JPH0379470U - - Google Patents
Info
- Publication number
- JPH0379470U JPH0379470U JP14008789U JP14008789U JPH0379470U JP H0379470 U JPH0379470 U JP H0379470U JP 14008789 U JP14008789 U JP 14008789U JP 14008789 U JP14008789 U JP 14008789U JP H0379470 U JPH0379470 U JP H0379470U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal
- wiring pattern
- sides
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ないし第３図は本考案の第１ないし第３
実施例のハイブリツドＩＣの正面図、第４図は従
来例のハイブツドＩＣの正面図、第５図はその背
面図である。
１１……絶縁基板、１２……端子電極、１３…
…電子部品、１４……保護膜、１４ａ，１４ｂ…
…端子識別膜、１５……リード端子、１６……挟
持部、１７，１８，１９……ハイブリツドＩＣ。
Figures 1 to 3 are the first to third figures of the present invention.
FIG. 4 is a front view of the hybrid IC of the embodiment, FIG. 4 is a front view of the conventional hybrid IC, and FIG. 5 is a rear view thereof. 11...Insulating substrate, 12...Terminal electrode, 13...
...Electronic component, 14...Protective film, 14a, 14b...
...Terminal identification film, 15... Lead terminal, 16... Holding part, 17, 18, 19... Hybrid IC.
Claims (1)
もに、少なくともそのいずれかの面の配線パター
ンに接続して電子部品を取り付け、その絶縁基板
の端縁の両面に前記配線パターンに接続された複
数個の端子電極をそれぞれ形成し、先端に挟持部
を備えたリード端子をその挟持部で前記絶縁基板
を挟持してその端子電極に半田付けしてなるハイ
ブリツドＩＣにおいて、 絶縁基板の一方の面の端子電極は、複数個のリ
ード端子のうちの所定のリード端子の位置にのみ
形成し、絶縁基板の他方の面の端子電極は、少な
くとも前記一方の面において端子電極が形成され
ていないリード端子の位置に形成し、少なくとも
絶縁基板の一方の面の端子電極の形成されていな
いリード端子の位置に絶縁基板面の色彩とは異な
る系統の色彩を有する端子識別膜を形成したこと
を特徴とするハイブリツドＩＣ。[Claims for Utility Model Registration] A wiring pattern is formed on both sides of an insulating substrate, and an electronic component is attached by connecting to the wiring pattern on at least one of the sides, and the wiring pattern is formed on both sides of the edge of the insulating substrate. In a hybrid IC formed by forming a plurality of terminal electrodes connected to each other, a lead terminal having a clamping part at the tip, holding the insulating substrate with the clamping part and soldering to the terminal electrode, the insulating substrate The terminal electrodes on one surface of the insulating substrate are formed only at predetermined lead terminal positions among the plurality of lead terminals, and the terminal electrodes on the other surface of the insulating substrate are formed only on the one surface. A terminal identification film having a color different from the color of the insulating substrate surface is formed at the position of the lead terminal where the terminal electrode is not formed on at least one side of the insulating substrate. A hybrid IC featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008789U JPH0379470U (en) | 1989-12-01 | 1989-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008789U JPH0379470U (en) | 1989-12-01 | 1989-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379470U true JPH0379470U (en) | 1991-08-13 |
Family
ID=31687085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14008789U Pending JPH0379470U (en) | 1989-12-01 | 1989-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379470U (en) |
-
1989
- 1989-12-01 JP JP14008789U patent/JPH0379470U/ja active Pending
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