JPH0255198A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH0255198A JPH0255198A JP63206680A JP20668088A JPH0255198A JP H0255198 A JPH0255198 A JP H0255198A JP 63206680 A JP63206680 A JP 63206680A JP 20668088 A JP20668088 A JP 20668088A JP H0255198 A JPH0255198 A JP H0255198A
- Authority
- JP
- Japan
- Prior art keywords
- card
- base material
- module
- hole
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011111 cardboard Substances 0.000 abstract description 23
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 10
- 238000001259 photo etching Methods 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 13
- 238000005452 bending Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 206010016256 fatigue Diseases 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体素子を内部に設け、外部端子を表面に
設けた半導体モジュールを、カード基板に収納したＩＣ
カードに関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an IC in which a semiconductor module having a semiconductor element inside and an external terminal provided on the surface is housed in a card board.
It's about cards.
第３図は例えば特開昭６２−２９０５９１号公報や特開
昭６２−２０２７９６号公報に示されたような従来のＩ
Ｃカードを示す平面図、第４図は第３図の■−■線に沿
った断面図で第３図よりも大きく拡大している。これら
の図において、（１）は硬質塩化ビニールシートなどの
積層体からなる板状のカード基板、（２）はカード基板
（１）の表面に設けられた磁気ストライブ、（３）はカ
ード基板（１）上に形成された凹部、（４）はこの凹部
（３）に接着剤（図示せず）で固定して収納された半導
体モジュール（以下、ＩＣモジュールと称す）、（５）
はガラス繊維強化エポキシで作られたはゾ長方形の基材
で、第４図において上から順にｔｉｎ 、 姉ｅ ［３
１の３枚を重ねて接着剤（図示せず）で一体上してでき
ている。（６）は基材ＩＺ ＊ Ｉｉ３を切欠いてこれ
らと基材（５１１とで形成された窪み、（７）は基材０
１ｉ１１の窪み（６）側に装着された半導体素子（以下
、ＩＣと称す）、（ｓＡ）、（ｓＢ）は基材Ｉりの両面
にフォトエツチングにより形成された配線パターン、（
９）は基材ｉｔ＋の窪み（６）とは反対側の面にフォト
エツチングにより形成された外部端子で、当然、基材る
υにより機械的に支持されている。００はＩＣ（７）と
配線パターン（８Ｂ）を接続するワイヤ、（ＩＩＡ）＃
（ｕ Ｂ ）はスルーホールで、（ｌＩＡ）は配線パタ
ーン（８Ａ） 、 （８Ｂ） 、基材−に連通ずる穴を
あけ、その側壁にめっき（１１１）を施すことにより配
線パターン（８Ａ） 、 （ｓ１３）間を電気的に接続
し、（１１Ｂ ）は配線パターン（８Ｂ） 、基材６１
１口、外部端子（９）に連通ずる穴をあけ、めっき（１
１１）を施すことにより配線パターン（８Ｂ）と外部端
子（９）を接続している。FIG. 3 shows a conventional I.
FIG. 4, a plan view showing the C card, is a cross-sectional view taken along the line ■--■ in FIG. 3, and is enlarged to a greater extent than in FIG. 3. In these figures, (1) is a plate-shaped card board made of a laminate such as a hard vinyl chloride sheet, (2) is a magnetic stripe provided on the surface of the card board (1), and (3) is a card board. (1) a recess formed on the top; (4) a semiconductor module (hereinafter referred to as an IC module) fixed and housed in the recess (3) with an adhesive (not shown); (5)
is a rectangular base material made of glass fiber-reinforced epoxy;
It is made by stacking three sheets of No. 1 one on top of the other with adhesive (not shown). (6) is a depression formed by cutting out the base material IZ*Ii3 and the base material (511), and (7) is a depression formed by cutting out the base material IZ*Ii3.
Semiconductor elements (hereinafter referred to as ICs), (sA) and (sB) mounted on the recess (6) side of 1i11 are wiring patterns formed by photo-etching on both sides of the base material I, (
9) is an external terminal formed by photoetching on the surface of the base material it+ opposite to the recess (6), and is naturally mechanically supported by the base material υ. 00 is the wire connecting IC (7) and wiring pattern (8B), (IIA) #
(uB) is a through hole, (lIA) is a wiring pattern (8A), (8B), by making a hole that communicates with the base material and plating (111) on the side wall of the wiring pattern (8A), (s13) are electrically connected, (11B) is the wiring pattern (8B), and the base material 61
1 hole, open a connecting hole to the external terminal (9), and plate it (1
11), the wiring pattern (8B) and the external terminal (9) are connected.
＠は窪み（６）に充填してＩＣ（７）を封止するモール
ド樹脂で、基材關などがモールド樹脂（６）の流出防止
枠となる。以上（５）ないし＠および（８Ａ） 、 （
８Ｂ）（１１Ａ） ｅ （ＩＩＢ）でＩＣモジュール（
４）を構成している。@ is a molding resin that is filled into the depression (6) to seal the IC (7), and the base material and the like serve as a frame to prevent the molding resin (6) from flowing out. The above (5) to @ and (8A), (
8B) (11A) e (IIB) and IC module (
4).
（至）は基材優υと同じ材料で、ＩＣモジュール（４）
の側面０１）から出っ張らせて、基材郭０と一体的に設
けられた外延部で、外部端子（９）は基材幹υから外延
部（至）上に延長して設けられている。(to) is the same material as the base material, IC module (4)
The external terminal (9) is an extension part protruding from the side surface 01) and provided integrally with the base material shell 0, and the external terminal (9) is provided extending from the base material trunk υ onto the extension part (to).
次に動作について説明する。上記のＩＣカードをカード
リーダーのカード受入口（図示せず）に挿入すると、カ
ードリーダーの電極（図示せず）とＩＣカードの外部端
子（９）が接触、導通し、ＩＣ（７）が動作して処理が
行われる。なお、磁気ストライブ（２）で磁気カードと
同様の動作も行うことができる。ところでＩＣカードは
、磁気カードもそうであるように、携帯されることが多
く、また、使用の度にカードリーダーへの挿抜が繰り返
される。Next, the operation will be explained. When the above IC card is inserted into the card slot of the card reader (not shown), the electrodes of the card reader (not shown) and the external terminals (9) of the IC card come into contact and conduct, and the IC (7) operates. The process is then performed. Note that the magnetic stripe (2) can also perform the same operation as a magnetic card. Incidentally, IC cards, like magnetic cards, are often carried around and are repeatedly inserted into and removed from card readers each time they are used.
このような携帯、使用時にＩＣカードが不用意に曲げら
れることがある。ＩＣカードに曲げが繰り返すれると、
ＩＣモジュール（４）とカード基板（１）の境界でクラ
ックが発生したり、更に、カード基板（１）が疲労破壊
に至ったりすることがある。第４図のＩＣカードでは、
土肥のような不具合を防止するために基材φυから外延
部（至）を、図において横方向に出っ張らせ、ＩＣカー
ドが曲げられた時に発生する応力の集中を軽減している
。When carried and used in this way, the IC card may be bent carelessly. If an IC card is repeatedly bent,
Cracks may occur at the boundary between the IC module (4) and the card substrate (1), and furthermore, the card substrate (1) may suffer from fatigue failure. In the IC card shown in Figure 4,
In order to prevent defects such as soiling, the outer extension part (to) from the base material φυ is made to protrude laterally in the figure to reduce the concentration of stress that occurs when the IC card is bent.
ＩＣカードの曲げに対してクラックの発生などの不具合
を起さないためには、カード基板に比べて固いＩＣモジ
ュールを小さくすること、および外延部の出っ張りの度
合いを大きくすることにより、応力の集中を防ぐのが望
ましい。ところが、従来のＩＣカードは上記のように構
成されていて、基材で形成した窪みにモールド樹脂を充
填するようになっているので、モールド樹脂の流出防止
枠となる基材の幅だけＩＣモジュールの大きさはモール
ド樹脂の大きさよりも大きくなり、またそのために、Ｉ
Ｃモジュールと外延部を合せた寸法を一定とすると、外
延部のＩＣモジュールからの出っ張りは小さくなり、従
って、応力集中防止作用が小さい。また、ＩＣカードの
曲げにより外延部とカード基板の間の接着が剥離するこ
とがあり、このような剥離が生じると外延部による応力
集中防止の作用がなくなってしまう、などの問題点があ
った。In order to prevent problems such as cracks from occurring when the IC card is bent, the IC module, which is harder than the card board, should be made smaller and the protrusion of the outer part should be increased to reduce stress concentration. It is desirable to prevent However, conventional IC cards are constructed as described above, and the mold resin is filled into the depression formed in the base material, so the IC module is only wide enough for the width of the base material, which serves as a frame to prevent mold resin from flowing out. The size of I is larger than that of the mold resin, and for that reason, I
If the combined dimensions of the C module and the extension part are constant, the protrusion of the extension part from the IC module will be small, and therefore the effect of preventing stress concentration will be small. In addition, when the IC card is bent, the adhesive between the outer part and the card board may peel off, and when such peeling occurs, the outer part loses its ability to prevent stress concentration. .
この発明は上記のような問題点を解消するためになされ
たもので、曲げられた時に生じる応力集中防止の作用が
優れ、不具合の起りにくいＩＣカードを得ることを目的
とする。This invention was made to solve the above-mentioned problems, and aims to provide an IC card that has an excellent effect of preventing stress concentration that occurs when bent and is less likely to cause malfunctions.
この発明に係るＩＣカードは、ＩＣを封止するモールド
樹脂よりも出っ張らせた外延部を設け、この外延部とモ
ールド樹脂の側面をカード基板の凹部の側面に係合させ
たもの、あるいは、ＩＣモジュー・ルの側面から出っ張
らせた外延部を設け、これに穴を形成したものである。The IC card according to the present invention is provided with an extended portion that protrudes beyond the molded resin that seals the IC, and the extended portion and the side surface of the molded resin are engaged with the side surface of the recessed portion of the card substrate. An extension part is provided that protrudes from the side of the module, and a hole is formed in this extension part.
この発明におけるＩＣカードは、モールド樹脂の側面を
、基材を介さず直接に、カード基板の凹部側面に係合さ
せることにより、ＩＣモジュールの大きさを小さくでき
、またその結果、外延部の出っ張りの寸法を大きくでき
、従って、応力集中防止の作用が大きい。あるいは、外
延部に穴を設けることにより、ＩＣカードを加熱、加圧
して製造する時に、カード基板の材料や近辺の接着剤が
軟化してこの穴に入り込み、そのために、外延部とカー
ド基板との間の固着が強化されて剥離を防止するので、
応力集中防止の作用が確実になる。In the IC card according to the present invention, the size of the IC module can be reduced by directly engaging the side surface of the molded resin with the side surface of the recessed portion of the card substrate without using the base material, and as a result, the protrusion of the external portion can be reduced. The dimensions can be increased, and therefore the effect of preventing stress concentration is large. Alternatively, by providing a hole in the outer part, when an IC card is manufactured by heating and pressurizing, the material of the card board or the adhesive in the vicinity softens and enters the hole. This strengthens the adhesion between the two and prevents them from peeling off.
The effect of preventing stress concentration is ensured.
以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実施例によるＩＣカードを示す断面図
で、図において、（１）は硬質塩化ビニールシートの積
層体からなる板状のカード基板、（３）はカード基板（
１）上に形成された凹部、（４）はこの凹部（３）に接
着剤（図示せず）で固定して収納されｔこＩＣモジュー
ル、（５）はガラス繊維強化エポキシで作られたはゾ長
方形の板状の基材、α荀は基材（５）に設けられたダイ
パッド、（７）はダイパッドＱ４）に装着されたＩＣ１
（８）は基板（５）のダイパッド０４と同じ側の面（こ
設けられた配線パターン、（９）は基材（５）のダイパ
ッド（Ｌ４）とは反対側の面に設けられた外部端子で、
グイバットαく、配線パターン（８）、外部端子（９）
はフォトエツチングにより形成され、基板（５）により
機械的に支持されている。α０はＩＣ（７）と配線パタ
ーン（８）を接続するワイヤ、＠はＩＣ（７）を封止す
るモールド樹脂で、上記（５）ないし＠でＩＣモジュー
ル（４）を構成している。（２）は基材（５）をカード
基板（１）の面方向にモールド樹脂（ロ）よりも出っ張
らせて構成した外延部で、基材（５）と同じ材料で連続
的、一体的に構成されており、これとモールド樹脂（６
）の側面（１２１）がカード基板（１）の凹部（３）の
側面０１）に係合している。また、配線パターン（８）
、外部端子（９）は基材（５）から外延部０３上に延長
して設けられている。０υは外延部（至）に設けられた
スルーホールで、配線パターン（８）、外延部（至）、
外部端子（９）に連通ずる穴を形成し、その側壁にめっ
き（１１１）を施すことにより、配線パターン（８）と
外部端子（９）とを電気的に接続している。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view showing an IC card according to an embodiment of the present invention. In the figure, (1) is a plate-shaped card substrate made of a laminate of hard vinyl chloride sheets, and (3) is a card substrate (
1) A recess formed on the top (4) is fixed and housed in the recess (3) with an adhesive (not shown), and (5) is an IC module made of glass fiber reinforced epoxy. A rectangular plate-shaped base material, α is a die pad provided on the base material (5), and (7) is an IC1 mounted on the die pad Q4).
(8) is the wiring pattern provided on the same side of the substrate (5) as the die pad 04, and (9) is the external terminal provided on the side of the substrate (5) opposite to the die pad (L4). in,
Guibat α, wiring pattern (8), external terminal (9)
is formed by photoetching and is mechanically supported by the substrate (5). α0 is a wire connecting the IC (7) and the wiring pattern (8), @ is a molding resin that seals the IC (7), and the above (5) to @ constitute an IC module (4). (2) is an extended part formed by making the base material (5) protrude more than the mold resin (b) in the plane direction of the card board (1), and is made of the same material as the base material (5) and is continuously and integrally formed. This and mold resin (6
) is engaged with the side surface 01) of the recess (3) of the card board (1). Also, wiring pattern (8)
, the external terminal (9) is provided extending from the base material (5) onto the extension portion 03. 0υ is a through hole provided in the extension part (to), and the wiring pattern (8), the extension part (to),
The wiring pattern (8) and the external terminal (9) are electrically connected by forming a hole communicating with the external terminal (9) and plating (111) on the side wall thereof.
次に、上記のＩＣカードを製造する方法について説明す
る。一体になった基材（５）と外延部α椴の両面にグイ
バットａ■、配線パターン（８）および外部端子（９）
をフォトエツチングにより形成し、外延部α］に配線パ
ターン（８）、外部端子（９）に連通ずる穴をあけてそ
の側壁にめっき（１１１）を施してスルーホール０］）
を作る。次に、ダイパッド（１４１上にＩＣ（７）を装
着し、ＩＣ（７）と配線パターン（８）の間をワイヤｑ
１で接続する。続いて、一体止したこれらをモールド金
型（図示せず）にセットし、例えばＤＩＰ形など通常の
半導体装置の製造に用いられるトランスファモールドと
同様の方法で、−度に多数個のモールド樹脂（６）の成
形を行う。モールド樹脂四の大きさは、面積で基材（５
）と外延部α■の合計面積の１／２、厚さでＩＣモジュ
ール（４）全体のシ３とした。カード基板（１）の材料
としては５層の硬質塩化ビニルシートを用い、これに開
口を設けて凹部（３）を形成し、そこに接着剤（図示せ
ず）を付けて、一体止したＩＣモジュール（４）と外延
部（至）を嵌合させ、これらを鏡面板（図示せず）に挾
持して１３０°Ｃｌ、 ２０１ｃｌｉ＋／７で加分間加
熱、加圧してＩＣカードが出来上る。Next, a method for manufacturing the above IC card will be explained. Guibat a■, wiring pattern (8) and external terminal (9) on both sides of the integrated base material (5) and extension part α.
is formed by photo-etching, a hole communicating with the wiring pattern (8) and the external terminal (9) is made in the extension part α], and the side wall thereof is plated (111) to form a through hole 0).
make. Next, the IC (7) is mounted on the die pad (141), and the wire q is connected between the IC (7) and the wiring pattern (8).
Connect with 1. Next, the integrally fixed pieces are set in a mold (not shown), and a large number of pieces of mold resin ( 6) Perform the molding. The size of mold resin 4 is based on the base material (5
) and the outer extension part α■, and the thickness was taken as shi3 of the entire IC module (4). A five-layer hard vinyl chloride sheet is used as the material for the card board (1), and an opening is formed in this to form a recess (3), and an adhesive (not shown) is applied thereto to secure the IC. The module (4) and the extended portion (to) are fitted together, held between mirror plates (not shown), and heated and pressurized at 130° Cl and 201 cli+/7 to complete an IC card.
なお、スルーホールαυが外延部（至）に設けられてカ
ード基板（１）に接しているので、第２図の断面拡大図
に示すように、カード基板（１）の材料や上記接着剤が
加熱により軟化してその一部がスルーホールαυに入り
込む。In addition, since the through hole αυ is provided in the outer part (end) and is in contact with the card board (1), as shown in the enlarged cross-sectional view of Fig. 2, the material of the card board (1) and the adhesive mentioned above are It softens due to heating and a part of it enters the through hole αυ.
次に動作について説明する０従来例で説明したような曲
げが上記ＩＣカードにも加えられる。しかし、モールド
樹脂＠の側面（１２１）をカード基板（１）の凹部（３
）の側面０］）に直接係合させているので、第４図の従
来例に比べて基板脇の分だけＩＣモジュール（４）の寸
法が小さく、即ち、カード基板（１）に埋め込まれた、
より固い部分の寸法が小さいことになり、応力集中の度
合いが小さくなる。また、外延部α→のモールド樹脂α
罎からの出っ張りの寸法は逆に大きくなるので、応力集
中防止の作用が大きい。更に、スルーホール０１）に入
り込んだカード基板（１）の材料や接着剤が、外延部α
：予とカード基板（１）の固着を強化するアンカーとし
て働き、特に、ＩＣカードを曲げたときに、第１図にお
いて外延部（１３の下面（１３１）とカード基板（１）
の間に生じる剪断応力に対して有効！こ働いて両者間の
剥離を防止し、外延部（２）の応力集中防止の作用を確
実（こする。Next, the above-mentioned IC card is also subjected to bending as described in the conventional example, the operation of which will be described below. However, the side surface (121) of the mold resin
), the dimensions of the IC module (4) are smaller by the side of the board compared to the conventional example shown in Fig. 4; ,
The dimensions of the harder part will be smaller, reducing the degree of stress concentration. In addition, the mold resin α of the extension part α→
On the contrary, since the size of the protrusion from the can becomes larger, the effect of preventing stress concentration is greater. Furthermore, the material and adhesive of the card board (1) that entered the through hole 01)
: Acts as an anchor to strengthen the adhesion of the card board (1) and the card board (1), especially when the IC card is bent.
Effective against shear stress generated during This action prevents peeling between the two and ensures the effect of preventing stress concentration on the extended portion (2).
なお、ＩＣモジュール（４）とカード基板（１）の寸法
精度をよくして互の接着を強固にするために、第４図の
従来例では基材（５）の外周を研磨などする必要があり
、また、多数のＩＣカードを製造する１こは基材（５）
で形成された窪み（６）のそれぞれにモールド樹脂＠を
充填していく必要があったが、この実施例では、モール
ド金型（図示せず）を用いるのでモールド樹脂＠の外周
は寸法精度がよくて研磨などの必要がなく、また、−度
に多数個のモールド樹脂（６）の成形が行われるので、
生産性がよいという効果がある。In addition, in order to improve the dimensional accuracy of the IC module (4) and the card board (1) and to strengthen their mutual adhesion, it is necessary to polish the outer periphery of the base material (5) in the conventional example shown in Fig. 4. Yes, and one of the base materials for manufacturing a large number of IC cards (5)
It was necessary to fill each of the depressions (6) formed by molding resin@, but in this example, a molding die (not shown) is used, so the dimensional accuracy of the outer circumference of the molding resin@ At best, there is no need for polishing, and since a large number of mold resins (6) are molded at one time,
This has the effect of increasing productivity.
上記の実施例では基材（５）の厚さをＩＣモジュール（
４）全体の偽としたが、これとは別に、基材（５）の厚
さがＩＣモジュール（４）全体の杓および的のものを作
り、曲げ試験を行った。上記厚さが２／３のものは、曲
げたときの外延部（至）のたわみが少いために、繰り返
し曲げによってクラックが発生した。上記厚暮をＶ２以
下にすれば曲げに対する強度が向上するが、その効果を
太き（するにはＩＡ以下にするのが好ましい。また、第
１図の実施例では、モールド樹脂（６）の面積を基材（
５）と外延部（至）の合計面積の１ｈとしたが、この比
率は、’／１．２ より小さく、好ましくは１ｈ、５
〜１／２とするのが良い◎更に、曲げ時の応力集中防止
のために１外延部（至）はカード基板（１）に比べて数
倍以上の弾性係数を持つ材料が良い。第１図の実施例で
は、外延部（至）としてガラス繊維強化エポキシを用い
たが、他の繊維で強化した高弾性体でもよい。In the above example, the thickness of the base material (5) is
4) Although the entire test was made false, we also made a case where the thickness of the base material (5) was the same as that of the entire IC module (4), and conducted a bending test. In the case where the thickness was ⅔ of the above, cracks occurred due to repeated bending because the outer extension part (end) had little deflection when bent. If the above-mentioned thickness is set to V2 or less, the strength against bending will improve, but in order to increase the effect, it is preferable to set it to IA or less.In addition, in the example shown in FIG. The area is the base material (
5) and the total area of the extension part (to) is 1h, but this ratio is smaller than '/1.2, preferably 1h, 5
It is preferable to set it to ~1/2◎Furthermore, in order to prevent stress concentration during bending, it is preferable that the first extension part (toward) be made of a material having an elastic modulus several times or more than that of the card substrate (1). In the embodiment shown in FIG. 1, glass fiber-reinforced epoxy is used as the extension part, but a highly elastic material reinforced with other fibers may also be used.
なお、第１図の実施例では、外延部（至）に設けた穴を
電気接続用のスルーホールＣ１，）としたが、スルーホ
ールαυを別に設ける場合は、外延部（至）の穴は電気
接続用でない単なる穴としてもよい。また、モールド樹
脂（６）よりも出っ張らせた外延部（２）とモールド樹
脂（２）の側面（１２１）をカード基板（１）の凹部（
３）の側面０υに係合させ、外延部（至）に穴は設けな
いようにしてもよいし、あるいは、第４図の従来例と同
様に基材（５）で窪み（６）を形成してこ＼にモールド
樹脂（６）を充填し、ＩＣモジュール（４）の側面＠υ
から出っ張らせた外延部（至）を設け、この外延部Ｑ１
に穴を設けるようにしてもよい。In the embodiment shown in Fig. 1, the hole provided in the outer part (to) is the through hole C1,) for electrical connection, but if the through hole αυ is provided separately, the hole in the outer part (to) should be It may also be a simple hole that is not used for electrical connections. In addition, the outer extension portion (2) that protrudes beyond the mold resin (6) and the side surface (121) of the mold resin (2) are connected to the concave portion (1) of the card board (1).
3) may be engaged with the side surface 0υ, and no hole may be provided in the outer extension (to), or alternatively, a depression (6) may be formed in the base material (5) as in the conventional example shown in Fig. 4. Fill the lever with molding resin (6) and attach it to the side of the IC module (4)
An outer extension part (to) is provided that protrudes from the outer extension part Q1.
A hole may be provided in the.
以上のようにこの発明によれば、モールド樹脂の側面を
カード基板の凹部の側面に係合させることにより、ＩＣ
モジュールを小さくでき・更にその結果、外延部の出っ
張りの寸法を大きくできるので応力集中防止の作用が大
きく、また、外延部に穴を設けることにより、カード基
板の材料や接着剤がこの穴に入り込んで外延部とカード
基板の間の固着を強化して剥離を防止するので応力集中
防止の作用が確実になるなど、いずれも応力集中防止の
作用が優れ、従って、クラックの発生や疲労破壊などの
不具合が起りにくいという効果がある。As described above, according to the present invention, by engaging the side surface of the mold resin with the side surface of the recess of the card board, the IC
The module can be made smaller, and as a result, the size of the protrusion on the outer extension can be increased, which has a greater effect on preventing stress concentration.Also, by providing a hole on the outer extension, the card board material and adhesive can enter the hole. This strengthens the adhesion between the extension part and the card board and prevents them from peeling off, ensuring the effect of preventing stress concentration. This has the effect of making it difficult for problems to occur.
第１図はこの発明の一実施例によるＩＣカードを示す断
面図、第２図は第１図のスルーホールの断面拡大図、第
３図は従来のＩＣカードを示す平面図、第４図は第３図
のＩＶ−ｆｆ線に沿った断面図である。
図において、（１）はカード基板、（３）はその凹部、
６ｕはこの凹部（３）の側面、（４）はＩＣモジュール
、（６）はその側面、（５）は基材、（７）はＩ Ｃ、
（９）は外部端子、αυはスルーホール、（ロ）はモー
ルド樹脂、（１２１）ハその側面、（至）は外延部であ
る。
なお各図中同一符号は同一または相当部分を示す。FIG. 1 is a cross-sectional view showing an IC card according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the through hole in FIG. 1, FIG. 3 is a plan view showing a conventional IC card, and FIG. FIG. 4 is a sectional view taken along the line IV-ff in FIG. 3; In the figure, (1) is the card board, (3) is its recess,
6u is the side surface of this recess (3), (4) is the IC module, (6) is the side surface, (5) is the base material, (7) is the IC,
(9) is an external terminal, αυ is a through hole, (B) is a molded resin, (121) is a side surface thereof, and (to) is an extended portion. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (2)
基材と上記半導体素子を封止するモールド樹脂とで一体
的に構成された半導体モジユールを、板状のカード基板
上に形成された凹部に収納するものにおいて、上記基材
を上記カード基板の面方向に上記モールド樹脂よりも出
つ張らせて構成した外延部を設け、この外延部および上
記モールド樹脂の側面を上記凹部の側面に係合させたこ
とを特徴とするＩＣカード。(1) A semiconductor module that is integrally constructed of a semiconductor element, an external terminal, a base material that supports the external terminal, and a mold resin that seals the semiconductor element is placed in a recess formed on a plate-shaped card substrate. The base material is provided with an extended portion that protrudes beyond the molded resin in the surface direction of the card substrate, and the extended portion and the side surfaces of the molded resin are engaged with the side surfaces of the recessed portion. An IC card that is characterized by being integrated.
基材と上記半導体素子を封止するモールド樹脂とで一体
的に構成された半導体モジユールを、板状のカード基板
上に形成された凹部に収納するものにおいて、上記基材
を上記半導体モジユールの側面から上記カード基板の面
方向に出つ張らせて構成した外延部を設け、この外延部
に穴を形成したことを特徴とするＩＣカード。(2) A semiconductor module that is integrally constructed of a semiconductor element, an external terminal, a base material that supports the external terminal, and a mold resin that seals the semiconductor element is placed in a recess formed on a plate-shaped card substrate. An IC card that is stored in an IC card, characterized in that an extended portion is provided in which the base material protrudes from a side surface of the semiconductor module in a surface direction of the card substrate, and a hole is formed in the extended portion. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63206680A JPH0255198A (en) | 1988-08-19 | 1988-08-19 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63206680A JPH0255198A (en) | 1988-08-19 | 1988-08-19 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0255198A true JPH0255198A (en) | 1990-02-23 |
Family
ID=16527333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63206680A Pending JPH0255198A (en) | 1988-08-19 | 1988-08-19 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0255198A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019531918A (en) * | 2016-07-27 | 2019-11-07 | コンポーズキュア，リミティド ライアビリティ カンパニー | Overmolded electronic component for transaction card and manufacturing method thereof |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11232341B2 (en) | 2017-10-18 | 2022-01-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| USD943669S1 (en) | 2018-01-30 | 2022-02-15 | Composecure, Llc | Layer of a transaction card |
| US11315002B2 (en) | 2017-09-07 | 2022-04-26 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11461608B2 (en) | 2016-07-27 | 2022-10-04 | Composecure, Llc | RFID device |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61222715A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
| JPS63185688A (en) * | 1987-01-29 | 1988-08-01 | 大日本印刷株式会社 | Manufacture of ic card |
-
1988
- 1988-08-19 JP JP63206680A patent/JPH0255198A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61222715A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
| JPS63185688A (en) * | 1987-01-29 | 1988-08-01 | 大日本印刷株式会社 | Manufacture of ic card |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
| US11829826B2 (en) | 2016-07-27 | 2023-11-28 | Composecure, Llc | RFID device |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
| JP2019531918A (en) * | 2016-07-27 | 2019-11-07 | コンポーズキュア，リミティド ライアビリティ カンパニー | Overmolded electronic component for transaction card and manufacturing method thereof |
| US11461608B2 (en) | 2016-07-27 | 2022-10-04 | Composecure, Llc | RFID device |
| US11247371B2 (en) | 2016-07-27 | 2022-02-15 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
| US11501128B2 (en) | 2017-09-07 | 2022-11-15 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11315002B2 (en) | 2017-09-07 | 2022-04-26 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11669708B2 (en) | 2017-09-07 | 2023-06-06 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11232341B2 (en) | 2017-10-18 | 2022-01-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| USD944322S1 (en) | 2018-01-30 | 2022-02-22 | Composecure, Llc | Layer of a transaction card |
| USD944323S1 (en) | 2018-01-30 | 2022-02-22 | Composecure, Llc | Layer of a transaction card |
| US11301743B2 (en) | 2018-01-30 | 2022-04-12 | Composecure, Llc | Di capacitive embedded metal card |
| USD943670S1 (en) | 2018-01-30 | 2022-02-15 | Composecure, Llc | Layer of a transaction card |
| USD943669S1 (en) | 2018-01-30 | 2022-02-15 | Composecure, Llc | Layer of a transaction card |
| US11710024B2 (en) | 2018-01-30 | 2023-07-25 | Composecure, Llc | Di capacitive embedded metal card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4463971A (en) | Identification card having an IC module | |
| KR900001745B1 (en) | Ic card and its producting method | |
| JPS63188964A (en) | Integrated circuit package | |
| JPS61157990A (en) | Ic card | |
| JPH0255198A (en) | Ic card | |
| JPH11288750A (en) | Joint structure of flexible wiring board | |
| JPS6015786A (en) | Ic card and its production | |
| JPS6333854A (en) | Integrated circuit package | |
| JP2000331138A (en) | Non-contact ic card | |
| JPS61204788A (en) | Portable electronic device | |
| JP2000067200A (en) | Ic card | |
| JPH01208847A (en) | Integrated circuit device | |
| JPH11216974A (en) | Composite type ic card, and its manufacture | |
| JP3081926B2 (en) | IC card | |
| JP2557357Y2 (en) | IC card | |
| JP2001229360A (en) | Ic card | |
| JP3181935B2 (en) | IC card | |
| JPH08104088A (en) | Ic card | |
| JPH0995076A (en) | Ic card | |
| JPH0976678A (en) | Ic module for ic card and the ic card | |
| JPS6394894A (en) | Semiconductor device | |
| KR0152576B1 (en) | Stack chip package having center pad | |
| JPH07164787A (en) | Manufacture of ic card | |
| JPH05278383A (en) | Ic card | |
| JP2000207516A (en) | Ic card |