JPH10193853A - Manufacture of non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacture of a non-contact IC card wherein a clearance of a vacant space part between a module package and a card base material when the module package in which an IC module is sealed with resin is fabricated by being buried in the vacant space part of the card base material, can be reduced surely in good workability by a simple process, and bonding properties and adhesive of the module package to the card base material can be improved. SOLUTION: When an IC module or the like is sealed with heat curable resin, it is not thoroughly cured, left in a semi-cured state to the degree of being deformed by pressurizing in later heat pressing, and a preliminarily cured module package 10a is prepared. Thereafter, when it is fabricated by being buried in a card base material by heat pressing, the preliminary module package 10a is cured in a state of being deformed by pressurizing, and the module package 10 is buried in the card base material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-contact IC card which communicates with a reader or the like in a non-contact state.

[0002]

2. Description of the Related Art In recent years, from the viewpoint of efficiency of information processing and security, IC cards mounted with semiconductor elements for recording and processing data have become widespread. Recently, a non-contact IC card has been developed which has a built-in antenna coil for transmitting and receiving data using electromagnetic waves and a semiconductor element for data processing, and can read and write data with an external processing device by a so-called wireless method. I have.

[0003] These non-contact IC cards include an antenna coil, and the shape of the antenna varies depending on the communication frequency and function. Further, unlike the IC card, a contact terminal is not required. Therefore, a manufacturing method that does not expose the module to the card surface is usually required.

For example, a module in which an antenna coil and an electronic element such as an IC are integrated is sandwiched between resin sheets, or a concave portion is formed in a resin sheet by counterbore processing, and the module is mounted in the concave portion. There is a method of covering, joining and enclosing. When the card is manufactured in such a manner that the module is not exposed on the card surface, if the module is thick and the unevenness is remarkable, the unevenness is reflected as it is on the card surface where the module package is embedded, and the appearance is poor. Occurs.

In order to eliminate such an appearance defect, an IC
There is a method of packaging a module or the like with a resin.
In this method, as shown in FIG.
A module hole 3a is formed in the resin center sheet 3 of about 600 μm by, for example, punching. On the other hand, the antenna coil, the IC module, and the like are sealed with, for example, an epoxy resin or an ultraviolet curable resin to flatten the upper and lower surfaces in a coin shape. Make it. The center package 3 having a thickness of, for example, about 400 to 600 μm is placed on a single cover sheet 4 a made of a heat-sealing resin having a thickness of, for example, 100 to 200 mm.
0 is attached to the module hole 3a of the center sheet 3, and an oversheet 4b of, for example, 100 to 200 mm of a heat-sealing resin is put on the center sheet 3 and, for example, a pressure of 25 k
g / cm ² , 150 ° C., 15 minutes, and the center sheet 3 and the cover sheets 4 a and 4 b are joined by heat welding, and the module package 10 is assembled with the center sheet 3 and the cover sheets 4 a on both sides thereof. It is embedded in the card base material 2 composed of 4b.

[0006]

However, the above I
On the surface of the C card, an undesired dent is generated due to a gap between the module package 10 and the wall surface of the module hole 3a. For example, the clearance allowed when the module package 10 in which a circular coin type module is packaged with epoxy resin is mounted in the module hole 3a of the card base material 2 made of vinyl chloride resin is usually about 0.5 mm. If the gap is larger than this, it tends to cause poor appearance during pressing. For example, if the diameter is 1
When a module package having an outer diameter of 17 mm is mounted in an 8 mm module hole, the clearance is 0.5 on average.
mm, and the mounting workability is good, but if the module package is biased to one side in the module hole, the clearance will be about 1 mm, and poor appearance due to this gap will occur.

[0007] By reducing such a gap, it is possible to reduce dents appearing on the card surface and to improve the appearance. However, as shown in FIG. 4, when the gap between the module package 10 and the module hole 3a is reduced, an operation of forcibly pushing the module package 10 into the module hole 3a may be required due to a variation in dimensions. However, there is a problem that workability is extremely poor, which leads to an increase in cost.

Although there is an attempt to inject a liquid adhesive into such a gap and fill the gap to improve the appearance, injecting the liquid adhesive into a narrow gap is very poor in workability and poor in mass productivity. . Conventionally, the resin that seals the IC module has poor compatibility with the adhesion and adhesion to the card substrate,
Few items could completely satisfy the test items based on the O standard.

To improve the adhesive strength, methods such as primer treatment, blast treatment, corona treatment, and use of an adhesive or an adhesive sheet have been considered and used. However, in the adhesive system, the thickness of the card is limited, so that the amount of coating film cannot be sufficiently increased.Therefore, there is a problem that a strong adhesive force cannot be obtained, and handling on a production line is difficult. There's a problem. In addition, it was difficult to sufficiently improve the adhesiveness of the primer treatment, the blast treatment, and the corona treatment for the purpose of improving the wettability.

The present invention has been made in view of the above circumstances, and has been made in consideration of the above circumstances, and has been described in connection with the case where a module package in which an IC module is sealed with a resin is buried in a void portion of a card base material. The object of the present invention is to provide a method for manufacturing a non-contact IC card, which can reliably reduce the workability with a simple process, improve the workability, and improve the adhesion and adhesion between the module package and the card base material. And

[0011]

In order to achieve the above object, the present invention provides a non-contact IC card in which a module package in which electronic components such as ICs and coils are sealed with a thermosetting resin is embedded in a card base material. In the manufacturing method, a pre-cured resin sealing step of manufacturing a pre-cured module package by sealing with a pre-cured resin cured to an extent capable of being deformed by pressure, and the pre-cured resin sealing step The pre-cured module package is mounted in the gap of the center sheet constituting the card base material, and hot-pressed while covering the gap with the cover sheet, so that the pre-cured module package is deformed under pressure. Pressurizing and heating to heat cure and join the cover sheet to the center sheet to form a card substrate with the module package embedded Contactless I, characterized in that it comprises
Provided is a method for manufacturing a C card.

The method for manufacturing a non-contact IC card according to the present invention comprises:
When the IC module or the like is sealed with a thermosetting resin, it is not completely cured, but is kept in a semi-cured state in which it is deformed by the pressure applied during the subsequent hot pressing, thereby producing a pre-cured module package. After that, when embedding processing in the card base material by a hot press, the spare module package is cured in a state of being deformed under pressure, and the module package is embedded in the card base material.

According to this method, by deforming the pre-cured module package under pressure, the shape of the module package can be changed to a shape corresponding to the shape of the space in which the pre-cured module package is mounted. The void of the card base material becomes a mold, and the void can be filled with the module package.

Therefore, the pre-cured module package is formed so that the outer diameter is smaller than the diameter of the gap of the card base material and the thickness of the pre-effect module package projects from the center sheet when the pre-cured module package is mounted in the gap. By making the volume of the module package approximately the same as the volume of the gap, the gap between the module and the gap is increased when mounting in the gap, facilitating mounting and improving productivity. Since the module package is deformed so as to fill the gap, the gap is reduced or almost eliminated, and poor appearance due to the gap hardly occurs. Further, since the pre-cured resin is deformed at the time of hot pressing, the sealing resin bites into the cover sheet, and the adhesiveness and the adhesiveness are good even without performing a treatment such as a primer treatment to enhance the adhesive effect.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be specifically described, but the present invention is not limited to the following embodiments. FIG. 1 is a perspective view showing an IC card according to the present invention. In the IC card 1, a coin-shaped module package 10 in which an IC module or the like is sealed is buried in a card-type card base material 2, and data can be read and written to and from an external device in a non-contact manner by a so-called wireless system. The embedding position of the module package 10 is preferably shifted from the center in the width direction of the card to the end in order to avoid bending stress of the card.

In this non-contact IC card 1, the space inside the card base material on which the module package 10 is mounted is almost completely filled with the module package 10, and the gap between the module package 10 and the peripheral wall of the space is extremely small. The card has almost no irregularities on the card surface, good appearance, good adhesion and adhesion between the module package and the card substrate, and excellent physical strength.

Next, a method of manufacturing the non-contact IC card 1 will be described with reference to FIG. First, FIG.
As shown in (1), a center sheet 3 and cover sheets 4a and 4b constituting a card base material 2 are prepared. Examples of the resin constituting the center sheet 3 and the cover sheet 4 according to the present invention include a heat-fusible polyvinyl chloride resin,
Polyethylene, polypropylene, polystyrene, ABS
Examples thereof include resins, acrylic resins, polyester resins, polyamide resins, and polyimide resins.

The center sheet 3 is made of, for example, hard vinyl chloride resin and has a thickness of about 0.56 mm. A module hole 3a for enclosing the module package 10 is formed by punching or other means. The outer diameter of the module hole 3a is 18 mm, which is 1 mm larger than the outer diameter 17 mm of the pre-cured module package 10a, which will be described later, and is a size that allows easy insertion of the pre-cured module package 10a. The cover sheet 4 is made of, for example, hard vinyl chloride resin and has a thickness of about 0.1 mm.

On the other hand, as shown in FIG. 2B, a non-contact module in which an electronic component 12 such as an IC module is disposed inside an antenna coil 11 has, for example, an outer diameter of a circular coil 11 of 15 mm and a thickness of 15 mm. Is about 0.5 mm. In the present invention, the configuration, shape, and the like of the non-contact module are not particularly limited.

This non-contact module is sealed with a thermosetting resin such as an epoxy resin to produce a module package. In the present invention, the hardening is not completely completed, but the hardening is stopped to the extent that it is compressed and deformed by the pressure at the time of hot pressing, and the coin-shaped pre-cured module package 10a in which both end surfaces in a semi-cured state are flattened. Make it. Specific conditions for semi-curing are, for example, an epoxy resin as an example, an amine-based curing agent is used as a curing agent, and a temperature of 4 is used.
Conditions at 0 to 100 ° C. for 1 to 10 minutes, usually several minutes, can be employed. The means for pre-curing is not limited to heat, but may include reaction promotion by mixing, UV, and the like.

As shown in FIG. 2C, the outer diameter of the coin-shaped pre-cured module package 10a is about 1 m from the outer diameter of the module hole 3a formed in the center sheet 3.
Let m be 17 mm smaller. The thickness of the center sheet 3 is set to be greater than 0.56 mm and about 0.63 mm. Thereby, the pre-cured module package 10
a is attached to the module hole 3a, the outer diameter is 1 mm
The height is projected from the center sheet 3 and the clearance is large at the time of mounting, so that the product can be mounted with high productivity. At the time of hot pressing, it is pressed by the hot press to cause deformation. . In addition, the volume of the pre-cured module package 10a is substantially the same as the volume of the module hole 3a so that the module hole 3a can be filled when deformed, and the height and the outer diameter are selected so as to have such a volume. I do.

Next, the pre-cured module package 10a is embedded in a card base material. As shown in FIG. 2D, the center sheet 3 is put on the cover sheet 4a, and the pre-cured module package 10a is mounted in the module hole 3a of the center sheet 3. At this time, the gap between the pre-cured module package and the module hole is 0.5 mm on average, so that the mounting operation is easy and the productivity is good. The pre-cured module package 10a protrudes from the surface of the center sheet 3 by about 0.07 mm. Then, the cover sheet 4b is put on the center sheet 3.

Next, for example, at a pressure of 25 kg / cm ² , 15
The center sheet 3 and the cover sheets 4a and 4b are joined by heat welding by hot pressing at 0 ° C. for 15 minutes. During this hot pressing, the pre-cured module package 10a is compressed and deformed because it protrudes from the center sheet 3. Since the volume of the pre-cured module package 10a is substantially the same as that of the module hole 3a, the deformed pre-cured module package 10a can fill the module hole 3a without any gap. In addition, the precured thermosetting resin is cured again by the heat at the time of hot pressing, and is cured in a state in which the module holes 3a are filled.

As a result, as shown in FIG. 2 (5), the cured module package 10 is deformed to an outer diameter of 18 mm and a thickness of 0.56 mm, and almost completely fills the module hole 3a. Therefore, there is almost no gap between the module hole 3a and the module package 10, and no dent is formed on the surface of the card base 2 due to this gap. In addition, when deformed by hot pressing, the precured thermosetting resin is once softened, so that the adhesiveness and adhesion to the cover sheet 4 are improved, and a card having excellent physical strength is obtained. In this way, it is possible to manufacture a non-contact IC card in which the recured module package 10 is embedded in the card base 2 composed of the center sheet 3 and the cover sheets 4a and 4b on both sides thereof.

Thereafter, if necessary, the product is punched into a predetermined size to obtain a product. Note that, for example, a transparent oversheet may be bonded to the cover sheet in a later step or simultaneously with the hot pressing. Further, an adhesive sheet may be used for joining the cover sheet 4 and the center sheet 3 by heat fusion.

In this embodiment, the center sheet 3
Since the method of forming the module hole 3a by punching or the like is adopted, it is more cost-effective than the counterbore method, which tends to be expensive due to breakage at the time of pressing due to module positioning error and counterbore processing cost. It is advantageous. However, the present invention is also applicable to a method in which a concave portion for mounting the module package is formed by counterbore processing, and the cover sheet is heat-sealed to the center sheet so as to seal the concave portion.

[0027]

According to the method for manufacturing a non-contact IC card of the present invention, the occurrence of a dent on the card surface due to the gap between the module package and the space where the module package is mounted is suppressed as much as possible. Therefore, a non-contact IC card having good appearance quality can be manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a non-contact IC card of the present invention.

FIGS. 2 (1) to (5) show the steps of manufacturing the non-contact IC card of the present invention, wherein (1), (4) and (5) are sectional views, respectively, and (2) and (3). Are perspective views, respectively.

FIG. 3 is a perspective view illustrating a method of including a coin-shaped module package in a card base material.

FIG. 4 is a cross-sectional view illustrating a conventional method of including a coin-shaped module package in a card base material.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Non-contact IC card, 2 ... Card base material, 3 ... Center sheet, 3a ... Module hole, 4 ... Cover sheet, 10
a: Pre-cured module package, 10: Module package

Claims (2)

[Claims] In a method for manufacturing a non-contact IC card in which a module package in which electronic components such as ICs and coils are sealed with a thermosetting resin is embedded in a card base material, the module package is cured to an extent capable of being deformed by pressure. A pre-cured resin sealing step of manufacturing a pre-cured module package by sealing with a pre-cured resin; and a gap of a center sheet constituting a card base material with the pre-cured module package obtained in the pre-cured resin sealing step Attached to the part, by hot pressing in a state where this void portion is covered with a cover sheet, while thermosetting in a state where the pre-cured module package is deformed under pressure,
Pressurizing and heating a step of joining a cover sheet to a center sheet and forming a card substrate in which a module package is embedded. 2. The non-contact IC card according to claim 1, wherein the volume of the void in the center sheet is substantially equal to the volume of the pre-cured module package, and the thickness of the pre-cured module package is larger than the thickness of the center sheet. Production method.