JPH038930B2 - - Google Patents
Info
- Publication number
- JPH038930B2 JPH038930B2 JP60101062A JP10106285A JPH038930B2 JP H038930 B2 JPH038930 B2 JP H038930B2 JP 60101062 A JP60101062 A JP 60101062A JP 10106285 A JP10106285 A JP 10106285A JP H038930 B2 JPH038930 B2 JP H038930B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- mold
- shaped
- shaped terminals
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000001746 injection moulding Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10106285A JPS61258716A (ja) | 1985-05-13 | 1985-05-13 | 射出成形における電子部品の金型装着方法およびその金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10106285A JPS61258716A (ja) | 1985-05-13 | 1985-05-13 | 射出成形における電子部品の金型装着方法およびその金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61258716A JPS61258716A (ja) | 1986-11-17 |
JPH038930B2 true JPH038930B2 (US07321065-20080122-C00020.png) | 1991-02-07 |
Family
ID=14290623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10106285A Granted JPS61258716A (ja) | 1985-05-13 | 1985-05-13 | 射出成形における電子部品の金型装着方法およびその金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61258716A (US07321065-20080122-C00020.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101481454B1 (ko) * | 2014-07-14 | 2015-01-12 | 재영솔루텍 주식회사 | 전자기기 케이스의 커버 내부재 사출 성형 금형 및 이를 이용한 커버 내부재 형성 방법 |
JP7374613B2 (ja) * | 2019-05-21 | 2023-11-07 | 日本発條株式会社 | 樹脂モールド回路体、金型、製造方法、及び回路基板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941955A (US07321065-20080122-C00020.png) * | 1972-08-17 | 1974-04-19 |
-
1985
- 1985-05-13 JP JP10106285A patent/JPS61258716A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941955A (US07321065-20080122-C00020.png) * | 1972-08-17 | 1974-04-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS61258716A (ja) | 1986-11-17 |
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