JPH038587B2 - - Google Patents
Info
- Publication number
- JPH038587B2 JPH038587B2 JP59105889A JP10588984A JPH038587B2 JP H038587 B2 JPH038587 B2 JP H038587B2 JP 59105889 A JP59105889 A JP 59105889A JP 10588984 A JP10588984 A JP 10588984A JP H038587 B2 JPH038587 B2 JP H038587B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit
- cooling
- semiconductor element
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10588984A JPS60249351A (ja) | 1984-05-24 | 1984-05-24 | 沸騰冷却型回路基板と冷媒液中での配置構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10588984A JPS60249351A (ja) | 1984-05-24 | 1984-05-24 | 沸騰冷却型回路基板と冷媒液中での配置構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60249351A JPS60249351A (ja) | 1985-12-10 |
| JPH038587B2 true JPH038587B2 (enrdf_load_stackoverflow) | 1991-02-06 |
Family
ID=14419483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10588984A Granted JPS60249351A (ja) | 1984-05-24 | 1984-05-24 | 沸騰冷却型回路基板と冷媒液中での配置構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60249351A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7011221B2 (ja) * | 2018-03-28 | 2022-01-26 | 日本電気株式会社 | 実装基板、電子機器及び素子冷却方法 |
| JP7419994B2 (ja) * | 2020-07-03 | 2024-01-23 | 株式会社オートネットワーク技術研究所 | 電気機器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51141462U (enrdf_load_stackoverflow) * | 1975-05-07 | 1976-11-15 | ||
| JPS52114271A (en) * | 1976-03-22 | 1977-09-24 | Hitachi Ltd | Semiconductor pellet mounting structure for substrate |
| JPS5887836A (ja) * | 1981-11-20 | 1983-05-25 | Hitachi Ltd | 基板およびそれを用いたペレツトボンデイング方法 |
-
1984
- 1984-05-24 JP JP10588984A patent/JPS60249351A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60249351A (ja) | 1985-12-10 |
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