JPH0392048U - - Google Patents

Info

Publication number
JPH0392048U
JPH0392048U JP1989152869U JP15286989U JPH0392048U JP H0392048 U JPH0392048 U JP H0392048U JP 1989152869 U JP1989152869 U JP 1989152869U JP 15286989 U JP15286989 U JP 15286989U JP H0392048 U JPH0392048 U JP H0392048U
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing material
wire bonding
wiring board
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989152869U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989152869U priority Critical patent/JPH0392048U/ja
Publication of JPH0392048U publication Critical patent/JPH0392048U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989152869U 1989-12-29 1989-12-29 Pending JPH0392048U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989152869U JPH0392048U (enExample) 1989-12-29 1989-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989152869U JPH0392048U (enExample) 1989-12-29 1989-12-29

Publications (1)

Publication Number Publication Date
JPH0392048U true JPH0392048U (enExample) 1991-09-19

Family

ID=31699108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989152869U Pending JPH0392048U (enExample) 1989-12-29 1989-12-29

Country Status (1)

Country Link
JP (1) JPH0392048U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780749A (en) * 1980-11-07 1982-05-20 Hitachi Ltd Electronic circuit device
JPS6216554A (ja) * 1985-07-15 1987-01-24 Sharp Corp 制御回路内蔵型電力半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780749A (en) * 1980-11-07 1982-05-20 Hitachi Ltd Electronic circuit device
JPS6216554A (ja) * 1985-07-15 1987-01-24 Sharp Corp 制御回路内蔵型電力半導体装置

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