JPH0379867B2 - - Google Patents
Info
- Publication number
- JPH0379867B2 JPH0379867B2 JP22812485A JP22812485A JPH0379867B2 JP H0379867 B2 JPH0379867 B2 JP H0379867B2 JP 22812485 A JP22812485 A JP 22812485A JP 22812485 A JP22812485 A JP 22812485A JP H0379867 B2 JPH0379867 B2 JP H0379867B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal substrate
- wiring board
- chip carrier
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22812485A JPS6286845A (ja) | 1985-10-14 | 1985-10-14 | 金属ベ−スチツプキヤリアの製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22812485A JPS6286845A (ja) | 1985-10-14 | 1985-10-14 | 金属ベ−スチツプキヤリアの製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6286845A JPS6286845A (ja) | 1987-04-21 |
JPH0379867B2 true JPH0379867B2 (enrdf_load_stackoverflow) | 1991-12-20 |
Family
ID=16871586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22812485A Granted JPS6286845A (ja) | 1985-10-14 | 1985-10-14 | 金属ベ−スチツプキヤリアの製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6286845A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100209263B1 (ko) * | 1996-12-31 | 1999-07-15 | 이해규 | 칩 캐리어 및 이 제조방법과 이 칩 캐리어를 이용한 반도체 부품 |
-
1985
- 1985-10-14 JP JP22812485A patent/JPS6286845A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6286845A (ja) | 1987-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |