JPH03781B2 - - Google Patents
Info
- Publication number
- JPH03781B2 JPH03781B2 JP58032979A JP3297983A JPH03781B2 JP H03781 B2 JPH03781 B2 JP H03781B2 JP 58032979 A JP58032979 A JP 58032979A JP 3297983 A JP3297983 A JP 3297983A JP H03781 B2 JPH03781 B2 JP H03781B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- film carrier
- metal layer
- bonding tool
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/0711—
-
- H10W72/077—
-
- H10W72/701—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58032979A JPS59159538A (ja) | 1983-03-02 | 1983-03-02 | ボンデイングツ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58032979A JPS59159538A (ja) | 1983-03-02 | 1983-03-02 | ボンデイングツ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159538A JPS59159538A (ja) | 1984-09-10 |
| JPH03781B2 true JPH03781B2 (cg-RX-API-DMAC10.html) | 1991-01-08 |
Family
ID=12373998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58032979A Granted JPS59159538A (ja) | 1983-03-02 | 1983-03-02 | ボンデイングツ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159538A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158154A (ja) * | 1984-12-28 | 1986-07-17 | Matsushita Electric Ind Co Ltd | 加熱圧着ツ−ル |
| KR0186084B1 (ko) * | 1995-09-02 | 1999-04-15 | 문정환 | 히팅장치를 구비한 웨지 공구 |
| CN114883286B (zh) * | 2022-06-08 | 2024-08-20 | 江西蓝微电子科技有限公司 | 一种金银合金复合键合丝及其制造方法 |
-
1983
- 1983-03-02 JP JP58032979A patent/JPS59159538A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59159538A (ja) | 1984-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4482912A (en) | Stacked structure having matrix-fibered composite layers and a metal layer | |
| JP2921668B2 (ja) | 熱伝導性かつ電気絶縁性の結合装置およびその製造方法 | |
| US5681647A (en) | Anisotropic conductive film for microconnections | |
| CA2081141A1 (en) | Pulsed current resistive heating for bonding temperature critical components | |
| US3811934A (en) | Heating member | |
| US4324974A (en) | Heating element assembly with a PTC electric heating element | |
| WO1991005368A1 (en) | Die attach structure and method | |
| US3705993A (en) | Piezoresistive transducers and devices with semiconducting films and their manufacturing process | |
| JPH03781B2 (cg-RX-API-DMAC10.html) | ||
| JP2828358B2 (ja) | 半導体放熱構造 | |
| JP2717867B2 (ja) | ボンディングツール | |
| US4570150A (en) | Precision resistor and method of making same | |
| JPS62172676A (ja) | 難ハンダ付性材料への端子の取付方法 | |
| JP2682556B2 (ja) | フラットケーブルの製造方法 | |
| JP2005294092A (ja) | 発熱体 | |
| JPS61181136A (ja) | ダイボンデイング方法 | |
| JPH05174944A (ja) | 導電性フィルム上に形成される電極とリード線との接続方法 | |
| JPS59161832A (ja) | ボンデイングツ−ル | |
| JPH0214161Y2 (cg-RX-API-DMAC10.html) | ||
| JPS6396930A (ja) | 半導体装置の製造方法 | |
| US4713529A (en) | Electroceramic heating devices with welded leads | |
| JPH0332913B2 (cg-RX-API-DMAC10.html) | ||
| JPS62297242A (ja) | 結露防止鏡の製造方法 | |
| JPH04198072A (ja) | セラミック発熱体装置 | |
| JPS6240549Y2 (cg-RX-API-DMAC10.html) |