JPH0388355A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPH0388355A JPH0388355A JP22507189A JP22507189A JPH0388355A JP H0388355 A JPH0388355 A JP H0388355A JP 22507189 A JP22507189 A JP 22507189A JP 22507189 A JP22507189 A JP 22507189A JP H0388355 A JPH0388355 A JP H0388355A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- conductor circuit
- terminal
- external lead
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 230000008018 melting Effects 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は電子部品を搭載し、セラミックス材料によっ
て形成された基材と、その基材の表面に形成された導体
回路と、その導体回路を介して前記電子部品に接続され
る外部引出し用端子とを備えた半導体パッケージに関す
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention includes a base material mounted with electronic components and formed of a ceramic material, a conductor circuit formed on the surface of the base material, and a conductor circuit formed on the surface of the base material. The present invention relates to a semiconductor package including an external lead-out terminal connected to the electronic component via a semiconductor package.
［従来の技術及び発明が解決しようとする課題］従来、
この種のパッケージでは、第３図に示すように、セラミ
ックス材料からなる基材２１の外周縁部表面に導体回路
２２を形成し、その導体回路２２には、断面長方形状の
リードフレーム２３をその一側面にて銀ロウやハンダ等
によって固着していた。[Prior art and problems to be solved by the invention] Conventionally,
In this type of package, as shown in FIG. 3, a conductor circuit 22 is formed on the outer peripheral surface of a base material 21 made of a ceramic material, and a lead frame 23 having a rectangular cross section is attached to the conductor circuit 22. It was fixed on one side with silver solder or solder.
ところが、上記のパッケージでは、リードフレーム２３
がその一側面で取付けられるため、取付は面積が大きく
なって、銀ロウやハンダ等の融解熱が基材に伝達され易
く、又、導体回路２２が基材２１の周縁部に形成されて
いるため、基材２１の周縁部が集中的に加熱されて、そ
の部分にクランクが発生し易くなるという問題があった
。However, in the above package, the lead frame 23
Since it is attached on one side of the base material, the mounting area becomes large, and the heat of melting of silver solder, solder, etc. is easily transmitted to the base material, and the conductor circuit 22 is formed on the periphery of the base material 21. Therefore, there was a problem in that the peripheral edge of the base material 21 was heated intensively, and cranks were likely to occur in that area.
この発明は上記の問題を解消するためになされたもので
あって、その目的は外部引出し用端子の取付けに際し、
基材の周縁部における加熱面積を少なくして、基材にお
けるクラックの発生を未然に防止することが可能な半導
体パッケージを提供することにある。This invention was made to solve the above problems, and its purpose is to:
An object of the present invention is to provide a semiconductor package that can prevent cracks from occurring in the base material by reducing the heating area at the peripheral edge of the base material.
［課題を解決するための手段及び作用］上記の目的を達
成するために、この発明では、外部引出し用端子の端部
に屈曲部を設け、その屈曲部の端面を導体回路に対向配
置した状態で、導体回路にロウ付けしている。[Means and effects for solving the problem] In order to achieve the above object, the present invention provides a bent part at the end of the external lead-out terminal, and the end face of the bent part is arranged opposite to the conductor circuit. And the conductor circuit is brazed.
従って、外部引出し用端子の取付は面積が少なくなって
、基材の周縁部における加熱面積が少なくなり、基材に
おけるクランクの発生が防止される。Therefore, the mounting area for the external lead-out terminal is reduced, the heating area at the peripheral edge of the base material is reduced, and the occurrence of cranks in the base material is prevented.
［実施例］
以下、この発明を具体化した一実施例を図面に従って詳
細に説明する。第１図及び第２図に示す半導体パッケー
ジ１は窒化アルミニウム製の基材２を備え、その上面に
は電子部品としてのＩＣＣペレットが搭載されると共に
、周縁部下面にはＴｉ層、Ｍｏ層及びＮｉ層を積層形成
した導体回路４が設けられ、図示しないスルーホール等
を介して両者３，４が接続されている。[Example] Hereinafter, an example embodying the present invention will be described in detail with reference to the drawings. The semiconductor package 1 shown in FIGS. 1 and 2 includes a base material 2 made of aluminum nitride, on which an ICC pellet as an electronic component is mounted, and on the lower surface of the periphery, a Ti layer, a Mo layer and a A conductor circuit 4 made of laminated Ni layers is provided, and both 3 and 4 are connected via a through hole (not shown) or the like.
前記導体回路４に接続される外部引出し用端子５は断面
はぼ長方形状をなすリードフレームであって、その先端
には屈曲部５ａが形成されている。The external lead-out terminal 5 connected to the conductor circuit 4 is a lead frame having a substantially rectangular cross section, and a bent portion 5a is formed at the tip thereof.
そして、屈曲部５ａの端面が導体回路４に対向配置され
、その周囲に供給された後に溶融・冷却される銀ロウや
ハンダ等のロウ材６により、前記端子５が導体回路４に
接続固定されている。Then, the end face of the bent portion 5a is arranged to face the conductor circuit 4, and the terminal 5 is connected and fixed to the conductor circuit 4 by a brazing material 6 such as silver solder or solder, which is supplied around the bent portion 5a and then melted and cooled. ing.
従って、この実施例では、外部引出し用端子５の取付は
面積を少なくして、前記端子５を導体回路４に接続する
際に基材２の周縁部がロウ材６の融解熱によって加熱さ
れる面積を少なくでき、よって基材２にクランクが発生
するおそれを未然に防止できる。Therefore, in this embodiment, the mounting area of the external lead-out terminal 5 is reduced so that the peripheral edge of the base material 2 is heated by the melting heat of the brazing material 6 when the terminal 5 is connected to the conductor circuit 4. The area can be reduced, and the possibility that cranks will occur in the base material 2 can therefore be prevented.
尚、この発明は前記実施例に限定されるものではなく、
外部引出し用端子５の断面形状、ロウ材６の種類及び基
材２の材質を適宜に変更することも可能である。Note that this invention is not limited to the above embodiments,
It is also possible to change the cross-sectional shape of the external lead-out terminal 5, the type of brazing material 6, and the material of the base material 2 as appropriate.
［発明の効果］
以上詳述したように、この発明は外部引出し用端子の取
付けに際し、基材の周縁部における加熱面積を少なくし
て、基材におけるクランクの発生を未然に防止すること
ができるという優れた効果を発揮する。[Effects of the Invention] As described in detail above, the present invention can prevent the generation of cranks in the base material by reducing the heating area at the peripheral edge of the base material when attaching external lead-out terminals. It exhibits an excellent effect.
第１図はこの発明を具体化した半導体パッケージの要部
拡大断面図、第２図は半導体パッケージの正面図、第３
図は従来の半導体パッケージの正面図である。
２・・・基材、３・・・電子部品としてのＩＣＣペレッ
ト４・・・導体回路、５・・・外部引出し用端子、５ａ
・・・屈曲部。FIG. 1 is an enlarged cross-sectional view of essential parts of a semiconductor package embodying the present invention, FIG. 2 is a front view of the semiconductor package, and FIG. 3 is a front view of the semiconductor package.
The figure is a front view of a conventional semiconductor package. 2... Base material, 3... ICC pellet as an electronic component 4... Conductor circuit, 5... External drawing terminal, 5a
...bending part.
Claims (1)
て形成された基材（２）と、その基材（２）の表面に形
成された導体回路（４）と、その導体回路（４）を介し
て前記電子部品（３）に接続される外部引出し用端子（
５）とを備えた半導体パッケージにおいて、 前記外部引出し用端子（５）の端部に屈曲部（５ａ）を
設け、その屈曲部（５ａ）の端面を導体回路（４）に対
向配置した状態で、導体回路（４）にロウ付けしたこと
を特徴とする半導体パッケージ。[Claims] 1. A base material (2) on which an electronic component (3) is mounted and formed of a ceramic material, a conductor circuit (4) formed on the surface of the base material (2), and the conductor. An external lead-out terminal (
5), in which a bent part (5a) is provided at the end of the external extraction terminal (5), and the end face of the bent part (5a) is arranged opposite to the conductor circuit (4). , a semiconductor package characterized in that a conductor circuit (4) is brazed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22507189A JPH0388355A (en) | 1989-08-31 | 1989-08-31 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22507189A JPH0388355A (en) | 1989-08-31 | 1989-08-31 | Semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388355A true JPH0388355A (en) | 1991-04-12 |
Family
ID=16823571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22507189A Pending JPH0388355A (en) | 1989-08-31 | 1989-08-31 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388355A (en) |
-
1989
- 1989-08-31 JP JP22507189A patent/JPH0388355A/en active Pending
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