JPH0387559U

JPH0387559U -

Info

Publication number: JPH0387559U
Application number: JP14492389U
Authority: JP
Priority date: 1989-12-18
Filing date: 1989-12-18
Publication date: 1991-09-05

Description

[Brief explanation of drawings]

第１図は本考案による研磨装置の実施例を示す
要部の断面図、第２図は第１図を上から見た図、
第３図、第４図は、従来から知られている研磨装
置の要部の断面図、第５図は第４図の研磨装置に
よる研磨状態を誇張して示した要部の断面図、第
６−１図、第６−２図は被研磨材８に傾斜がつい
て研磨された状態を示す断面図、第７図はブロツ
ク７上に接着された被研磨材８の配置図を示す。１……加圧軸、２……軸受、３……加圧ヘツド
、３ａ〜３ｄ……加圧チユーブの位置決めガイド
、４ａ〜４ｃ……気体導入口、５ａ〜５ｃ……圧
力計、６ａ〜６ｃ……リング状の加圧チユーブ、
７……ブロツク、８……被研磨材（半導体ウエー
ハ）、９……研磨用パツド、１０……定盤、１１
……調心軸受、１２……保持具、１３……軸受、
１４……回転軸、１５……流体を充填した中空体
、１６…研磨液。 FIG. 1 is a sectional view of the main parts showing an embodiment of the polishing apparatus according to the present invention, FIG. 2 is a view of FIG. 1 viewed from above,
3 and 4 are cross-sectional views of the main parts of a conventionally known polishing device, FIG. 6-1 and 6-2 are cross-sectional views showing the state in which the polished material 8 is tilted and polished, and FIG. 7 is a layout diagram of the polished material 8 bonded onto the block 7. 1... Pressure shaft, 2... Bearing, 3... Pressure head, 3a-3d... Pressure tube positioning guide, 4a-4c... Gas inlet, 5a-5c... Pressure gauge, 6a- 6c...Ring-shaped pressure tube,
7... Block, 8... Material to be polished (semiconductor wafer), 9... Polishing pad, 10... Surface plate, 11
... Aligning bearing, 12 ... Holder, 13 ... Bearing,
14... Rotating shaft, 15... Hollow body filled with fluid, 16... Polishing liquid.

Claims

[Scope of utility model registration request]

A block 7 that holds the workpiece 8 to be polished, a surface plate 10 disposed on the side of the workpiece 8 of the block 7, a pressure mechanism that presses the block 7 against the workpiece 10, and a block 7 and the workpiece 10. In a polishing device having a relative sliding mechanism, a ring-shaped pressure tube 6 is provided between the block 7 and the pressure mechanism, and a plurality of ring-shaped pressure tubes 6 are arranged so that the center of the ring and the center of pressure of the block 7 coincide with each other. A polishing device characterized in that the polishing device is arranged in a plurality of pieces.