JP4843311B2 - Memory card and manufacturing method thereof - Google Patents

Description

  The present invention relates to a memory card and a method for manufacturing the same, and more particularly to a small memory card used by being attached to a personal computer, a mobile phone, a digital camera, and the like, and a method for manufacturing the same.

  Currently, as a memory card using a semiconductor flash memory chip, a normal size memory card to be mounted on a personal computer and a small size small memory card to be mounted on a mobile phone, a digital camera, etc. are commercially available.

  1A, 1B, 2 and 3 show a conventional small memory card 1 as an example. 1A is a perspective view of the memory card 1, FIG. 1B is a perspective view showing the memory card 1 in an inverted state, and FIG. 2 is an exploded view of the memory card 1 in the posture shown in FIG. 3 is a cross-sectional view taken along line III-III in FIG.

  The memory card 1 has a structure in which a memory chip module 10 is accommodated between a lower case 2 and an upper case 5. The lower case 2 has a cutout window 3 on the tip side. The lower case 2 and the upper case 5 are welded at their peripheral portions. Reference numeral 20 denotes a welded portion.

  The memory chip module 10 includes a semiconductor flash memory chip 12 and a control chip 13 mounted on the upper surface 11a of the printed circuit board 11 in FIG. 2, and a plurality of the memory chip modules 10 along the edge 11c at the tip of the upper surface 11a of the printed circuit board 11. The pad-shaped terminals 15 are formed side by side.

A pad-like terminal 15 is exposed from the cutout window 4 of the lower case 2 of the memory card 1.
Japanese Examined Patent Publication No. 6-62026

In order to manufacture this memory card 1, the memory chip module 10, which is individualized together,
A lower case 2 and an upper case 5 are prepared, and a step of setting the memory chip module 10 on the lower case 2, a step of covering the upper case 5, and a step of welding the surrounding portions are required. Moreover, the memory cards 1 are manufactured one by one through these three steps. For this reason, the manufacturing cost of the memory card 1 is high.

  Therefore, an object of the present invention is to provide a memory card made in view of the above points and a method for manufacturing the same.

The present invention includes a memory chip module in which a memory chip is mounted on a printed circuit board chip in which a terminal portion is formed on an end side , which includes a tie bar cutting portion formed by cutting a tie bar included in a printed circuit board,
The memory chip module comprises a memory card body that packages the terminal part and the tie bar cutting part to be exposed,
The memory card main body is a portion formed by insert molding with respect to the memory chip module.

  According to the present invention, since the memory card body is packaged so that the terminal portion is exposed, the memory card body is a portion formed by insert molding with respect to the memory chip module, so a large number of pieces can be obtained. Thus, the manufacturing cost can be reduced as compared with the conventional structure in which the upper and lower cases are welded to accommodate the memory card main body.

  Next, an embodiment of the present invention will be described.

  4A and 4B show a small memory card 30 according to the first embodiment of the present invention. 4A is a perspective view of the memory card 30, FIG. 4B is a perspective view showing the memory card 30 in a state where the memory card 30 is reversed, and FIG. 5 is a cross-sectional view taken along VV in FIG. 4B. .

  The memory card 30 is an SD card (trade name) and has a configuration in which the memory chip module 40 is packaged inside the memory card main body 50.

  The memory card body 50 is a resin portion formed by insert molding of the memory chip module 40, and forms the outer shape of the memory card 30, and includes a front surface 51, a back surface 52, side surfaces 53 and 54, a back surface 56, and a front end surface 57. Have The memory card main body 50 has a window portion 58 on one end side of the back surface 52, and a plurality of pad-like terminals 55 are exposed from the window portion 58.

  As shown in FIG. 8, the memory chip module 40 has a semiconductor flash memory chip 42 and a control chip 43 mounted on the upper surface 41a of the polyimide printed circuit board chip 41 in FIG. A plurality of pad-like terminals 55 are formed side by side along the edge 41c at the tip of the upper surface 41a of the chip 41.

  The pad-like terminal 55 is exposed from a window 58 formed in the memory card main body 50.

  The back surface 56 has a gate cutting portion 60 and a tie bar cutting portion 61 is exposed.

  On side surfaces 53 and 54, tie bar cutting portions 62 and 63 are exposed, respectively.

  As will be described later, since the tie bar is made of polyimide and is an insulator, the memory card 30 is used when the memory card 30 is used even if the tie bar cutting portions 61, 62, 63 are exposed on the peripheral side surface of the memory card 30. Even if the person is charged with static electricity, the static electricity does not flow into the memory card 30 through the tie bar cutting portions 61, 62, 63, and thus the semiconductor flash memory chip 42, the control chip 43, etc. No accidents that are destroyed by

  FIG. 6 shows a manufacturing process of the memory card 30.

  As will be described below, ten memory cards 30 are manufactured.

  First, a printed circuit board 70 shown in FIG. 7 is prepared. The printed circuit board 70 is made of, for example, epoxy or polyimide, and is formed by punching out a printed circuit board on which a pattern is formed. Ten printed circuit board chips 41-1 to 41-10 are arranged in groups of five. It is the composition which is. The printed circuit board chips 41-1 to 41-5 are arranged in a line along the Y1 side of the crossing bar 72, and the printed circuit board chips 41-6 to 41-10 are arranged in a line along the Y2 side of the crossing bar 72. .

  The printed circuit board 70 includes a frame portion 71, printed circuit board chips 41-1 to 41-10, a transverse bar 72 that crosses the frame portion 71 in the X direction, and tie bars 73, 74, and 75. Each printed circuit board chip 41-1 to 41-10 is supported on three sides by three tie bars 73, 74, 75. The tie bar 73 extends between the printed circuit board chips 41-1 to 41-10 and the crossing bar 72, and the tie bars 74 and 75 are between and adjacent to the printed circuit board chip 41-1 and the frame portion 71. It extends between the matching printed circuit board chips 41-1 and the like. The tie bar 73 supports the printed circuit board chips 41-1 to 41-10 with respect to the cross bar 72, and the tie bars 74 and 75 are the printed circuit board chips 41-1 to 41-5 and 41-6 to 41-10. The position is determined by restraining the displacement in the X1-X2 direction.

  As shown in an enlarged view in FIG. 7, a plurality of pad-like terminals 55 are formed side by side along the edge 41c of the tip on the upper surface 41a of the printed circuit board chip 41-1, and a tie bar 73 extends. On the side, a pad 80 for mounting a control chip is formed, and a pad 81 for mounting a semiconductor flash memory chip is formed between the pad-like terminal 55 and the pad 80 and between them. The printed circuit board chips 41-2 to 41-5 are provided with pad-like terminals 55 and pads 80 and 81 as in the printed circuit board chip 41-1.

  The printed circuit board chips 41-6 to 41-10 have pad-like terminals 55 and pads 80 and 81 on the printed circuit board chips 41-2 to 41-5 centered on points O1 to O5 on the cross bar 72, respectively. The pad-like terminal 55 and the pads 80 and 81 are formed in a point-symmetric arrangement.

  First, the chip mounting process 100 is performed.

  The printed circuit board 70 is set in a chip mounting apparatus, and as shown in FIG. 8, the semiconductor flash memory chip 42, the control chip 43, etc. are flip-chip bonded onto all the printed circuit board chips 41-1 to 41-10. Thus, the memory chip module printed circuit board 90 in which the memory chip modules 40-1 to 40-10 are arranged is manufactured.

  Next, an insert molding step 101 is performed.

  The memory chip module printed circuit board 90 is positioned and placed on the molding lower mold 110 of the resin sealing device, and the molding upper mold 120 is lowered and set. The molding dies 110 and 120 have cavities, runners, gates, air vents and the like corresponding to the printed circuit board chips 41-1 to 41-10 formed on the surfaces to be attached.

  FIG. 9 shows an enlarged view of the relationship between the molding dies 110 and 120 of one memory chip module 40-1. The printed circuit board chip 41-1 includes the tie bars 73, 74, and 75 sandwiched between the molding lower mold 110 and the molding upper mold 120, and the cavity 111 and the molding upper mold of the molding lower mold 110. The mold 120 is supported in the cavity 130 formed by combining with the cavity portion 121 of the mold 120. A vacuum pump (not shown) is connected to the molding upper mold 120, and the pad-like terminal 55 is vacuum-sucked by a suction port 122 formed in the molding upper mold 120 to be a surface of the molding upper mold 120. 123 is in close contact.

  The other printed circuit board chips 41-2 to 41-10 are also supported in the cavity in the same manner as the printed circuit board chip 41-1.

  The plunger (not shown) of the resin sealing device is driven, and a thermosetting resin (for example, epoxy resin) heated to the molding temperature is poured into the cavities 130 through the runner and gate with the plunger. FIG. 10 shows a state where the thermosetting resin occupies the cavity 130 and covers the printed circuit board chip 41-1, the semiconductor flash memory chip 42, and the control chip 43. The pad-shaped terminal 55 is adsorbed and adhered to the surface 123 of the molding upper mold 120, and the thermosetting resin does not enter the pad-shaped terminal 55. Thereafter, curing is performed as appropriate.

  Next, a mold release step 102 is performed.

  The molding upper mold 120 is raised and the insert molded product is pushed up from the molding lower mold 110 to release the insert molded product.

  FIG. 11 shows an unprinted memory card printed circuit board 140, which is a release insert molded product. The unprinted memory card printed circuit board 140 has a configuration in which unprinted memory cards 30A-1 to 30A-5 and 30A-6 to 30A-10 are connected side by side along both sides of the crossing bar 72. 141 is a runner trace portion formed by a runner, and 142 is a gate trace portion formed by a gate. FIG. 12 shows an enlarged part of FIG.

  Next, a marking process 103 is performed.

  The unprinted memory card printed circuit board 140 is set in a printing apparatus (not shown), and the marks 160 are printed at once on the upper surfaces of all the memory cards 30A-1 to 30A-10.

  FIG. 13 shows the memory card printed circuit board 150 on which the mark 160 is printed. Marks 160 are printed on the upper surfaces of all the memory cards 30A-1 to 30A-10, and the memory cards 30-1 to 30-5 and 30-6 to 30-10 are arranged along both sides of the crossing bar 72. It is the structure which is connected. FIG. 14 is an enlarged view of a part of FIG.

  Here, since the printing of the mark 160 is performed collectively on the upper surfaces of all the memory cards 30A-1 to 30A-10, the number of man-hours is small compared with the case where the marks 160 are printed one by one.

  Finally, the singulation process 104 is performed.

  The memory card printed circuit board 150 is set in a cutting device (not shown), and the gate trace portion 132 and the three tie bars 73, 74, 75 are cut.

As a result, the memory cards 30-1 to 30-10 are separated from the printed circuit board 70,
After being separated into individual pieces, the memory card 30 shown in FIGS. 4 and 5 is manufactured.

  Since ten memory cards 30-1 to 30-10 can be manufactured by one insert molding and one printing, and the welding process is unnecessary, the manufacturing cost of the memory card 30 is as shown in FIG. The cost is lower than the manufacturing cost of the conventional memory card 1 shown in FIG.

  The above manufacturing method can also be applied to the manufacture of a memory stick (trade name).

  15A and 15B show a small memory card 30B according to the second embodiment of the present invention.

  As shown in an enlarged view in FIG. 16, the tie bars 73B, 74B, and 75B of the printed circuit board 70B have long slits 170, 171, and 172 in the longitudinal direction of the tie bar, respectively.

  Therefore, compared to the memory card 30 shown in FIG. 4, two tie bar cutting portions 61B-1, 61B-2, 62B-1, 62B-2, 63B-1, and 63B-2 are arranged side by side. Therefore, compared with the memory card 30 shown in FIG. 4, the tie bar cutting part is less noticeable.

FIG. 2 shows a conventional memory card, in which (A) is a perspective view and (B) is a perspective view in an inverted posture. It is a disassembled perspective view of the conventional memory card. FIG. 3B is a cross-sectional view taken along line III-III in FIG. BRIEF DESCRIPTION OF THE DRAWINGS The memory card which becomes Example 1 of this invention is shown, (A) is a perspective view, (B) is a perspective view of the attitude | position reversed front and back. It is sectional drawing which follows the VV line in FIG.4 (B). It is a manufacturing process figure of a memory card. It is a figure which shows a printed circuit board. It is a figure which shows a memory chip module printed circuit board. It is a figure which expands and shows the relationship between one memory chip module and a shaping die at the time of setting a memory chip module printed circuit board to a shaping die. It is a figure which expands and shows the state by which the memory chip module was insert-molded. It is a figure which shows an unprinted memory card printed circuit board. It is a figure which expands and shows a part of unprinted memory card printed circuit board of FIG. It is a figure which shows a memory card printed circuit board. It is a figure which expands and shows a part of memory card printed circuit board of FIG. The memory card which becomes Example 2 of this invention is shown, (A) is a perspective view, (B) is a perspective view of the attitude | position reversed front and back. It is a figure which expands and shows a part of printed circuit board.

Explanation of symbols

30, 30-1 to 30-10, 30B Memory card 30A-1 to 30A-10 Unprinted memory card 40 Memory chip module 41, 41-1 to 41-10 Printed circuit board chip 42 Semiconductor flash memory chip 43 Control chip 50 Memory card body 51 Front surface 52 Back surface 53, 54 Side surface 55 Pad-like terminal 56 Back surface 57 Front end surface 58 Window portion 60 Gate cutting portion 61, 62, 63, 61B-1 to 66B-2 Tie bar cutting portion 70, 70B Printed circuit board 71 Frame part 72 Crossing bar 73, 74, 75, 73B, 74B, 75B Tie bar 80 Pad for mounting control chip 81 Pad for mounting semiconductor flash memory chip 100 Chip mounting process 101 Insert molding process 102 Mold release process 103 Mark Process 104 singulation process 110 molding upper mold 120 molding lower mold 122 suction port 130 cavity 140 unprinted memory card printed circuit board 141 runner trace part 142 gate trace part 150 memory card printed circuit board 160 mark 170,171 , 172 Slit

Claims (6)

A memory chip module including a tie bar cutting portion formed by cutting a tie bar included in a printed circuit board, a memory chip mounted on a printed circuit board chip having a terminal portion formed on an end side, and
The memory chip module comprises a memory card body that packages the terminal part and the tie bar cutting part to be exposed,
The memory card body is a portion formed by insert molding with respect to the memory chip module. A memory chip module is formed by mounting a memory chip on each printed circuit board chip in a shape in which a plurality of printed circuit board chips having terminal portions formed on the end side are supported and aligned by tie bars. A memory chip mounting process for manufacturing a memory chip module printed circuit board supported and aligned by a tie bar; and
The memory chip module printed circuit board is set in a molding die, insert molding is performed, and a memory card body that is packaged so that the terminal portion and the tie bar are exposed to each memory chip module is molded, An insert molding process for manufacturing a memory card printed circuit board in which a plurality of memory cards are supported and aligned by the tie bars;
A memory card comprising: a memory card separating step of cutting the tie bar of the memory card printed circuit board to separate the memory card from which the tie bar cutting portion formed by cutting the tie bar is exposed. Card manufacturing method. In the manufacturing method of the memory card according to claim 2,
The printed circuit board has a frame portion and a crossing bar that crosses the frame portion,
Manufacturing of a memory card, characterized in that the printed circuit board chip is supported by the tie bar with respect to the crossing bar and arranged along the crossing bar on both sides of the crossing bar. Method. In the manufacturing method of the memory card according to claim 2,
The method of manufacturing a memory card, wherein the tie bar of the printed circuit board has a shape having a slit. In the manufacturing method of the memory card according to claim 2,
The molding die used in the insert molding step is configured to have a suction port for sucking the terminal portion of the printed circuit board chip,
A method of manufacturing a memory card, characterized in that the insert molding step is performed in a state where the terminal portion of the printed circuit board chip is vacuum-sucked by the suction port and is in close contact with the surface of the molding die. . In the manufacturing method of the memory card according to claim 2,
Between the insert molding step and the memory card singulation step,
A method of manufacturing a memory card, further comprising a marking step of performing printing on all the memory cards of the memory card printed circuit board at a time.

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