JPH039258Y2 - - Google Patents
Info
- Publication number
- JPH039258Y2 JPH039258Y2 JP18331784U JP18331784U JPH039258Y2 JP H039258 Y2 JPH039258 Y2 JP H039258Y2 JP 18331784 U JP18331784 U JP 18331784U JP 18331784 U JP18331784 U JP 18331784U JP H039258 Y2 JPH039258 Y2 JP H039258Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- plug
- wiring board
- socket
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 32
- 230000037431 insertion Effects 0.000 claims description 32
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 30
- 238000010586 diagram Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18331784U JPH039258Y2 (US07709020-20100504-C00041.png) | 1984-12-03 | 1984-12-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18331784U JPH039258Y2 (US07709020-20100504-C00041.png) | 1984-12-03 | 1984-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197249U JPS6197249U (US07709020-20100504-C00041.png) | 1986-06-21 |
| JPH039258Y2 true JPH039258Y2 (US07709020-20100504-C00041.png) | 1991-03-07 |
Family
ID=30740823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18331784U Expired JPH039258Y2 (US07709020-20100504-C00041.png) | 1984-12-03 | 1984-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039258Y2 (US07709020-20100504-C00041.png) |
-
1984
- 1984-12-03 JP JP18331784U patent/JPH039258Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197249U (US07709020-20100504-C00041.png) | 1986-06-21 |
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