessed part 5 ... Cavity 10, 110, 310 ... Inlet 11 ... Board | substrate 12 ... Antenna 13 ... Antenna terminal 14 ... resin 15,115,215 ... second upper mold 16,116,216 ... first convex part 17,117,217 ... third concave part 18,118,218 ... cavity 19,119,219 ... fourth Recesses 20, 120 ... spare card base 21 ... contact pad 22 ... resin mold 23 ... external connection terminals 30, 130, 230 ... card body 31 ... through holes 40, 140, 240 ... IC modules 50, 150, 250 ... hybrid IC card

Claims (7)

Manufacturing an IC card including an antenna and an inlet having an antenna terminal connected to the antenna, and an IC module having an IC chip and an external connection terminal connected to an external device and an IC module having a contact pad connected to the antenna terminal A way to
Preparing a first upper mold and a lower mold having at least one of the concave portions of the IC card shape, and disposing the inlet in close contact with the bottom of the first upper mold with the antenna terminal facing up ,
Arranging the first upper mold and the lower mold in alignment and forming a first cavity between the two molds;
Injecting a molding resin into the cavity and integrally forming the inlet and the molding resin to form a preliminary card substrate;
The IC card-shaped concave portion and the second upper mold formed in the concave portion and having a convex portion corresponding to the IC module shape are aligned with the lower mold on which the spare card base material is arranged. Arranging the second cavity between the molds,
A step of injecting molding resin into the second cavity, integrally molding the spare card base material and resin, and forming an IC card body having a concave shape suitable for the IC module; and conforming to the IC module A method of manufacturing a hybrid IC card, comprising the step of joining the IC module in a recess having a shape to be formed. Manufacturing an IC card including an antenna and an inlet having an antenna terminal connected to the antenna, and an IC module having an IC chip and an external connection terminal connected to an external device and an IC module having a contact pad connected to the antenna terminal A method for
The first upper mold having the IC card-shaped first recess is closely attached to the bottom of the first mold with the first recess and the inlet facing the antenna terminal. The step of placing,
Disposing the first upper mold and the lower mold provided with the IC card-shaped second recess by aligning the first recess and the second recess;
A step of injecting molding resin into a cavity between the first recess and the second recess, and integrally forming the inlet and the resin to form a preliminary card substrate;
The IC card-shaped third recess, and a second upper mold formed in the third recess and having a protrusion corresponding to the IC module shape, and the lower part in which the spare card base material is disposed Placing the mold in alignment with the third recess and the spare card substrate;
An IC card having a fourth recess having a shape that fits the IC module by injecting molding resin into a cavity between the third recess and the spare card substrate, and integrally molding the spare card substrate and the resin. A method of manufacturing a hybrid IC card, comprising: a step of forming a main body; and a step of bonding the IC module in the fourth recess. An antenna, an antenna terminal connected to the antenna, an inlet having a joint hole with the IC module, an IC chip, an external connection terminal connected to an external device on one end surface of the IC module body, and an opposite end surface facing the other end surface A method for manufacturing an IC card including a contact pad connected to the antenna terminal and an IC module provided with a protrusion adapted to the joint hole,
The first upper mold having the first concave portion of the IC card shape and the first convex portion provided in the first concave portion and having a shape adapted to the joint hole is disposed below the first concave portion. A step of arranging the inlet on the bottom of the first upper mold in close contact with the antenna terminal facing up and fitting the joint hole with the first protrusion,
Disposing the first upper mold and the lower mold provided with the IC card-shaped second recess by aligning the first recess and the second recess;
A step of injecting molding resin into a cavity between the first recess and the second recess, and integrally forming the inlet and the resin to form a preliminary card substrate;
The IC card-shaped third recess, and at least two-stage projections provided in the third recess, the projections corresponding to the IC module main body being stacked with projections that fit the joint holes. A second upper mold having a second convex part and the lower mold provided with a spare card base material, the projection and the joining hole are matched, and the third concave part and the spare card A step of aligning and arranging the base material;
An IC card having a fourth recess having a shape that fits the IC module by injecting molding resin into a cavity between the third recess and the spare card substrate, and integrally molding the spare card substrate and the resin. A method of manufacturing a hybrid IC card, comprising: a step of forming a main body; and a step of bonding the IC module in the fourth recess. The IC module main body has a locking portion extending horizontally from the peripheral edge of the IC module main body to the end surface on the external terminal side end surface, and the third recess corresponds to the shape of the IC module main body. The method according to claim 3, further comprising a three-stage projection shape in which a projection corresponding to the locking portion is further stacked under the projection to be performed. The method according to any one of claims 1 to 4, wherein the step of placing the inlet in close contact with the bottom of the first upper mold is performed by vacuum suction. The inlet according to any one of claims 1 to 4, wherein the inlet has an outer dimension that is at least 0.5 mm smaller than an outer dimension of the IC card in both length and width, and the periphery of the inlet is covered with a molding resin. The method according to claim 1. The method according to any one of claims 1 to 4, wherein the inlet has a plurality of openings in a portion other than the antenna and the antenna terminal.

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