JPH0195071U - - Google Patents

Info

Publication number
JPH0195071U
JPH0195071U JP1987190608U JP19060887U JPH0195071U JP H0195071 U JPH0195071 U JP H0195071U JP 1987190608 U JP1987190608 U JP 1987190608U JP 19060887 U JP19060887 U JP 19060887U JP H0195071 U JPH0195071 U JP H0195071U
Authority
JP
Japan
Prior art keywords
lead terminal
board
conductive pattern
hybrid
pattern electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987190608U
Other languages
Japanese (ja)
Other versions
JPH0446381Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987190608U priority Critical patent/JPH0446381Y2/ja
Publication of JPH0195071U publication Critical patent/JPH0195071U/ja
Application granted granted Critical
Publication of JPH0446381Y2 publication Critical patent/JPH0446381Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案の第１の実施例の構成説
明図、第２図は第２の実施例の構成説明図、第３
図ａ，ｂ，ｃ，ｄは従来のハイブリツドＩＣ基板
及びリード端子の構成説明図である。 １……ハイブリツドＩＣ基板、２……プリント
基板、３……ＤＩＰ型ＩＣＲＯＭ、４……リード
端子（リード用電極）、５……マザーボード、６
……スルーホール、９……導電パターン電極、９
ａ……テーパー部、１０……ブリツジ、２０……
リード端子（リード用電極）、２１……挾持部、
２１ａ……テーパー部。 Figures 1a and b are explanatory diagrams of the configuration of the first embodiment of the present invention, Figure 2 is an explanatory diagram of the configuration of the second embodiment, and Figure 3 is an explanatory diagram of the configuration of the first embodiment of the present invention.
Figures a, b, c, and d are explanatory diagrams of the configuration of a conventional hybrid IC board and lead terminals. 1...Hybrid IC board, 2...Printed circuit board, 3...DIP type ICROM, 4...Lead terminal (lead electrode), 5...Motherboard, 6
...Through hole, 9...Conductive pattern electrode, 9
a... Taper part, 10... Bridge, 20...
Lead terminal (lead electrode), 21... clamping part,
21a...Tapered part.

Claims (1)

【実用新案登録請求の範囲】 ハイブリツドＩＣ基板のプリント板の導電パタ
ーン電極を、リード端子先端の挾持部で導電パタ
ーン電極を含むプリント板を挾持するよう取付け
ることによつてリード端子を設けたハイブリツド
ＩＣ基板において、 該導電パターンの端部またはリード端子の挾持
部にはテーパー部が形成され、該導電パターン電
極に該リード端子を接続したとき該テーパー部は
該プリント板の板面上に位置していることを特徴
とするハイブリツドＩＣ基板のリード端子。[Claims for Utility Model Registration] A hybrid IC in which a lead terminal is provided by attaching a conductive pattern electrode on a printed board of a hybrid IC board so that the printed board containing the conductive pattern electrode is held by a clamping portion at the tip of the lead terminal. In the board, a tapered part is formed at an end of the conductive pattern or a holding part of the lead terminal, and when the lead terminal is connected to the conductive pattern electrode, the tapered part is located on the surface of the printed board. A lead terminal for a hybrid IC board, which is characterized by:
JP1987190608U 1987-12-15 1987-12-15 Expired JPH0446381Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987190608U JPH0446381Y2 (en) 1987-12-15 1987-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987190608U JPH0446381Y2 (en) 1987-12-15 1987-12-15

Publications (2)

Publication Number Publication Date
JPH0195071U true JPH0195071U (en) 1989-06-22
JPH0446381Y2 JPH0446381Y2 (en) 1992-10-30

Family

ID=31481563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987190608U Expired JPH0446381Y2 (en) 1987-12-15 1987-12-15

Country Status (1)

Country Link
JP (1) JPH0446381Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013108993A (en) * 2013-02-25 2013-06-06 Ngk Spark Plug Co Ltd Wiring board, wiring board for ic electrical characteristics test, and method of manufacturing wiring board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143755U (en) * 1985-02-22 1986-09-05
JPS62167374U (en) * 1986-04-11 1987-10-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143755U (en) * 1985-02-22 1986-09-05
JPS62167374U (en) * 1986-04-11 1987-10-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013108993A (en) * 2013-02-25 2013-06-06 Ngk Spark Plug Co Ltd Wiring board, wiring board for ic electrical characteristics test, and method of manufacturing wiring board

Also Published As

Publication number Publication date
JPH0446381Y2 (en) 1992-10-30

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