JPH0377673U - - Google Patents
Info
- Publication number
- JPH0377673U JPH0377673U JP13961389U JP13961389U JPH0377673U JP H0377673 U JPH0377673 U JP H0377673U JP 13961389 U JP13961389 U JP 13961389U JP 13961389 U JP13961389 U JP 13961389U JP H0377673 U JPH0377673 U JP H0377673U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- adhesive
- electrode terminal
- wiring board
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000011800 void material Substances 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- Y02E60/12—
Landscapes
- Battery Mounting, Suspending (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案による配線基板の第１実施例を
示す断面図、第２図は第１実施例による配線基板
の製造工程を示す平面図、第３図は配線基板の第
２実施例を示す平面図、第４図は第２実施例によ
る配線基板の製造工程を示す断面図、第５図は情
報カード読取システムの構成を示す略線図、第６
図は従来の情報カードの製造工程を示す略線的平
面図、第７図及び第８図は従来の負電極端子板と
ランドとの電気的接合の説明に供する断面図及び
平面図。
７，４１……バンプ、１４……絶縁シート、３
０，４０……配線基板、３１……負電極端子板、
３２，４２……接着材、３３……基板、３４……
ランド、３５……空所。
1 is a sectional view showing a first embodiment of the wiring board according to the present invention, FIG. 2 is a plan view showing the manufacturing process of the wiring board according to the first embodiment, and FIG. 3 is a sectional view showing the second embodiment of the wiring board according to the present invention. FIG. 4 is a cross-sectional view showing the manufacturing process of the wiring board according to the second embodiment, FIG. 5 is a schematic diagram showing the configuration of the information card reading system, and FIG.
The figure is a schematic plan view showing the manufacturing process of a conventional information card, and FIGS. 7 and 8 are a sectional view and a plan view illustrating the electrical connection between the conventional negative electrode terminal plate and the land. 7, 41... Bump, 14... Insulating sheet, 3
0, 40... Wiring board, 31... Negative electrode terminal plate,
32, 42...adhesive material, 33...substrate, 34...
Land, 35... Blank space.
Claims (1)
ペーバーバツテリの電極端子を圧着することによ
り上記電極端子を上記配線パターンに電気的に接
合させた状態を維持するように上記接着材によつ
て上記電極端子を上記配線パターンに接合するよ
うになされた配線基板において、 上記接着材の中央部に空所を設けることにより
、上記接着材の外側縁部位置及び空所側縁部位置
において上記電極端子を上記配線パターンに電気
的に接合させる ことを特徴とする配線基板。 (2) 配線パターン上に塗布された接着材にペー
バーバツテリの電極端子を圧着することにより上
記電極端子を上記配線パターンに電気的に接合さ
せた状態を維持するように上記接着材によつて上
記電極端子を上記配線パターンに接着するように
なされた配線基板において、 上記配線パターン上にバンプを形成した後上記
接着材を塗布することにより、上記バンプによつ
て上記電極端子を上記配線パターンに電気的に接
合させる ことを特徴とする配線基板。[Claims for Utility Model Registration] (1) Maintaining the state in which the electrode terminals are electrically connected to the wiring pattern by crimping the electrode terminals of the paver battery to the adhesive strip applied on the wiring pattern. In the wiring board in which the electrode terminal is bonded to the wiring pattern using the adhesive, by providing a void in the center of the adhesive, the position of the outer edge of the adhesive and the void can be adjusted. A wiring board characterized in that the electrode terminal is electrically connected to the wiring pattern at a side edge position. (2) The electrode terminal of the paver battery is crimped onto the adhesive applied to the wiring pattern, so that the electrode terminal is maintained electrically connected to the wiring pattern using the adhesive. In a wiring board configured to bond an electrode terminal to the wiring pattern, bumps are formed on the wiring pattern and then the adhesive is applied, so that the electrode terminal is electrically attached to the wiring pattern by the bumps. A wiring board that is characterized by being bonded to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13961389U JPH0751812Y2 (en) | 1989-12-01 | 1989-12-01 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13961389U JPH0751812Y2 (en) | 1989-12-01 | 1989-12-01 | Wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377673U true JPH0377673U (en) | 1991-08-05 |
| JPH0751812Y2 JPH0751812Y2 (en) | 1995-11-22 |
Family
ID=31686647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13961389U Expired - Lifetime JPH0751812Y2 (en) | 1989-12-01 | 1989-12-01 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751812Y2 (en) |
-
1989
- 1989-12-01 JP JP13961389U patent/JPH0751812Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751812Y2 (en) | 1995-11-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |