JPH0380351B2 - - Google Patents
Info
- Publication number
- JPH0380351B2 JPH0380351B2 JP57210224A JP21022482A JPH0380351B2 JP H0380351 B2 JPH0380351 B2 JP H0380351B2 JP 57210224 A JP57210224 A JP 57210224A JP 21022482 A JP21022482 A JP 21022482A JP H0380351 B2 JPH0380351 B2 JP H0380351B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- glass
- iron
- kovar
- sealing glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21022482A JPS59100555A (ja) | 1982-11-30 | 1982-11-30 | 気密端子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21022482A JPS59100555A (ja) | 1982-11-30 | 1982-11-30 | 気密端子およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59100555A JPS59100555A (ja) | 1984-06-09 |
| JPH0380351B2 true JPH0380351B2 (enrdf_load_stackoverflow) | 1991-12-24 |
Family
ID=16585838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21022482A Granted JPS59100555A (ja) | 1982-11-30 | 1982-11-30 | 気密端子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59100555A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59186349A (ja) * | 1983-04-06 | 1984-10-23 | Shinko Electric Ind Co Ltd | 気密封止用ステム |
| CN110950549A (zh) * | 2019-12-31 | 2020-04-03 | 西安赛尔电子材料科技有限公司 | 一种用于储能焊接的可伐合金-玻璃封接工艺 |
-
1982
- 1982-11-30 JP JP21022482A patent/JPS59100555A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59100555A (ja) | 1984-06-09 |
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