JP5125365B2 - IC card and IC card manufacturing method - Google Patents

Description

  The present invention relates to an IC card equipped with an IC module composed of an IC chip, an antenna, and the like, and more particularly to an IC card equipped with an IC module excellent in durability and reliability, and a method for manufacturing the IC card.

  Recently, students can exchange data just by holding an IC card with an IC chip with a unique identification number that can be contactlessly communicated with each scanner, and can also be applied to conventional magnetic recording card readers. In addition, security systems for entrance / exit management of employee ID cards, gate opening / closing systems for parking lots, applications related to traffic such as commuter passes, and IC cards equipped with IC modules such as electronic money and credit cards are used.

  In order to improve durability and reliability of IC cards equipped with these IC modules, methods for mounting IC modules on various cards have been studied. In other words, in order to prevent the IC module from falling off the card base while the IC card is in use or being damaged by insertion and removal with an ATM (Automatic teller machine), various research / Improvements are being made.

A method for mounting an IC module on a card will be described.
Conventionally, an IC module is mounted on a card by a method in which a concave portion is formed on a card substrate by milling or the like, and the IC module is embedded in the concave portion.
An example of the recess shape is shown in FIGS. 5A and 5B, and an example in which the IC module is mounted in the recess 120 is shown in FIG.
The recess 120 includes a first recess 121 and a second recess 122 formed at predetermined positions of the card base 111, and the module substrate of the IC module 200 is attached to the first recess 121 as a hot melt adhesive layer. The mold part of the IC module 200 was stored in the second recess 122 by adhesion and fixing at 131.

  In mounting the IC module 200 in the recess 120 of the card base 111, the thickness of the lower portion of the second recess 122 after the second recess 122 is formed in the card base 111 is the total thickness of the card base. However, in recent years, bank-based magnetic cards have been converted into IC cards for strengthening security and used in ATMs under the same conditions as magnetic cards. It has come to be.

  In addition, in the ATM transport mechanism installed for the magnetic card, a card transport roller or the like is disposed in the vicinity of the RFU terminal of the external connection terminal 131 of the IC card 110 shown in FIG. The problem that cracks are likely to occur at the corners of the second recesses of the card base 111 of the IC card 110 in the product has become clear (see FIGS. 5A and 5C).

An IC card and an IC card manufacturing method for improving the above problems have been proposed (see, for example, Patent Document 1).
As shown in FIG. 4 (b), an IC module having a mold resin portion (convex curved surface) is mounted on a card substrate with respect to the module substrate, and the cross section of the concave hole formed in the card substrate is shown in the IC module. By adopting a shape (stepped mortar shape) that approximates the curved surface of the mold resin, it is possible to provide a highly durable IC card for the ATM insertion / extraction test.

However, in recent years, an IC module used for an IC card is generally manufactured by mounting an IC on a substrate having an external connection terminal and then encapsulating it in a substantially rectangular shape with a transfer mold or a potting mold. Therefore, the technology disclosed in the previous example cannot be applied to these general IC modules.
JP 2003-308505 A

  The present invention has been devised in view of the above problems, and by adding a device to the concave shape of the card base on which the IC module is mounted, an IC module excellent in durability and reliability with respect to the ATM insertion / extraction test is obtained. An object is to provide a mounted IC card and a method of manufacturing the IC card.

  In order to achieve the above object in the present invention, first, in claim 1, a first concave portion 21 formed on one surface of the card substrate 11, a second concave portion 22, and a curved shape on the side surface. The IC module 30 having the convex mold resin portion 32 is fixed and mounted via the hot melt adhesive layer 41a in the concave portion 20 including the third concave portion 23 having at least one convex portion 23a. This is a characteristic IC card.

According to a second aspect of the present invention, there is provided an IC card manufacturing method comprising at least the following steps.
(A) At least one first concave portion (21), second concave portion (22), and curved convex portion (23a) are provided on a side surface by milling at a predetermined position of the card substrate (11). Forming a recess (20) comprising a third recess (23);
(B) The external connection terminal (33) is provided on one side of the substrate (31) of the IC module (30), and the mold resin part (32) is provided on the other side. The mold resin part (32 of the IC module (30)) A step of producing an IC module (30a) in which a hot-melt adhesive sheet (41) is temporarily fixed to the outer peripheral portion of the peripheral substrate (31) on the () side.
(C) The first concave portion (21) of the card base (11) and the hot melt adhesive sheet (41) on the peripheral portion of the peripheral substrate (31) on the mold resin portion (32) side of the IC module (30). The IC module (30) is fixed and mounted in the recess (20) of the card base (11) by placing the IC module (30) opposite to each other and applying pressure and heating from the external connection terminal (33) side of the IC module (30). Process.

  Since the IC card of the present invention has at least one curved convex portion in the third concave portion of the card base, the stress is dispersed when bending stress is applied to the IC card, and the card base Cracks can be prevented from occurring at the corners of the third recess, and cracks can also be prevented from occurring at the corners of the third recess in the ATM transport test.

Hereinafter, embodiments of the present invention will be described.
FIG. 1A is a schematic top view showing an embodiment of an IC card according to the present invention, and FIG. 1B is a partial schematic cross-sectional view of FIG. 1A taken along line AA ′. .
The IC card 100 of the present invention according to claim 1 includes at least one first concave portion 21 formed on one surface of the card base 11, a second concave portion 22, and a curved convex portion 23a on a side surface. An IC module 30 having a convex mold resin portion 32 is fixed and mounted on a recess 20 composed of a third recess 23 having a hot melt adhesive layer 41a.
Since the IC card 100 of the present invention has at least one curved convex portion 23a in the third concave portion 23 of the card base 11, the stress is dispersed when bending stress is applied to the IC card 100. It is possible to prevent cracks from occurring at the corners of the third recess 23 of the card substrate 11 and to prevent cracks from occurring at the corners of the third recess 23 in the ATM transport test. it can.

A method for manufacturing an IC card according to claim 2 will be described.
2A to 2C are explanatory views showing an embodiment of the IC card manufacturing method of the present invention in the order of steps. FIG. 2A shows a third concave portion 23 having at least one first concave portion 21, a second concave portion 22, and a curved convex portion 23a on a side surface by milling at a predetermined position of the card base 11. 2 (a-1) is a schematic top view of the card substrate 11, and FIG. 2 (a-2) is a cross-sectional view taken along line AA ′. It is the partial model structure sectional view cut. 2B-1 is a schematic cross-sectional view of the IC module 30, and FIG. 2B-2 shows a hot melt adhesive sheet 41 on the outer periphery of the substrate 31 on the side of the mold resin portion 32 of the IC module 30. It is a schematic structure sectional view of IC module 30a temporarily fixed.
FIG. 2C is a partial schematic cross-sectional view of the IC card 100 in which the IC module 30 is mounted in the concave portion 20 of the card base 11.

First, 0.2 to 0.27 mm depth from the card substrate surface by milling using an end mill with a blade tip diameter of 1 mmφ to 2 mmφ at a predetermined position of the card substrate 11 made of a material such as PVC, ABS, or PET-G. Of the first concave portion 21, the second concave portion 22 having a depth of 0.45 to 0.55 mm from the surface of the card substrate, and at least one curved convex portion 23 a on the side surface. A recess 20 for mounting the IC module 30 including the third recess 23 having a depth of 0.57 to 0.65 mm is formed (see FIGS. 2A-1 and 2A-2).
Here, an example is shown in which one curved convex portion 23a is provided on the side surface of the third concave portion 23 on each of the upper side and the lower side, but this is merely an example, and the curved convex portion 23a is an IC. It can be set appropriately according to the shape of the module 30.

  Next, the hot melt adhesive sheet 41 is temporarily fixed at a predetermined temperature to the outer periphery of the peripheral substrate 31 on the mold resin portion 32 side of the IC module 30, and the hot melt adhesive sheet 41 is temporarily attached to the peripheral portion of the substrate 31 of the IC module 30. The stopped IC module 30a is manufactured (see FIGS. 2B-1 and 2B-2).

  Next, it arrange | positions so that the 1st recessed part 21 of the card | curd base material 11 and the hot-melt-adhesive sheet | seat 41 of the peripheral board | substrate 31 periphery of the mold resin part 32 side of IC module 30 may oppose, By pressing and heating with a head heated to a predetermined temperature from the connection terminal 33 side, the IC module 30 is fixed to the first recess 21 of the card base 11, and a curved shape is formed on the side of the card base 11. It is possible to obtain the IC card 100 in which the IC module 30 is mounted in the concave portion 20 in which the third concave portion 23 having at least one convex portion 23a is formed (see FIG. 2C).

  According to the configuration of the IC card 100, since the curved convex portion 23a is provided on the side surface of the third concave portion 23 on each of the upper side and the lower side, the third concave portion is formed by a substantially rectangular straight line. Compared to the state where the bending force is applied to the IC card 100 or the pressure applied by the ATM is applied, the stress can be dispersed and the stress is absorbed at the corners of the second recess 22. Therefore, it is possible to prevent the stress from concentrating on the third recess 23 and causing cracks.

  Hereinafter, the present invention will be described in detail by way of examples.

First, at a predetermined position of the card base 11 made of PVC material and having a thickness of 0.8 mm, the blade tip diameter is 3 mm.
By milling using a φ end mill, a first recess 21 having a depth of 0.2 mm from the surface of the card substrate, a second recess 22 having a depth of 0.4 mm from the surface of the substrate, and a curved protrusion on the side surface A concave portion 20 for mounting an IC module 30 having two convex portions 23a having a height of 0.4 mm and two third concave portions 23 having a depth of 0.5 mm from the surface of the card base is formed. (See FIG. 2 (a) -1 and FIG. 2 (a) -2).

  Next, a hot-melt adhesive sheet 41 having a thickness of 0.5 mm is temporarily fixed at 120 ° C. to the outer peripheral portion of the peripheral substrate 31 on the mold resin portion 32 side of the IC module 30, and hot-melt bonding is performed to the peripheral portion of the substrate 31 of the IC module 30. An IC module 30a on which the sheet 41 was temporarily fixed was manufactured (see FIGS. 2B-1 and 2B-2).

  Next, it arrange | positions so that the 1st recessed part 21 of the card | curd base material 11 and the hot-melt-adhesive sheet | seat 41 of the peripheral board | substrate 31 periphery of the mold resin part 32 side of IC module 30 may oppose, The IC module 30 is fixed to the first recess 21 of the card base 11 by pressing and heating with a head heated to 170 ° C. from the side of the connection terminal 33, and on the side surface of the card base 11. An IC card 100 was obtained in which the IC module 30 was mounted in the concave portion 20 in which the third concave portion 23 having one curved convex portion 23a on each of the upper side and the lower side was formed (see FIG. 2C).

  Repeated bending test based on the IC card bending test defined in JIS X6303, the IC card 100 obtained in Example 1 above and the conventional IC card formed only by the first recess and the second recess, An ATM conveyance test was performed. The results are shown in Table 1.

As the above test results show, no effective difference was found in the repeated bending test, but a significant effect was seen in the ATM transport test, and the IC card 100 had cracks in the corners of the third recess. Not confirmed.

(A) is a schematic top view which shows one Example of the IC card of this invention. (B) is a partial schematic cross-sectional view of an IC card obtained by cutting (a) along the line A-A ′. (A)-(c) is explanatory drawing which shows one Example of the manufacturing method of the IC card of this invention in order of a process. (A) From the 1st recessed part 21, the 2nd recessed part 22, and the 3rd recessed part 23 which has at least one curved-shaped convex part 23a on the side by milling in the predetermined position of the card | curd base material 11 (A-1) is a schematic top view of the card substrate 11, and (a-2) is a partial schematic configuration cross-sectional view of (a-1) cut along the AA 'line. It is. (B-1) is a schematic cross-sectional view of the IC module 30, and (b-2) is an IC in which a hot-melt adhesive sheet 41 is temporarily fixed to the outer peripheral portion of the peripheral substrate 31 on the mold resin portion 32 side of the IC module 30. It is a schematic structure sectional view of module 30a. (C) is a partial schematic cross-sectional view of the IC card 100 in which the IC module 30a is mounted in the recess 20 of the card base 11. It is a schematic top view which shows an example of the contact location of the conveyance roller of the ATM conveyance mechanism with respect to an IC card. (A) is a schematic top view which shows an example of IC module mounting of the conventional IC card. (B) is a schematic schematic cross-sectional view showing an example of mounting an IC module of a conventional IC card. (A) is a schematic top view which shows an example of the conventional card | curd in which the recessed part which consists of a 1st recessed part and a 2nd recessed part was formed in the card | curd base material. (B) is a partial schematic cross-sectional view of a conventional card obtained by cutting (a) along the line A-A ′. (C) It is a partial schematic cross-sectional view showing an example of an IC card in which an IC module is mounted on a concave portion formed of a first concave portion and a second concave portion on a card substrate.

Explanation of symbols

11, 111... Card base material 20, 120... Recess 21, 121... First recess 22, 122... Second recess 23. ... IC module 31 ... Substrate 32 ... Mold resin part 33, 201 ... External connection terminal 41 ... Hot melt adhesive sheet 42a, 131 ... Hot melt adhesive layer 100, 110 ... IC card

Claims (2)

  A third recess having a first recess (21), a second recess (22) formed on one surface of the card substrate (11), and at least one curved protrusion (23a) on the side surface. An IC module (30) having a convex mold resin portion (32) is fixed and mounted via a hot melt adhesive layer (41a) in a concave portion (20) comprising the concave portion (23). IC card to do. An IC card manufacturing method comprising at least the following steps.
(A) At least one first concave portion (21), second concave portion (22), and curved convex portion (23a) are provided on a side surface by milling at a predetermined position of the card substrate (11). Forming a recess (20) comprising a third recess (23);
(B) The external connection terminal (33) is provided on one side of the substrate (31) of the IC module (30), and the mold resin part (32) is provided on the other side. The mold resin part (32 of the IC module (30)) A step of producing an IC module (30a) in which a hot-melt adhesive sheet (41) is temporarily fixed to the outer peripheral portion of the peripheral substrate (31) on the () side.
(C) The first concave portion (21) of the card base (11) and the hot melt adhesive sheet (41) on the peripheral portion of the peripheral substrate (31) on the mold resin portion (32) side of the IC module (30). The IC module (30) is fixed and mounted in the recess (20) of the card base (11) by placing the IC module (30) opposite to each other and applying pressure and heating from the external connection terminal (33) side of the IC module (30). Process.