JP2000306068A - Production of hybrid ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an efficient method by which an antenna terminal and an IC module are formed at exact positions by sealing an inlet at a fixed position with a resin without damaging the antenna terminal and an antenna. SOLUTION: An inlet 10 having the antenna and an antenna terminal 13 is arranged while being tightly adhered to a first upper die and aligned with a lower die, the resin for molding is injected to a cavity between both the dies and an auxiliary card substrate is formed by integrally molding the inlet 10 and the resin. Afterwards, a second upper die having a projecting part for forming a recessed part in desired shape and the lower die with the auxiliary card substrate arranged therein are aligned, the resin for molding is injected to a cavity between both the dies and a main body 30 of IC card having the recessed part in the desired shape is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hybrid IC card which can be used in both a contact type and a non-contact type.

[0002]

2. Description of the Related Art In recent years, a hybrid IC card having both a contact type and a non-contact type has been attracting attention instead of a conventional contact type IC card and a non-contact type IC card with an antenna.

[0003] This hybrid IC card connects a contact IC module and a non-contact type inlet with an antenna and shares one IC chip information, so that both the contact type and the non-contact type can be used. It was made possible.

[0004] Such a hybrid IC card is
For example, an inlet provided with an antenna and an antenna terminal is sandwiched between two pieces of vinyl chloride resin, laminated and buried in the resin, and then the resin is ground to expose the antenna terminal, thereby forming a concave portion corresponding to an IC module. Is formed by carrying out a counterboring process for forming the IC module and storing the IC module in the obtained concave portion.

However, in the method of manufacturing an IC module using counterboring, the antenna terminal and the antenna are easily damaged during grinding, and the antenna is adversely affected by heating and pressing during lamination. Further, the heating and pressing, and the thickness of the inlet is, for example, 2
When the thickness is 0 to 30 μm, the inlet is misaligned in the resin in the vertical, horizontal, and height directions in the resin at the time of manufacture due to a variation of about 50 μm in the thickness of the vinyl chloride resin sheet used. Therefore, it is difficult to form the antenna terminal at a fixed position of the IC card. Also, IC
Counterboring, which individually grinds the card compact, takes time, and the above-mentioned defects are likely to occur.
The production efficiency was poor and it was not suitable for mass production.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and allows an inlet to be resin-sealed at a fixed position without damaging an antenna terminal and an antenna. It is an object of the present invention to provide a method of manufacturing a hybrid IC card which can be formed at any position and has good production efficiency.

[0007]

According to the present invention, first, an inlet having an antenna and an antenna terminal connected to the antenna, an external connection terminal having a built-in IC chip and connecting to an external device, and a multi-end face are provided. A first upper mold and a lower mold having at least one of said IC card-shaped recesses in at least one of said first and second molds. Preparing a step of placing the inlet on the bottom of the first upper mold in close contact with the antenna terminal facing upward, aligning and positioning the first upper mold and the lower mold, Forming a first cavity between the two molds, injecting a molding resin into the cavity, integrally molding the inlet and the molding resin to form a spare card base material, A second upper mold having an IC card-shaped recess and a protrusion formed in the recess and corresponding to the IC module shape, and the lower mold having the spare card base material are aligned. Arranging and forming a second cavity between both molds, injecting a molding resin into the second cavity, integrally molding the spare card base material and the resin to have a shape suitable for the IC module. Forming an IC card main body having a concave portion, and joining the IC module into a concave portion having a shape adapted to the IC module.
Provided is a method for manufacturing a C card.

The present invention provides, in a second aspect, an inlet having an antenna and an antenna terminal connected to the antenna;
Built-in C chip, external connection terminal to connect with external equipment,
And an IC module having an IC module having a contact pad connected to the antenna terminal, comprising: a first upper mold having a first recess having a shape of the IC card; A step of arranging the inlet in close contact with the bottom of the first mold with the antenna terminal facing up, with the first concave part facing down,
Disposing a lower mold provided with the IC card-shaped second concave portion with the first concave portion and the second concave portion being aligned, and disposing the lower die between the first concave portion and the second concave portion. Injecting a molding resin into the cavity and integrally molding the inlet and the resin to form a spare card base; a third recess of the IC card shape; and the IC formed in the third recess. A second upper mold having a convex portion corresponding to a module shape and the lower mold having the spare card base are arranged by aligning the third recess with the spare card base. Injecting a molding resin into the cavity between the third concave portion and the spare card base material, integrally molding the spare card base material and the resin, and forming a fourth resin having a shape suitable for the IC module.
Forming an IC card main body having a concave portion, and joining the IC module in the fourth concave portion.

[0009] Third, the present invention provides an IC having an antenna, an antenna terminal connected to the antenna, an inlet having a joint hole with an IC module, and an IC chip.
To manufacture an IC card including an external connection terminal connected to an external device on one end surface of the module main body, and an IC module provided with a contact pad connected to the antenna terminal and a projection adapted to the joint hole on the other end surface. The method according to claim 1, wherein the first upper mold having the first concave portion having the IC card shape and the first convex portion provided in the first concave portion and having a shape adapted to the joining hole is provided. With the first concave part down,
A step of disposing the inlet with the antenna terminal facing upward and the joint hole in close contact with the first protrusion, at the bottom of the first upper mold; A lower mold provided with the IC card-shaped second concave portion,
Positioning the first recess and the second recess in alignment with each other, injecting molding resin into a cavity between the first recess and the second recess, and integrally molding the inlet and the resin; Forming a spare card base, a third recess having the IC card shape, and the IC provided in the third recess.
A second upper mold having a second projection having at least a two-stage projection shape in which projections corresponding to the bonding holes are superimposed on projections corresponding to the module body shape, and a spare card base material is arranged. Positioning the lower mold with the projection and the joining hole and aligning the third recess with the spare card base; and positioning the third recess with the spare card base. Injecting a molding resin into the cavity between them, and integrally molding the spare card base material and the resin to form an IC card main body having a fourth concave portion shaped to fit the IC module; and A method of manufacturing a hybrid IC card, comprising the step of joining the IC module in a recess.

[0010] Fourth, the present invention provides an antenna, an antenna terminal connected to the antenna, an inlet having a joint hole with the IC module, and an external connection terminal connected to an external device on one end surface of the IC module body. And a locking portion extending horizontally from the peripheral portion to the end surface, and a projection having a built-in contact pad connected to the antenna terminal and an IC chip adapted to the bonding hole is provided on the other end surface facing the locking portion. For manufacturing an IC card including an integrated circuit module and a first concave portion having the IC card shape and a first concave portion provided in the first concave portion and having a shape adapted to the joining hole. A first upper mold having a convex portion is placed on the bottom of the first upper mold with the first concave portion facing down, the inlet with the antenna terminal facing upward, and the joining hole in the first upper mold. With the convex part of Attaching and disposing the first upper mold and the lower mold having the IC card-shaped second concave portion by aligning the first concave portion and the second concave portion. Disposing a molding resin into a cavity between the first concave portion and the second concave portion, and integrally molding the inlet and the resin to form a spare card base material;
A card-shaped third concave portion, and a protrusion provided in the third concave portion and corresponding to the locking portion, a protrusion corresponding to the IC module main body shape, and a protrusion matching the joint hole are overlapped. A second projection having a second projection having a three-step projection shape;
The upper mold and the lower mold on which a spare card base material is arranged are arranged with the projections and the joining holes fitted, and the third recess and the spare card base material are aligned. Process,
An IC card having a fourth concave portion shaped to fit the IC module by injecting molding resin into the cavity between the third concave portion and the spare card base material and integrally molding the spare card base material and the resin. Forming a main body; and joining the IC module in the fourth recess.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of the present invention comprises three molds for forming an IC card shape, namely, a lower mold and, if necessary, a convex portion for forming a concave portion of a desired shape on an antenna terminal. The first upper mold and the second upper mold provided are used, and basically, (1) an antenna and an inlet having an antenna terminal connected to the antenna are brought into close contact with the first upper mold. (2) aligning and positioning the first upper mold with the lower mold, and (3) injecting molding resin into the cavity between the first upper and lower molds. Forming a spare card base by integrally molding the inlet and the resin; (4) aligning and arranging the second upper mold and the lower mold having the spare card base;
(5) a step of injecting a molding resin into a cavity between the second upper mold and the lower mold to form an IC card main body having a recess of a desired shape, and (6) a step of forming an IC card body having a recess of a desired shape. It includes a step of joining the IC module.

The inlet means a structure in which an antenna and an antenna terminal are formed on a surface of an insulating substrate such as a resin sheet by, for example, printing or photolithography.

Further, the steps (1) to (3) and (4)
The steps (6) to (6) can be continuously performed by automatically replacing the upper mold with the first upper mold with the second upper mold. Alternatively, after repeating the steps (1) to (3), using the obtained spare card base material,
Or (6) Step can be performed continuously.

According to this method, as shown in the steps (1) to (3), the inlet is arranged in close contact with the first upper mold, so that the spare card base material is fixed with the inlet fixed. It is formed and does not cause displacement of the inlet. By using this spare card base material, it is possible to form a highly accurate IC card main body that can accurately form the antenna terminal of the IC card at a predetermined position.

In this method, (4) to (6)
As shown in the process, a desired concave portion can be easily provided on the antenna terminal by using the spare card base material and the second upper mold. In this step, no grinding is performed as in the prior art, and no excessive heating or pressurization is involved, so that the antenna and the antenna terminal are not damaged or adversely affected.

Further, by using this method, a series of manufacturing steps can be performed by injection molding without grinding, and a highly accurate IC card can be manufactured efficiently.

The outer dimensions of the inlet, both vertically and horizontally, are at least 0.5 mm smaller than the outer dimensions of the IC card.
By setting it small, it is possible to sufficiently cover the periphery of the inlet with the molding resin.

The molding resin preferably used in the present invention includes, for example, acrylonitrile butadiene styrene-polycarbonate alloy, acrylonitrile butadiene styrene-polybutylene terephthalate alloy,
Examples include thermoplastic resins such as acrylonitrile butadiene styrene-polycarbonate-polybutylene terephthalate alloy, polycarbonate, and acrylonitrile butadiene styrene.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings.

Embodiment 1 FIGS. 1, 3, 5, 6, and 8 are views for explaining each step of a first example of the method of manufacturing an IC card according to the present invention.

FIG. 2 is a front view for explaining the structure of an example of the inlet used in the present invention.

As shown in FIG. 1, a first upper mold 1 having a first concave portion 3 having the same size as one surface of an IC card.
And a lower mold 2 having a bottom having the same dimensions as one surface of the IC card and a second concave portion 4 having a predetermined height, and one surface of an insulating substrate 11 made of, for example, resin as shown in FIG. An antenna 12 and a pair of antenna terminals 13 are formed thereon, for example, 40 mm × 70 mm in length and width, and a thickness of 20 to 30 mm.
A μm inlet 10 was prepared.

First, the inlet 10 is arranged at a predetermined position of the first upper mold 1 with the antenna terminal 13 facing upward, and air is evacuated from an exhaust hole (not shown) to move the inlet 10 to the first upper mold. 1 was vacuum-adsorbed to the bottom.

Next, by aligning the first concave portion 3 and the second concave portion 4, the first concave portion 3 and the second concave portion 4 are aligned.
The cavity 5 was formed between them. Thereafter, a molding resin is injected into the cavity 5 to be solidified, and the inlet 10 is solidified.
And resin were integrally molded. As shown in FIG. 3, when the first upper mold 1 is removed, the inlet 10 is connected to the antenna terminal 13.
The spare card base material 20 was placed at a predetermined position on the surface with the other side facing up, and the other part was covered with the resin 14.

FIG. 4 is a view of the obtained spare card base material 20 as viewed from above. As shown, the spare card substrate 2
0 is the same as the target IC card in the vertical and horizontal dimensions, the thickness is thinner, and at a predetermined position on the upper surface thereof,
The inlet 10 having the antenna 12 and the antenna terminal 13 was provided on the surface, and the other part was made of resin.

Thereafter, as shown in FIG. 5, a third concave portion 17 having the same bottom as the one surface of the IC card and a predetermined height, and a predetermined position of the third concave portion similar to the IC module are provided. Preparing a second upper mold 15 having a convex portion 16 having an outer shape and a lower mold 2 provided with a spare card base material 20, and aligning the third concave portion 17 with the spare card base material 20. Thereby, the cavity 18 was formed between the third concave portion 17 and the spare card base material 20.

Thereafter, as shown in FIG. 6, a molding resin was injected into the cavity 18 and solidified, and the spare card base material 20 and the resin were integrally molded to obtain an IC card main body 30. FIG. 7 shows a schematic sectional view of the obtained IC card main body 30.

As shown, the IC card main body 30
IC having recess 19 shaped to fit IC module
A configuration including a resin in the shape of a card main body and an inlet including an antenna terminal at the bottom of the concave portion 19, and an inlet 10 embedded in the resin other than that, was provided.

Finally, as shown in FIG.
An IC having an external terminal 23 on its upper surface and a contact pad 21 and an IC chip 22 on its lower surface on a card body 30
By joining the modules 40, for example, about 54.0
mm × 85.6mm × 0.76mm hybrid type I
C card 50 was obtained.

When the IC card was repeatedly manufactured in the same process, the antenna terminal was always formed at a predetermined position on the IC card, and there was no problem in joining with the IC module, and the antenna and the antenna terminal were damaged. It was possible to manufacture efficiently without performing.

Embodiment 2 FIGS. 9, 11, 13, 14, and 16 are diagrams for explaining each step of a second example of the method of manufacturing an IC card according to the present invention.

FIG. 10 is a front view for explaining the structure of another example of the inlet used in the present invention.

As shown in FIG. 9, a first upper mold having a first concave portion 103 having the same dimensions as one surface of the IC card and a first convex portion 26 which fits into the joint hole 27 for the IC module. 101, a lower mold 2 having a bottom having the same dimensions as one surface of the IC card and a second concave portion 4 having a predetermined height, and an insulating substrate 111 made of, for example, resin as shown in FIG. An inlet 110 having, for example, a length of 40 mm × 70 mm and a thickness of 20 to 30 μm, in which the antenna 12, a pair of antenna terminals 13, and a joint hole 27 for an IC module provided between the pair of antenna terminals 13 are formed on the surface, is prepared. did.

First, the inlet 110 is placed at a predetermined position of the first upper mold 1 with the antenna terminal 13 facing upward, and the joint hole 27 is fitted into the first convex portion 26 and arranged. By bleeding air, inlet 11
0 was vacuum-adsorbed to the bottom of the first upper mold 101.

Next, the lower mold 2 is disposed below the first upper mold 101 with the second recess 4 facing upward, and the first recess 103 and the second recess 4 are aligned. By doing
A cavity 105 was formed between the first recess 103 and the second recess 4. Thereafter, a molding resin was injected into the cavity 105 and solidified, and the inlet 110 and the resin were integrally molded. As shown in FIG. 11, when the first upper mold 1 is removed, the antenna terminal 13 on the upper surface and the inlet 110 having the joint hole 27 therebetween are arranged at predetermined positions on the surface, and the other parts are made of resin. To obtain a spare card base material 120 covered with.

FIG. 12 shows the obtained spare card base material 120.
It is the figure which looked at from the top. As shown in the figure, the spare card base material 120 has the same vertical and horizontal dimensions as the target IC card, has a smaller thickness, and has an antenna 112 and an antenna terminal 13 at a predetermined position on its upper surface. , And an inlet 110 having a joint hole 27 therebetween, and the other portion is made of the resin 14.

Thereafter, as shown in FIG. 13, a third recess 117 having a bottom and a predetermined height similar to one surface of the IC card and a predetermined position of the third recess are provided with the IC module main body. A second upper mold 115 having a second convex portion 116 having a two-stage protrusion shape in which a protrusion having a shape of a resin and a protrusion of a shape of a resin mold 122 provided on the IC module main body are overlapped; By preparing the lower mold 2 on which the base material 120 is arranged and aligning the third recess 117 with the spare card base material 120, as shown in FIG. A cavity 118 was formed therebetween.

Thereafter, as shown in FIG. 14, a molding resin is injected into the cavity 118 and solidified, and the spare card base material 120 and the resin are integrally molded.
0 was obtained.

FIG. 15 is a schematic sectional view of the obtained IC card main body 130.

As shown in FIG.
Is an IC card body-shaped resin having a two-step recess 119 that fits an IC module, and one area including the antenna terminal is exposed at the bottom of the recess 119, and the other area is embedded in the resin. And a configuration including the inlet 110. The two-step recess 119 is
It has the same shape as the concave portion 19 used in the first embodiment, except that a concave portion constituted by the C mod joint hole 27 is further provided.

Finally, the obtained IC card body 130
Then, an external terminal 23 is bonded to the upper surface, and an IC module 140 having the contact pad 21 and the resin mold 122 is bonded to the lower surface, for example, to about 54.0 mm × 8
A hybrid IC card 150 of 5.6 mm × 0.76 mm was obtained.

This hybrid type IC card 150
By fitting the resin mold 122 of the IC module into the recess formed by the joining hole 27 and joining the IC module,
Compared to the IC card according to the first embodiment, the card body and I
The joint area with the C module can be increased.
Therefore, the bonding strength between the card body and the IC module is improved.

Further, when the IC card was repeatedly manufactured in the same process, the antenna terminal was always formed at a predetermined position of the IC card, and there was no problem in joining with the IC module, and the antenna and the antenna terminal were damaged. It was possible to produce efficiently without generating any.

Embodiment 3 FIGS. 17 and 18 are views for explaining each step of still another example of the method of manufacturing an IC card according to the present invention.

In the same manner as in Example 2, the spare card base material 1
20 was obtained.

Thereafter, as shown in FIG. 17, a third concave portion 217 having a bottom having a size similar to one surface of the IC card and a predetermined height, and a predetermined position of the third concave portion 217 are provided.
A protrusion having a shape corresponding to the locking portion 28 extending horizontally from the periphery of the IC module main body to the end face, a protrusion having a shape of the IC module main body, and a protrusion having a shape of the resin mold 122 provided on the IC module main body. A second upper mold 215 having a second convex portion 216 having a three-stage projection shape in which the second mold is superimposed, and a lower mold 2 provided with a spare card base material 120 are prepared. Spare card base material 120
As shown in FIG. 18, a cavity 218 was formed between the third concave portion 217 and the spare card base material 120 by aligning.

Thereafter, as shown in FIG. 18, a molding resin is injected into the cavity 218 and solidified, and the spare card base material 120 and the resin are integrally molded.
0 was obtained.

FIG. 19 is a schematic sectional view of the obtained IC card main body 230.

As shown in FIG.
Is a three-stage recess 21 that matches the shape of the IC module.
9 having an IC card body shape and
9, one region including the antenna terminal 12 is exposed, and the other region is embedded in the resin.
0. The shape of the recess 219 is I
It has the same shape as the fourth recess 119 of the second embodiment, except that a recess 29 corresponding to the locking portion 28 is further provided above the recess corresponding to the C module main body.

Finally, the obtained IC card body 230
Then, an IC module 240 having an external terminal 23 and a locking portion 28 on its upper surface and a contact pad 21 and a resin mold 122 on its lower surface is joined to, for example, about 5 mm.
A hybrid IC card 250 of 4.0 mm × 85.6 mm × 0.76 mm was obtained.

In the hybrid IC card 250 according to the third embodiment, since the concave portion 29 is provided in the card body and the locking portion 28 is provided in the IC module, a sufficient bonding area can be obtained. And IC card adhesion strength can be significantly improved.

Further, when the IC card was repeatedly manufactured in the same process, the antenna terminal was always formed at a predetermined position of the IC card, and there was no problem in bonding with the IC module, and the antenna and the antenna terminal were damaged. The IC card could be efficiently manufactured without generating the problem.

Another Application FIG. 21 is a view for explaining still another example of the inlet used in the present invention.

As shown in FIG.
Has a configuration similar to that of FIG. 10 except that a plurality of through holes 31 provided inside the antenna and the antenna terminal at a sufficient distance are provided near the center of the substrate 211.

For example, an IC card was manufactured in the same manner as in Example 3 except that the above-described inlet 310 was used instead of the inlet 110. FIG. 22 is a schematic sectional view showing the configuration of the obtained IC card.

As shown in the drawing, in the obtained IC card, the resin introduced into the through hole 31 plays the role of a pillar, and the joint between the inlet 31 and the resin around the inlet 31 is strengthened to further increase the card strength. Can be improved.

[0057]

According to the method of manufacturing a hybrid IC card of the present invention, the inlet can be resin-sealed at a fixed position without damaging the antenna terminal and the antenna, and the antenna terminal and the IC module can be formed at the correct position. And the production efficiency is improved.

[Brief description of the drawings]

FIG. 1 is a view for explaining each step of a first example of the present invention.

FIG. 2 is a front view for explaining a configuration of an example of an inlet used in the present invention.

FIG. 3 is a diagram for explaining each step of the first example of the present invention.

FIG. 4 is a top view of the spare card base material according to the first example.

FIG. 5 is a diagram for explaining each step of the first example of the present invention.

FIG. 6 is a view for explaining each step of the first example of the present invention.

FIG. 7 is a schematic sectional view of an IC card main body according to the first example of the present invention.

FIG. 8 is a diagram for explaining each step of the first example of the present invention.

FIG. 9 is a view for explaining each step of the second example of the present invention.

FIG. 10 is a front view for explaining the configuration of another example of the inlet used in the present invention.

FIG. 11 is a view for explaining each step of the second example of the present invention.

FIG. 12 is a top view of a spare card base material according to a second example.

FIG. 13 is a view for explaining each step of the second example of the present invention.

FIG. 14 is a view for explaining each step of the second example of the present invention.

FIG. 15 is a schematic sectional view of a card body according to a second example of the present invention.

FIG. 16 is a view for explaining each step of the second example of the method for manufacturing an IC card of the present invention.

FIG. 17 is a view for explaining each step of the third example of the present invention.

FIG. 18 is a view for explaining each step of the third example of the present invention.

FIG. 19 is a schematic cross-sectional view of a card body according to a third example of the present invention.

FIG. 20 is a view for explaining each step of the third example of the present invention.

FIG. 21 is a front view illustrating a configuration example of an inlet according to another application example of the present invention.

FIG. 22 is a schematic sectional view of an IC card according to another application example of the present invention.

[Explanation of symbols]

 1, 101 first upper mold 2 lower mold 3, 103 first concave part 4 second concave part 5 cavity 10, 110, 310 inlet 11 substrate 12 antenna 13 antenna terminal 14 ... Resin 15, 115, 215 Second upper mold 16, 116, 216 First convex part 17, 117, 217 Third concave part 18, 118, 218 Cavity 19, 119, 219 Fourth Recesses 20, 120 ... spare card base material 21 ... contact pads 22 ... resin mold 23 ... external connection terminals 30, 130, 230 ... card body 31 ... through holes 40, 140, 240 ... IC modules 50, 150, 250 ... hybrid Type IC card

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takuaki Nara 45, Kazumida Oyamazaki, Oyamazaki-cho, Otonun-gun, Kyoto F-term within Maxell Seiki Co., Ltd. F-term (reference) 5B035 AA03 AA04 BA03 BA04 BB09 CA01 CA08 CA25

Claims (7)

[Claims] 1. An IC module having an antenna, an inlet having an antenna terminal connected to the antenna, and an IC module having a built-in IC chip and having an external connection terminal connected to an external device and a contact pad connected to the antenna terminal. A method for manufacturing an IC card, comprising: providing a first upper mold and a lower mold having at least one of the IC card-shaped recesses, and disposing the inlet at the bottom of the first upper mold. A step of placing the antenna terminals in close contact with each other, a step of arranging and aligning the first upper mold and the lower mold, and forming a first cavity between both the molds; Forming a spare card substrate by integrally molding the inlet and the molding resin into the inlet, and forming the IC card-shaped concave portion and the concave portion in the concave portion A second upper mold having a convex portion corresponding to the IC module shape and the lower mold on which the spare card base material is arranged are arranged in alignment, and a second mold is provided between the two molds. Forming a cavity, injecting a molding resin into the second cavity, integrally molding the spare card base material and the resin to form an IC card main body having a concave portion shaped to fit the IC module; And in a recess having a shape adapted to the IC module,
A method for manufacturing a hybrid IC card, comprising a step of bonding the IC module. 2. An IC module having an antenna, an inlet having an antenna terminal connected to the antenna, and an IC module having a built-in IC chip and having an external connection terminal connected to an external device and a contact pad connected to the antenna terminal. A method for manufacturing an IC card including: a first upper mold having a first concave portion having the IC card shape, a first concave portion having the first concave portion facing down, Arranging the inlet in close contact with the antenna terminal facing upward, the first upper mold and the lower mold provided with the IC card-shaped second concave portion, the first concave portion and the first concave portion; A step of aligning and arranging the second recess, injecting molding resin into a cavity between the first recess and the second recess, and integrally molding the inlet and the resin to form a spare card base material Process, A second upper mold having a third concave portion in the form of the IC card and a convex portion formed in the third concave portion and corresponding to the shape of the IC module; Positioning a mold with the third concave portion and the spare card base material aligned; injecting molding resin into a cavity between the third concave portion and the spare card base material; A step of forming an IC card body having a fourth concave portion having a shape conforming to the IC module by integrally molding a base material and a resin, and a step of joining the IC module in the fourth concave portion. A method of manufacturing a hybrid IC card. 3. An external connection terminal having an antenna, an antenna terminal connected to the antenna, and an inlet having a joint hole with the IC module, an IC chip built-in, and one end face of the IC module main body connected to an external device, A method for manufacturing an IC card including a contact pad connected to the antenna terminal on an opposite end surface and an IC module provided with a projection adapted to the bonding hole, wherein the first IC card has a first shape. And a first upper mold having a first convex portion provided in the first concave portion and having a shape adapted to the joining hole and having the first concave portion facing downward.
Disposing the inlet with the antenna terminal facing upward and the bonding hole in close contact with the first protrusion, at the bottom of the upper mold, the first upper mold and the IC Arranging a lower mold provided with a card-shaped second concave portion by aligning the first concave portion and the second concave portion, and disposing a lower mold having a cavity between the first concave portion and the second concave portion. A step of injecting a molding resin and integrally molding the inlet and the resin to form a spare card base; a third recess of the IC card shape; and the IC module main body provided in the third recess. At least two projections corresponding to the bonding holes are superimposed on the projections corresponding to the shape.
A second upper mold having a second projection having a stepped projection shape, and a lower mold having a spare card substrate arranged therein, wherein the projection is adapted to the joint hole and the third mold is formed; Positioning the concave portion and the spare card base material in alignment with each other, injecting a molding resin into a cavity between the third concave portion and the spare card base material, and integrally molding the spare card base material and the resin Forming an IC card body having a fourth concave portion having a shape adapted to the IC module, and joining the IC module in the fourth concave portion. A method for manufacturing an IC card. 4. The IC module main body has, on an external terminal side end surface thereof, a locking portion extending horizontally from the peripheral portion of the IC module main body to the end surface, and the third concave portion is provided with the IC module. The method according to claim 3, further comprising a three-stage projection shape in which a projection corresponding to the locking portion is further stacked below the projection corresponding to the module body shape. 5. The method according to claim 1, wherein the step of placing the inlet in close contact with the bottom of the first upper mold is performed by vacuum suction. 6. The inlet according to claim 1, wherein the inlet and outlet have outer dimensions at least 0.5 mm smaller than the outer dimensions of the IC card, and the periphery of the inlet is covered with a molding resin. Any one of 1 to 4
The method described in the section. 7. The method according to claim 1, wherein the inlet has a plurality of openings in a portion other than the antenna and the antenna terminal.