JPH03798B2 - - Google Patents

Info

Publication number
JPH03798B2
JPH03798B2 JP57189847A JP18984782A JPH03798B2 JP H03798 B2 JPH03798 B2 JP H03798B2 JP 57189847 A JP57189847 A JP 57189847A JP 18984782 A JP18984782 A JP 18984782A JP H03798 B2 JPH03798 B2 JP H03798B2
Authority
JP
Japan
Prior art keywords
wiring board
chip
board
rigid
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57189847A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5978590A (ja
Inventor
Shuichi Matsura
Yasuo Myadera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP57189847A priority Critical patent/JPS5978590A/ja
Publication of JPS5978590A publication Critical patent/JPS5978590A/ja
Publication of JPH03798B2 publication Critical patent/JPH03798B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP57189847A 1982-10-28 1982-10-28 チツプ部品搭載用基板 Granted JPS5978590A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57189847A JPS5978590A (ja) 1982-10-28 1982-10-28 チツプ部品搭載用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57189847A JPS5978590A (ja) 1982-10-28 1982-10-28 チツプ部品搭載用基板

Publications (2)

Publication Number Publication Date
JPS5978590A JPS5978590A (ja) 1984-05-07
JPH03798B2 true JPH03798B2 (de) 1991-01-08

Family

ID=16248189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57189847A Granted JPS5978590A (ja) 1982-10-28 1982-10-28 チツプ部品搭載用基板

Country Status (1)

Country Link
JP (1) JPS5978590A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122378U (ja) * 1984-07-16 1986-02-08 富士通テン株式会社 可撓性印刷配線基板の接続構造
US4855872A (en) * 1987-08-13 1989-08-08 General Electric Company Leadless ceramic chip carrier printed wiring board adapter
JP2740028B2 (ja) * 1989-12-20 1998-04-15 株式会社東芝 多層印刷配線基板
JP2008091638A (ja) 2006-10-02 2008-04-17 Nec Electronics Corp 電子装置およびその製造方法
JP5510877B2 (ja) * 2008-10-07 2014-06-04 株式会社リコー センサモジュール及びセンシング装置
JP7197448B2 (ja) * 2019-09-06 2022-12-27 ルネサスエレクトロニクス株式会社 電子装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640685B2 (de) * 1970-04-13 1981-09-22

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640685U (de) * 1979-09-04 1981-04-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640685B2 (de) * 1970-04-13 1981-09-22

Also Published As

Publication number Publication date
JPS5978590A (ja) 1984-05-07

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