JP3767750B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
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- JP3767750B2 JP3767750B2 JP2003319469A JP2003319469A JP3767750B2 JP 3767750 B2 JP3767750 B2 JP 3767750B2 JP 2003319469 A JP2003319469 A JP 2003319469A JP 2003319469 A JP2003319469 A JP 2003319469A JP 3767750 B2 JP3767750 B2 JP 3767750B2
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- bonding
- gas supply
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- 239000011261 inert gas Substances 0.000 claims description 65
- 239000007789 gas Substances 0.000 claims description 41
- 239000004065 semiconductor Substances 0.000 claims description 38
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000003064 anti-oxidating effect Effects 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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Description
前記ボンディングステージは、前記ヒータプレートの外周近傍に設けられた第1の不活性ガス供給口と第2の不活性ガス供給口とを備えたガス供給ノズルとを有し、前記第1の不活性ガス供給口は前記半導体部品の中心方向へ向かって上方に斜度θ1の関係で多数配置されて前記チャンバーとの間にガス空間を形成し、前記第2の不活性ガス供給口は、前記ガス供給ノズル上面から外周方向に斜度θ2の関係を有して多数配置されて前記ボンディングステージ周囲から前記チャンバー内に形成されたガス空間への外気の侵入を防止して、前記ボンディングステージ、前記チャンバー及び前記ヘッドカバーで形成された空間内に不活性ガス空間を形成するようにしたものである。
10 不活性ガス
11 チャンバー上面カバー
11a ボンディングヘッド移動用切欠き
12 上面カバー用ヒンジ部
2 ボンディングヘッド
20 ボンディングヘッドカバー移動空間
21 ヘッドカバー
21a ボンディングヘッド下降用切欠き
21b 認識カメラ用切欠き
23 ガス供給ノズル
23a 不活性ガス供給口
24 クランパ
25 キャピラリ
26 ワイヤ
26a ボール
28 バンプ
3 ボンディングステージ
30 ボンディングステージ移動空間
31 ボンディングステージ移動用レール
33 ガス供給ノズル
33a 不活性ガス供給口
33b 不活性ガス供給口
4 ヒータプレート
5 ウエハ
7 認識用カメラ
9 ボンディング装置
9a ボンディング装置フレーム
Claims (6)
- 直交2方向に移動可能で所定の位置に位置決め制御可能、かつ、半導体部品を載置・加熱するヒータプレートを有するボンディングステージと、
ボンディングヘッド移動用切欠きが形成されたチャンバー上面カバーを有するチャンバーと、
前記ボンディングヘッド移動用切欠きを介して前記ボンディングステージの移動平面と平行な直交2方向及びその直角方向の3方向に移動可能な位置決め制御手段を有して前記半導体部品にボンディングを行なうボンディングヘッドと、
前記チャンバーの上方に配置され、前記ボンディングヘッドと一体に移動可能なヘッドカバーとを有するボンディング装置であって、
前記ヘッドカバーは、周縁部に不活性ガス供給口を備えたガス供給ノズルを配し、該不活性ガス供給口を介して不活性ガスを供給して、前記ボンディングステージ、前記チャンバー及び前記ヘッドカバーで形成された空間内に不活性ガス空間を形成することを特徴とするボンディング装置。 - 前記不活性ガス供給口は、前記チャンバー上面カバーに向けて下方向に設けられていることを特徴とする請求項1に記載のボンディング装置。
- 直交2方向に移動可能で所定の位置に位置決め制御可能、かつ、半導体部品を載置・加熱するヒータプレートを有するボンディングステージと、
ボンディングヘッド移動用切欠きが形成されたチャンバー上面カバーを有するチャンバーと、
前記ボンディングヘッド移動用切欠きを介して前記ボンディングステージの移動平面と平行な直交2方向及びその直角方向の3方向に移動可能な位置決め制御手段を有して前記半導体部品にボンディングを行なうボンディングヘッドと、
前記チャンバーの上方に配置され、前記ボンディングヘッドと一体に移動可能なヘッドカバーとを有するボンディング装置であって、
前記ボンディングステージは、前記ヒータプレートの外周近傍に設けられた第1の不活性ガス供給口と第2の不活性ガス供給口とを備えたガス供給ノズルとを有し、
前記第1の不活性ガス供給口は前記半導体部品の中心方向へ向かって上方に斜度θ1の関係で多数配置されて前記チャンバーとの間にガス空間を形成し、前記第2の不活性ガス供給口は、前記ガス供給ノズル上面から外周方向に斜度θ2の関係を有して多数配置されて前記ボンディングステージ周囲から前記チャンバー内に形成されたガス空間への外気の侵入を防止して、前記ボンディングステージ、前記チャンバー及び前記ヘッドカバーで形成された空間内に不活性ガス空間を形成することを特徴とするボンディング装置。 - 前記ヘッドカバーは、チャンバー上面カバーに向けて下方向に設けられている不活性ガス供給口を備えたガス供給ノズルを周縁部に配することを特徴とする請求項3記載のボンディング装置。
- 前記ボンディングステージが有する不活性ガス供給口、前記ヘッドカバーに搭載されたガス供給ノズルへの不活性ガスの供給経路の何れか、若しくはそれぞれに流量調整弁を設けて独立に流量調整可能としたことを特徴とする請求項1乃至請求項4記載のうち、少なくとも1に記載のボンディング装置。
- 前記ヘッドカバーに搭載されたガス供給ノズルに設けられた流量調整弁により不活性ガスの流速を調整することにより、ボンディング実行時ボンディングヘッドのキャピラリ先端に形成されるボールの安定を図ることを特徴とする請求項5記載のボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003319469A JP3767750B2 (ja) | 2003-09-11 | 2003-09-11 | ボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003319469A JP3767750B2 (ja) | 2003-09-11 | 2003-09-11 | ボンディング装置 |
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