JPH0387559U - - Google Patents
Info
- Publication number
- JPH0387559U JPH0387559U JP14492389U JP14492389U JPH0387559U JP H0387559 U JPH0387559 U JP H0387559U JP 14492389 U JP14492389 U JP 14492389U JP 14492389 U JP14492389 U JP 14492389U JP H0387559 U JPH0387559 U JP H0387559U
- Authority
- JP
- Japan
- Prior art keywords
- block
- workpiece
- pressure
- ring
- polishing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14492389U JPH0387559U (US07993877-20110809-P00003.png) | 1989-12-18 | 1989-12-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14492389U JPH0387559U (US07993877-20110809-P00003.png) | 1989-12-18 | 1989-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0387559U true JPH0387559U (US07993877-20110809-P00003.png) | 1991-09-05 |
Family
ID=31691594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14492389U Pending JPH0387559U (US07993877-20110809-P00003.png) | 1989-12-18 | 1989-12-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0387559U (US07993877-20110809-P00003.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000354959A (ja) * | 1999-06-10 | 2000-12-26 | Applied Materials Inc | 基板に圧力を加えて保持するためのキャリアヘッド |
JP2001334454A (ja) * | 2000-05-29 | 2001-12-04 | Shin Etsu Handotai Co Ltd | ワークの研磨方法並びにワーク保持板及びワーク研磨装置 |
JP2007276110A (ja) * | 2001-05-29 | 2007-10-25 | Ebara Corp | 基板キャリアシステムおよび基板を研磨する方法 |
-
1989
- 1989-12-18 JP JP14492389U patent/JPH0387559U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000354959A (ja) * | 1999-06-10 | 2000-12-26 | Applied Materials Inc | 基板に圧力を加えて保持するためのキャリアヘッド |
JP2001334454A (ja) * | 2000-05-29 | 2001-12-04 | Shin Etsu Handotai Co Ltd | ワークの研磨方法並びにワーク保持板及びワーク研磨装置 |
JP2007276110A (ja) * | 2001-05-29 | 2007-10-25 | Ebara Corp | 基板キャリアシステムおよび基板を研磨する方法 |
JP4660505B2 (ja) * | 2001-05-29 | 2011-03-30 | 株式会社荏原製作所 | 基板キャリアシステムおよび基板を研磨する方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910009320B1 (ko) | 연마장치 | |
KR960039174A (ko) | 연마장치 및 그 보정방법 | |
JPH0387559U (US07993877-20110809-P00003.png) | ||
JPH09272062A (ja) | ガラス物品の研磨装置 | |
JP3731411B2 (ja) | ウェーハ研磨装置 | |
JPH0451364U (US07993877-20110809-P00003.png) | ||
JP3795198B2 (ja) | 基板保持装置及び該基板保持装置を備えたポリッシング装置 | |
JPS6330462U (US07993877-20110809-P00003.png) | ||
JPS6084251U (ja) | 遊星回転式研摩装置 | |
JPH01135464A (ja) | 研磨装置 | |
JPS62118435U (US07993877-20110809-P00003.png) | ||
JPS6285355U (US07993877-20110809-P00003.png) | ||
JP2005244258A (ja) | ウェーハ研磨装置 | |
JPH03270870A (ja) | 研磨装置 | |
JPS6370857U (US07993877-20110809-P00003.png) | ||
JPS6131655U (ja) | 平面研摩装置の被加工物保持機構 | |
TW411296B (en) | Chemical mechanical polishing apparatus | |
JPS5939163U (ja) | 研摩布クリ−ニング装置 | |
JPH0282033U (US07993877-20110809-P00003.png) | ||
JPS6127657U (ja) | 平面研摩装置の被加工物保持機構 | |
JPH0223951U (US07993877-20110809-P00003.png) | ||
JPS63144953A (ja) | 研磨装置 | |
JPS59135807U (ja) | 圧延ロ−ルの研削装置 | |
JPS63158755U (US07993877-20110809-P00003.png) | ||
JPH0375959U (US07993877-20110809-P00003.png) |