JPH0383367A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPH0383367A JPH0383367A JP22076989A JP22076989A JPH0383367A JP H0383367 A JPH0383367 A JP H0383367A JP 22076989 A JP22076989 A JP 22076989A JP 22076989 A JP22076989 A JP 22076989A JP H0383367 A JPH0383367 A JP H0383367A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electrode terminal
- semiconductor device
- terminal
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 239000011347 resin Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、樹脂封止型半導体装置に関する。[Detailed description of the invention] Industrial applications The present invention relates to a resin-sealed semiconductor device.
従来の技術
近年、電子機器の小型、薄形化に伴ない樹脂封止型半導
体が多用されるようになってきた。2. Description of the Related Art In recent years, as electronic devices have become smaller and thinner, resin-sealed semiconductors have come into widespread use.
以下に従来の半導体装置について説明する。A conventional semiconductor device will be explained below.
第３図は従来の半導体装置の側面図であり、■は樹脂封
止体、２は樹脂封止体１の側面から引き出された電極端
子である。この電極端子２は樹脂封止体１の側面から引
き出された後に、樹脂封止体１の側面および下面に沿っ
て折り曲げられている。このような樹脂封止型半導体装
置は、前記電極端子２の下面をプリント基板と半田付け
して使用される。FIG. 3 is a side view of a conventional semiconductor device, in which ``■'' is a resin molded body, and 2 is an electrode terminal drawn out from the side surface of the resin molded body 1. In FIG. After the electrode terminal 2 is pulled out from the side surface of the resin molding body 1, it is bent along the side surface and the bottom surface of the resin molding body 1. Such a resin-sealed semiconductor device is used by soldering the lower surface of the electrode terminal 2 to a printed circuit board.
発明が解決しようとする課題
しかしながら上記の従来の樹脂封止型半導体装置では電
極端子２の下面が固定されていないために搬送時、特性
検査時および実装時などに第５図および第６図に示すよ
うに電極端子２が変形してしまうという問題を有してい
た。Problems to be Solved by the Invention However, in the conventional resin-sealed semiconductor device described above, the lower surface of the electrode terminal 2 is not fixed, so that during transportation, characteristic testing, mounting, etc. As shown, there was a problem in that the electrode terminal 2 was deformed.
本発明は上記の問題を解決するもので、電極端子の変形
を防止することのできる樹脂封止型半導体装置を提供す
ることを目的とする。The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a resin-sealed semiconductor device that can prevent deformation of electrode terminals.
課題を解決するための手段
上記課題を解決するために本発明は、樹脂封止体下面に
複数の突起部を備え、かつ前記突起部は電極端子を挟み
込むような構成としたものである。Means for Solving the Problems In order to solve the above problems, the present invention has a structure in which a plurality of protrusions are provided on the lower surface of a resin sealing body, and the protrusions sandwich electrode terminals.
作用
上記構成により、電極端子が突起部で樹脂封止体に対し
て安定に保持されるので、電極端子の変形が防止され、
電極端子の安定性を向上することができる。Effect With the above configuration, the electrode terminal is stably held against the resin sealing body by the protrusion, so that deformation of the electrode terminal is prevented.
The stability of the electrode terminal can be improved.
実施例 以下本発明の一実施例に基づいて説明する。Example An explanation will be given below based on one embodiment of the present invention.
第１図において、樹脂封止体１１の側面から電極端子２
１が引き出されており、前記電極端子２１は、前記樹脂
封止体１１の側面および下面に沿って曲げ加工されてい
る。また、前記樹脂封止体１１の下面には、突起部１２
が電極端子２１に当接するように設けられている。In FIG. 1, the electrode terminal 2 is
1 is drawn out, and the electrode terminal 21 is bent along the side and lower surfaces of the resin sealing body 11. Further, a protrusion 12 is provided on the lower surface of the resin sealing body 11.
is provided so as to come into contact with the electrode terminal 21.
以下、上記構成における作用を説明する。The operation of the above configuration will be explained below.
樹脂封止体１１の下面に設けられた突起部１２により、
電極端子２１の先端部近傍が安定に保持されるので、電
極端子２１の変形が防止され、電極端子２１の安定を図
ることができる。The protrusion 12 provided on the lower surface of the resin sealing body 11 allows
Since the vicinity of the tip of the electrode terminal 21 is stably held, deformation of the electrode terminal 21 is prevented, and the electrode terminal 21 can be stabilized.
なお、本実施例では、突起部１２をレール状にし、複数
の電極端子に対して一組の突起部を用いたが、突起部を
各電極端子ごとにレール状に設けたり、囲む様に設けて
も同様の効果が得られる。In this embodiment, the protrusions 12 are shaped like rails, and one set of protrusions is used for a plurality of electrode terminals. The same effect can be obtained.
発明の効果
以上述べたように、本発明によれば、樹脂封止体の下面
に電極端子に当接する突起部を設けることにより、電極
端子の変形を防止でき、優れた半導体装置を実現できる
。Effects of the Invention As described above, according to the present invention, by providing the protrusion that abuts the electrode terminal on the lower surface of the resin sealing body, deformation of the electrode terminal can be prevented and an excellent semiconductor device can be realized.
第１図は本発明の一実施例を示す半導体装置の側面図、
第２図は第１図の斜視図、第３図および第４図は従来例
の半導体装置の側面図、第５図は第４図の斜視図である
。
１１・・・・・・樹脂封止体、１２・・・・・・突起部
、２１・・・・・・電極端子。FIG. 1 is a side view of a semiconductor device showing an embodiment of the present invention;
2 is a perspective view of FIG. 1, FIGS. 3 and 4 are side views of a conventional semiconductor device, and FIG. 5 is a perspective view of FIG. 4. 11...Resin sealing body, 12...Protrusion, 21...Electrode terminal.
Claims (1)
面および下面に沿って曲げ加工された電極端子と、前記
樹脂封止体下部に複数の突起部を備えた樹脂封止型半導
体装置。A resin-sealed semiconductor device comprising an electrode terminal pulled out from a side surface of a resin-sealed body and bent along the side and bottom surfaces of the resin-sealed body, and a plurality of protrusions at the bottom of the resin-sealed body. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22076989A JPH0383367A (en) | 1989-08-28 | 1989-08-28 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22076989A JPH0383367A (en) | 1989-08-28 | 1989-08-28 | Resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383367A true JPH0383367A (en) | 1991-04-09 |
Family
ID=16756270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22076989A Pending JPH0383367A (en) | 1989-08-28 | 1989-08-28 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383367A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003088431A (en) * | 2001-09-20 | 2003-03-25 | Tanahashi Kogyo Kk | Partition for division display in book display shelf |
| US8202069B2 (en) | 2006-09-07 | 2012-06-19 | Denso Corporation | Electric fuel pump |
-
1989
- 1989-08-28 JP JP22076989A patent/JPH0383367A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003088431A (en) * | 2001-09-20 | 2003-03-25 | Tanahashi Kogyo Kk | Partition for division display in book display shelf |
| US8202069B2 (en) | 2006-09-07 | 2012-06-19 | Denso Corporation | Electric fuel pump |
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