JPH0381126A - 集積回路素子ケーシングの射出成形装置 - Google Patents

集積回路素子ケーシングの射出成形装置

Info

Publication number
JPH0381126A
JPH0381126A JP18835890A JP18835890A JPH0381126A JP H0381126 A JPH0381126 A JP H0381126A JP 18835890 A JP18835890 A JP 18835890A JP 18835890 A JP18835890 A JP 18835890A JP H0381126 A JPH0381126 A JP H0381126A
Authority
JP
Japan
Prior art keywords
mold
lead frame
casing
cavity
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18835890A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Mitsuhiro Obara
小原 光博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP18835890A priority Critical patent/JPH0381126A/ja
Publication of JPH0381126A publication Critical patent/JPH0381126A/ja
Publication of JPH0525655B2 publication Critical patent/JPH0525655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP18835890A 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置 Granted JPH0381126A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18835890A JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18835890A JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP23172885A Division JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Publications (2)

Publication Number Publication Date
JPH0381126A true JPH0381126A (ja) 1991-04-05
JPH0525655B2 JPH0525655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-04-13

Family

ID=16222227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18835890A Granted JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Country Status (1)

Country Link
JP (1) JPH0381126A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688650A4 (en) * 1994-01-13 1997-06-11 Citizen Watch Co Ltd RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES
EP0783949A4 (en) * 1994-09-28 1998-07-08 Meiho Co Ltd INJECTION MOLDING DEVICE
WO2007147470A1 (de) * 2006-06-21 2007-12-27 Hansatronic Gmbh Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte
WO2010099999A1 (de) * 2009-03-06 2010-09-10 Robert Bosch Gmbh Verfahren zum einbetten einer elektrischen baugruppe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688650A4 (en) * 1994-01-13 1997-06-11 Citizen Watch Co Ltd RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES
EP0783949A4 (en) * 1994-09-28 1998-07-08 Meiho Co Ltd INJECTION MOLDING DEVICE
WO2007147470A1 (de) * 2006-06-21 2007-12-27 Hansatronic Gmbh Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte
WO2010099999A1 (de) * 2009-03-06 2010-09-10 Robert Bosch Gmbh Verfahren zum einbetten einer elektrischen baugruppe

Also Published As

Publication number Publication date
JPH0525655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-04-13

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