JPH037949Y2 - - Google Patents
Info
- Publication number
- JPH037949Y2 JPH037949Y2 JP14238786U JP14238786U JPH037949Y2 JP H037949 Y2 JPH037949 Y2 JP H037949Y2 JP 14238786 U JP14238786 U JP 14238786U JP 14238786 U JP14238786 U JP 14238786U JP H037949 Y2 JPH037949 Y2 JP H037949Y2
- Authority
- JP
- Japan
- Prior art keywords
- fixed cover
- cover
- semi
- inert gas
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011261 inert gas Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14238786U JPH037949Y2 (enrdf_load_stackoverflow) | 1986-09-17 | 1986-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14238786U JPH037949Y2 (enrdf_load_stackoverflow) | 1986-09-17 | 1986-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349235U JPS6349235U (enrdf_load_stackoverflow) | 1988-04-04 |
| JPH037949Y2 true JPH037949Y2 (enrdf_load_stackoverflow) | 1991-02-27 |
Family
ID=31051077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14238786U Expired JPH037949Y2 (enrdf_load_stackoverflow) | 1986-09-17 | 1986-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH037949Y2 (enrdf_load_stackoverflow) |
-
1986
- 1986-09-17 JP JP14238786U patent/JPH037949Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349235U (enrdf_load_stackoverflow) | 1988-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6893204B1 (en) | Substrate delivering robot | |
| US5894657A (en) | Mounting apparatus for electronic component | |
| JPH037949Y2 (enrdf_load_stackoverflow) | ||
| KR19980019581A (ko) | 반도체 패키지 제조용 디스펜서의 헤드유닛 (head unit of dispenser for producing a ic package) | |
| JP2002198398A (ja) | ボンディング装置 | |
| KR100347429B1 (ko) | 반도체 펠릿의 위치 결정 방법 및 그 장치 | |
| KR20060019883A (ko) | 다이 본딩 장치 | |
| JP2619123B2 (ja) | 半導体製造装置 | |
| CN216450612U (zh) | 一种固晶设备 | |
| JP4294165B2 (ja) | 電子部品搭載装置 | |
| JP3767750B2 (ja) | ボンディング装置 | |
| JP4212226B2 (ja) | 表面実装部品装着機 | |
| JP7544795B2 (ja) | ダイエジェクティング装置及びダイエジェクティング方法 | |
| KR20050108870A (ko) | 에어프레셔 타입의 고속 디스펜서헤드 | |
| JPH0550799U (ja) | チップマウンタ | |
| JP2890922B2 (ja) | ボンダのｘｙテーブル装置 | |
| KR100221651B1 (ko) | 스크린 프린트 장치의 웨이퍼 고정용 지그 | |
| JP3646418B2 (ja) | 電子部品実装装置 | |
| JPS5776849A (en) | Bonding device for semiconductor pellel | |
| JP3366013B2 (ja) | 部品実装装置及び部品実装方法 | |
| JPS61269319A (ja) | 半導体装置の製造方法および製造装置 | |
| JPH08162501A (ja) | ボンディングヘッド | |
| JPH03218037A (ja) | 半導体素子実装用基板 | |
| JPH05235261A (ja) | 表面実装型混成集積回路装置 | |
| JPS5810381Y2 (ja) | 回路基板 |