JPH0381126A - 集積回路素子ケーシングの射出成形装置 - Google Patents
集積回路素子ケーシングの射出成形装置Info
- Publication number
- JPH0381126A JPH0381126A JP18835890A JP18835890A JPH0381126A JP H0381126 A JPH0381126 A JP H0381126A JP 18835890 A JP18835890 A JP 18835890A JP 18835890 A JP18835890 A JP 18835890A JP H0381126 A JPH0381126 A JP H0381126A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- casing
- cavity
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18835890A JPH0381126A (ja) | 1990-07-17 | 1990-07-17 | 集積回路素子ケーシングの射出成形装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18835890A JPH0381126A (ja) | 1990-07-17 | 1990-07-17 | 集積回路素子ケーシングの射出成形装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23172885A Division JPS6290213A (ja) | 1985-10-17 | 1985-10-17 | 集積回路素子ケ−シングの射出成形による成形方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0381126A true JPH0381126A (ja) | 1991-04-05 |
JPH0525655B2 JPH0525655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-13 |
Family
ID=16222227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18835890A Granted JPH0381126A (ja) | 1990-07-17 | 1990-07-17 | 集積回路素子ケーシングの射出成形装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0381126A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0688650A4 (en) * | 1994-01-13 | 1997-06-11 | Citizen Watch Co Ltd | RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES |
EP0783949A4 (en) * | 1994-09-28 | 1998-07-08 | Meiho Co Ltd | INJECTION MOLDING DEVICE |
WO2007147470A1 (de) * | 2006-06-21 | 2007-12-27 | Hansatronic Gmbh | Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte |
WO2010099999A1 (de) * | 2009-03-06 | 2010-09-10 | Robert Bosch Gmbh | Verfahren zum einbetten einer elektrischen baugruppe |
-
1990
- 1990-07-17 JP JP18835890A patent/JPH0381126A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0688650A4 (en) * | 1994-01-13 | 1997-06-11 | Citizen Watch Co Ltd | RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES |
EP0783949A4 (en) * | 1994-09-28 | 1998-07-08 | Meiho Co Ltd | INJECTION MOLDING DEVICE |
WO2007147470A1 (de) * | 2006-06-21 | 2007-12-27 | Hansatronic Gmbh | Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte |
WO2010099999A1 (de) * | 2009-03-06 | 2010-09-10 | Robert Bosch Gmbh | Verfahren zum einbetten einer elektrischen baugruppe |
Also Published As
Publication number | Publication date |
---|---|
JPH0525655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-13 |
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